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  • Apple A6 investigation shows highly customized dual-core, triple-GPU layout

    by 
    Jon Fingas
    Jon Fingas
    09.25.2012

    There's been a significant mystery lingering around the A6 processor found in the iPhone 5, even as it became clearer that Apple was veering further than usual from the basic ARM formula. A microscope-level inspection by Chipworks and iFixit is at last identifying the key elements of the 32nm, Samsung-assembled chip and revealing just how far it strays from the beaten path. The examination confirms earlier suspicions of a dual-core design with triple-core graphics -- it's how that design is shaped that makes the difference. Apple chose to lay out the two processor cores by hand rather than let a computer do the work, as most ARM partners do. The procedure is expensive and slow, but also gives the A6 a better-optimized design; it explains why the chip is noticeably faster than much of its competition without needing the brute force approaches of higher clock speeds or extra cores. Some mysteries remain, such as the exact PowerVR graphics that are at work, but it's evident Apple now has the design talent and resources to speed up mobile devices on its own terms rather than wait for off-the-shelf layouts like the Cortex-A15.

  • Globalfoundries unveils 14nm-XM chip architecture, vows up to a 60 percent jump in battery life

    by 
    Jon Fingas
    Jon Fingas
    09.23.2012

    Globalfoundries wants to show that it can play the 3D transistor game as well as Intel. Its newly unveiled 14nm-XM (Extreme Mobility) modular architecture uses the inherently low-voltage, low-leak nature of the foundry's FinFET layout, along with a few traces of its still-in-development 20nm process, to build a 14-nanometer chip with all the size and power savings that usually come from a die shrink. Compared to the larger processors with flat transistors that we're used to, the new technique is poised to offer between 40 to 60 percent better battery life, all else being equal -- a huge help when even those devices built on a 28nm Snapdragon S4 can struggle to make it through a full day on a charge. To no one's shock, Globalfoundries is focusing its energy on getting 14nm-XM into the ARM-based processors that could use the energy savings the most. It will be some time before you find that extra-dimensional technology sitting in your phone or tablet, though. Just as Intel doesn't expect to reach those miniscule sizes until 2013, Globalfoundries expects its first working 14nm silicon to arrive the same year. That could leave a long wait between test production runs and having a finished product in your hands.

  • Samsung announces 1.4GHz Exynos 4 Quad as basis for Galaxy S3

    by 
    Sean Buckley
    Sean Buckley
    04.25.2012

    Looking for something a bit more solid than a third-party benchmark? We can do that. "Already in production the Exynos 4 Quad is scheduled to be adopted first into Samsung's next Galaxy smartphone that will officially be announced in May," the horse's mouth reveals. Samsung boasts that the new 32nm 1.4GHz quad-core processor flaunts twice the processing power over its predecessor, thanks to its High-K Metal Gate (HKMG) low-power technology. The net energy savings? About 20-percent. "The application processor is a crucial element in providing our customers with a PC-like experience on mobile devices," explains Hankil Yoon, Senior VP of Product Strategy Team at Samsung, "Samsung's next Galaxy device, which will be officially announced soon, offers uncompromised performance and ground breaking multitasking features, thanks to Exynos 4 Quad's powerful performance and efficient energy management technology." Sammy says it's shopping the new processor around to other handset manufacturers (like Meizu), noting that the Exynos 4 Quad is pin-to-pin compatible with the Exynos 4 Dual (the brains behind the Galaxy S II and Note), which gives designers the ability to update product designs with minimal costs. Check out Samsung's full press release after the break.

  • Meizu MX Quad-core launching with Android 4.0 in June, gets 32GB and 64GB flavors

    by 
    Richard Lai
    Richard Lai
    04.15.2012

    Can't say we're surprised, but Meizu's finally giving us the lowdown on the quad-core variant of its flagship Android smartphone. Simply dubbed the MX Quad-core, this new device will be powered by a Cortex-A9-based, 32nm HKMG (High-K Metal Gate) quad-core Samsung Exynos chip -- no word on the clock speed or RAM, but we're betting our money on the Exynos 4412 that goes up to 1.5GHz. Meizu claims this will save up to 20 percent of CPU power consumption compared to its dual-core counterpart. Also, the battery will be bumped up from 1,600mAh to 1,700mAh -- we shall see how much difference this makes when we eventually get our hands on the phone. And yes, in addition to the original white back cover, you'll be able to swap it with one of the five optional colored covers pictured above.On the software side you'll get a Meizu-customized Ice Cream Sandwich system (aka Flyme OS), though it isn't clear whether the company will stick to its old promise of simultaneously releasing a vanilla ROM. The rest of the new phone's identical to the dual-core MX, especially the 4-inch 960 x 640 ASV display and the eight-megapixel BSI camera. While there's still no microSD expansion, here's some good news to make up for this flaw: the base model starts at 32GB and it'll cost the same as the current 16GB MX! In other words, come June the unsubsidized MX Quad-core will go from ¥2,999 (US$480) in China and HK$3,099 (US$400) in Hong Kong; and then there'll also be a 64GB version priced at ¥3,999 (US$635) and HK$4,099 (US$530), respectively. Meanwhile, starting today, the original MX is reduced to ¥2,399 (US$380) and HK$2,599 (US$335). Press release after the break.Now, with Meizu proudly claiming to have the world's first smartphone to utilize the quad-core Exynos chip, we wonder where Samsung's at with its own unicorn device?

  • Globalfoundries takes ARM Cortex-A9 into 28nm land, looks forward to 20nm chips in 2013

    by 
    Vlad Savov
    Vlad Savov
    09.02.2010

    Forget the numbers, here's what matters: Globalfoundries' new production capabilities will lead to "smooth production ramp-ups and faster time-to-market" for its customers. Now consider that this promise relates to scrumptious 28nm Cortex-A9 SOCs and feel free to rejoice. The chip fabricator has just declared itself ready to take orders for ARM's systems-on-chip built using its high-k metal gate 28nm fab process. This fulfills its pledge for mass production in the latter half of 2010, but lest you think Globalfoundries is resting on any nanoscale laurels, it also has a 20nm roadmap to tell you about. It's very simple, really: expect even smaller, even more power-efficient silicon in 2013. We don't know if the future will be bright, but it sure looks like it's gonna be small.

  • ARM and TSMC team up for tinier 20nm Cortex SOCs

    by 
    Sean Hollister
    Sean Hollister
    07.21.2010

    It's no secret that ARM ideas are powering much of the mobile revolution these days, but the company doesn't print its own systems-on-a-chip, that duty gets outsourced to silicon foundries -- like TSMC, who just got all buddy-buddy with the firm to transition future smartphone chips to the 28nm and obscenely tiny 20nm high-k metal gate processes. (We're not sure what this means for GlobalFoundries, who had a similar deal earlier this year.) As per usual with a die size reduction, ARM chips will see higher speed and have decreased power consumption, but since 20nm is (relatively) unexplored territory it could be years before chips hit the market. PR after the break, or hit the more coverage link for further explanation by an ARM VP of Marketing.