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Samsung's QLED 8K TV will be one of the first certified by the 8K Association
Samsung has fired a shot in a brewing 8K standards war by announcing that its 8K QLED TVs will be among the first to be certified by the fledgling 8K Association (8KA) sometime next year. That means the sets will hit a minimum 7,680 x 4,320 resolution (twice that of UHD), while peaking out at 600 nits of brightness and supporting HDMI2.1 and HEVC (H.265) standards. That could include models like Samsung's rumored bezel-free Q950T.
PCI Express 6 spec promises massive headroom for AI and storage
PCI Express 5.0 has barely been finalized, but that isn't stopping its creators from dreaming about what comes next. The PCI Special Interest Group has unveiled a PCI Express 6.0 specification that should deliver up to a blistering 256GB per second across 16 lanes -- that's twice as fast as the yet-to-ship PCIe 5.0 spec, and four times as much as the 4.0 spec that's only just reaching computers. The PCI-SIG aims to achieve the feat by using Pulse Amplitude Modulation technology that can carry twice as much data as existing methods without needing to double the transmission bandwidth and use ridiculously high frequencies.
USB 3.1 specification published, bringing 10 Gbps USB closer
The USB 3.0 Promoter Group announced yesterday that the specification for USB 3.1 has been completed and is available for download by device manufacturers. While USB 3.1 is no surprise, having been announced earlier this year, the publication of the spec opens the door for manufacturers to begin making and selling devices that comply with the fast interconnection standard. USB 3.1, aka SuperSpeed USB 10 Gbps, remains backwards compatible with USB 3.0 and USB 2.0 devices, but adds higher speeds to the USB architecture. With a 10 Gbps top throughput, the new standard matches the initial Thunderbolt data rate while being much less expensive to implement. Of course, Thunderbolt 2 -- offering 20 Gbps to more than just one device at a time -- is waiting in the wings and has been announced as the new standard I/O architecture for the upcoming Mac Pro. But Thunderbolt 2 will most likely remain a standard for video and design professionals who need and can afford the pricey equipment, while USB 3.1 will move into the mainstream like its slower predecessors. [via 9to5Mac] The full press release from the USB 3.0 Promoter Group is embedded below. Show full PR text SuperSpeed USB 10 Gbps – Ready for Development USB 3.0 Promoter Group announced availability of the USB 3.1 Specification to increase SuperSpeed USB to 10 Gbps HILLSBORO, Ore. – July 31, 2013 – The USB 3.0 Promoter Group today announced the completion of the USB 3.1 Specification which adds enhancements to enable SuperSpeed USB to operate at up to 10 Gbps. This latest release of the specification will be available today for download from the USB Implementers Forum (USB-IF) website. SuperSpeed USB 10 Gbps uses a more efficient data encoding and will deliver more than twice the effective data through-put performance of existing SuperSpeed USB over enhanced, fully backward compatible USB connectors and cables. Compatibility is assured with existing USB 3.0 software stacks and device class protocols as well as with existing 5 Gbps hubs and devices and USB 2.0 products. Developers interested in implementing the new USB 3.1 Specification have the opportunity to learn technical details during three developer conferences currently being planned. The international conferences planned in Europe and Asia will offer more advanced system design training as breakout sessions on the second day. For more details and conference registration instructions, please visit the USB-IF website. 1. USB 3.1 Developers Day US – August 21, 2013 in Hillsboro, Ore. 2. USB 3.1 Developers Days Europe – October 1-2, 2013 in Dublin, Ireland 3. USB 3.1 Developers Days Asia – Two day conference scheduled for early December 2013, more details to follow "The USB 3.1 specification primarily extends existing USB 3.0 protocol and hub operation for speed scaling along with defining the next higher physical layer speed as 10 Gbps," said Brad Saunders, USB 3.0 Promoter Group Chairman. "The specification team worked hard to make sure that the changes made to support higher speeds were limited and remained consistent with existing USB 3.0 architecture to ease product development." "We recognize this advancement in USB technology is an important development forour customers," said Tom Bonola, Chief Technology Officer, Business PC Solutions, HP. "The USB 3.1 Specification enables us to meet the growing needs of our customers for faster data transfer while maintaining backwards compatibility with existing devices."The industry has affirmed the strong demand for higher through-put, for user-connected peripherals and docks, by coming together to produce a quality SuperSpeed USB 10 Gbps specification," said Alex Peleg, Vice President, Intel Architecture Group. "Intel is fully committed to deliver on this request." "While maintaining backward compatibility, USB continues to advance to meet customer's growing need for higher speed data" said Roland Sperlich, TI Consumer and Computing Interface Product Line Manager. "The 10 Gbps data rate allows designers across many industries to do more with a universal standard." "In this multi-device world, the USB 3.1 updates will enable end-users to move content across devices quickly, conveniently and without worrying about compatibility," said Emile Ianni, Corporate Vice President of Platform Solutions Engineering, AMD. "AMD thanks our engineers as well as the other technology contributors for bringing to market robust innovation that is designed to work seamlessly with new and existing solutions." About the USB 3.0 Promoter Group The USB 3.0 Promoter Group, comprised of Hewlett-Packard Company, Intel Corporation, Microsoft Corporation, Renesas Electronics, ST-Ericsson and Texas Instruments, developed the USB 3.0 Specification that was released in November 2008. In addition to maintaining and enhancing this specification, the USB 3.0 Promoter Group develops specification addendums to extend or adapt its specifications to support more platform types or use cases where adopting USB 3.0 technology will be beneficial in delivering a more ubiquitous, richer user experience. About the USB-IF The non-profit USB Implementers Forum, Inc. was formed to provide a support organization and forum for the advancement and adoption of USB technology. The USB-IF facilitates the development of high-quality compatible USB devices through its logo and compliance program, and promotes the benefits of USB and the quality of products that have passed compliance testing. Further information, including postings of the most recent product and technology announcements, is available by visiting the USB-IF website at www.usb.org.
Alliance for Wireless Power approves its specification, edges closer to truly cable-free charging
Design by committee might not be the death knell for technology after all. Over four months after the Alliance for Wireless Power was founded in earnest, the coalition has already greenlit a specification for its partners to work from. The guideline lets device makers start building devices that charge through a magnetic resonance technology more forgiving of distance and material than Qi while simplifying the process through short-range wireless formats like Bluetooth 4.0. While the A4WP group hasn't made all the details public, it's holding meetings this week to speed up the commercialization process -- it's here that we'll learn whether the corporate bureaucracy is just as quick at getting wireless charging hardware into our hands as it is handshaking on standards.
CompactFlash Association announces 600MB/sec CFast2.0 spec, SanDisk developing cards
SD cards and their many variants may be the memory card format of choice in most cameras these days, but there's still plenty of instances where nothing but a larger CompactFlash card will suffice. Now the organization behind the format has announced its latest revision, the CFast2.0 specification, which it hopes will find its way into future digital cameras and other professional video devices. The big news with it is a promised "theoretical" performance of up to 600MB/sec, which is about four times faster than today's CompactFlash cards, as well as a new sleep mode that promises to help conserve battery life when the card is not in use. What's more, while the cards themselves are still a ways off, SanDisk has announced today that it has begun development of them, and medium format camera manufacturer Phase One has also confirmed that it intends to support the new specification.
CompactFlash Association develops XQD 2.0 spec, promises up to 8 Gbps throughput
Just as were starting to get cozy with the still vastly unavailable XQD format, the CompactFlash Association is back with version 2.0 of the spec, which it says could provide transfer speeds of up to 8 Gb/s (1,000 MB/s). You'll need to have access to a PCI Express 3.0 interface in order to take advantage of that throughput, however -- a boost from the 5 Gbps offered with the previous-gen solution. XQD 2.0 is still under development, with Sony footing the bill, and the organization is welcoming "additional participation" as it works to refine the standard. There's no saying exactly when we'll start seeing devices that employ the new tech, though CFA is aiming to make the spec available "in the second half of 2012." Cards that utilize the new format will enable video capture at higher bandwidth that the SD and CF media of today, and while we seem to be managing just fine with the current stock for capturing 1080p, faster storage will certainly be welcome in the future, once 4K, and perhaps even larger formats, make their mainstream debut.
USB Power Delivery spec upped to 100W, aims to make proprietary power connectors obsolete
The battle between Thunderbolt and USB 3.0 has only recently begun in earnest, what with mobo's finally emerging to give non-Mac computers access to the 10Gbps interface. While USB 3.0 can't match Thunderbolt in terms of data throughput, it now has the upper hand in power capabilities, as last week the 100W Power Delivery spec was approved for both USB 2.0 and 3.0. That's ten times what Thunderbolt can do, and it means that you can charge up your laptop or power most any peripheral via Universal Serial Bus. Naturally, the new specification relies on beefier cables to deliver maximum juice, but we won't have to go replacing all our old wires -- it includes a means to check attached cables and devices and set the voltage and amperage accordingly. Perfect, that means we won't have to carry around bundle of proprietary power cords when we travel, and we get peace of mind that charging via USB won't have any, ahem, unpleasant side effects.
802.11-2012 WiFi freshens up spec with 3.7GHz bands, mesh networking
It's hard to believe that 802.11 WiFi has only had three major revisions since it was started up 15 years ago. The IEEE must be equally surprised, as it's introducing a new 802.11-2012 standard that unites 10 technologies from various amended WiFi versions under one big tent. Among the picks are new support for 3.65 and 3.7GHz bands, to avoid clashing with 2.4GHz or 5GHz networks, as well as better support for direct linking, faster cellular hand-offs, in-car networks, roaming and mesh networking. You can pay $5 to have a peek at the 2012 WiFi spec today, although we'd brace for a significant wait before smartphones and routers ship with the new 802.11 format -- we know how long it can take for a WiFi standard to become a practical reality.
BMW, Porsche, others announce support for HomePlug's EV networking spec
The HomePlug Powerline Alliance already wants to tether your entire household to the Internet, and it may soon extend its reach to your garage, as well. At Computex today, the company announced that Audi, BMW, Daimler, Porsche and Volkswagen have all agreed to support its HomePlug Green PHY (GP) technology as their EV charging interface of choice. The networking specification would allow electric car owners to link their plug-ins to the Smart Grid via the same ports used to charge their batteries, opening up new, Powerline-based possibilities. Once your EV hooks up to the network, it may be able to conduct system checks in real-time, for instance, or provide instant feedback on performance or the condition of your battery. The low power GP spec will also be interoperable with HomePlug's forthcoming AV2 spec, though it's still not clear when we can expect to see Germany's automakers incorporate it into production. Zip past the break for the full PR.
HTC Sensation versus the rest of the dual-core world: smartphone spec sheet smackdown
We got to feeling a bit curious about how exactly HTC's latest Android superphone, the Sensation 4G, stacks up against its fellow dual-core competition, so we did what every geek does in such situations, we compiled a chart. Included in this list are the finest and brightest Android handsets from each of the major manufacturers that have gone dual-core so far: the Galaxy S II, the Atrix 4G, the Optimus 2X / G2X, and HTC's own EVO 3D. As it turns out, there are quite a few commonalities among these phones (besides the benchmark-crushing performance). They all boast screens of either 4 or 4.3 inches in size, the minimum amount of RAM among them is 512MB, the smallest battery is 1500mAh, and yes, they all have front-facing video cameras. Basically, it's the future of smartphones, reduced to a stat sheet. As such, it must also come with the warning that specs aren't everything, and user experience will most often depend on the software available on each device and on the preferences of the human holding it. With that proviso fully digested, join us after the break for the data.
Sandisk, Sony, and Nikon propose 500MBps memory card with more than 2TB capacity
While the CompactFlash Association scoots along at a maximum transfer rate of 167MB per second under its just released CF6.0 specification, Sandisk, Sony, and Nikon are already looking to the future. The trio have just officially proposed a new memory card format that switches from PATA to the PCI Express serial interface to achieve data transfer rates of up to 500 megabytes per second with a potential to extend maximum storage capacities beyond 2 terabytes. The proposed set of specifications hints at the high performance requirements we'll soon face as DSLRs and camcorders are updated to capture continuous burst shooting of massive RAW images and ever higher definition video. Naturally, the spec also enables photogs to transfer their troves of data more quickly to computers for post processing and combines high-speed transfer with a scaling system to extend battery life. The CompactFlash Association has already announced a new workgroup to study the proposal. Canon's Shigeto Kanda, CFA chairman of the board, had this to say about the proposal: Future professional photography and video applications will require memory cards with faster read/write speeds. The development of a new high-performance card standard with a serial interface will meet the needs of the professional imaging industry for years to come and open the door for exciting new applications. Sounds like tacit approval to us. And really, anything that brings Sony and Sandisk together on a future storage format should be seen as a positive step. Unless, of course, you're the SD Card Association or anyone who recently purchased a CFast card.
PCI Express makes the 3.0 leap, doubles bandwidth over PCIe 2.0 spec
First Bluetooth, then USB and now PCI Express. It's clearly the era of version 3.0, and given that the PCI Express specification has been humming along at 2.0 speeds for over two years now, we'd say an update was definitely due. Thankfully, the PCI-SIG has announced the availability of the PCIe Base 3.0 specification to its members today, and the highlights are certainly notable. There's a new 128b/130b encoding scheme and a data rate of 8 gigatransfers per second (GT/s), doubling the interconnect bandwidth over the PCIe 2.0 specification. And since we're sure you're fretting it, we'll go ahead and affirm that it maintains backward compatibility with previous PCIe architectures. We're also told that based on this data rate expansion, "it is possible for products designed to the PCIe 3.0 architecture to achieve bandwidth near 1 gigabyte per second (GB/s) in one direction on a single-lane (x1) configuration and scale to an aggregate approaching 32 GB/s on a sixteen-lane (x16) configuration." A lot of technobabble, sure, but one thing's for sure: your next graphics card is bound to murder your current one if paired with a PCIe 3.0 motherboard.
Wireless USB reaches revision 1.1, makes for smarter and more efficient toys
Wireless USB 1.1 is here, whether you like it or not, and we're betting you're going to like it if manufacturers make it work. The USB-IF's new spec, finalized this week, is still capped at the same 480Mbps of its wired cousin USB 2.0, but it reportedly brings with it reduced power consumption and near-field communication for proximity-based pairing. And if the idea of, say, touching your smartphone and a wireless Pixel Qi panel together to automatically connect the twain doesn't make you jump for joy, we're not really sure what would. Perhaps you're still waiting for the one-gigabit-per-second Intel's Jeff Ravencraft promised three years ago this month? Download the full spec at our more coverage link to see what's what.
128GB BDXL Blu-ray disc specification finalized... and fabulous!
Looks like the Blu-ray Disc Association has published the final specs for the monster BDXL disc, opening the way for manufacturers to start introducing the technology in their optical drives. Not too much here that we don't already know: aimed at institutions and folks who need to archive lots and lots of... stuff, BDXL discs are available in either triple layer 100GB (re-writable or write-once) or 128GB quad layer write-once flavors. Of course, with all these layers (or layuhs in Brooklyn) the laser in the Blu-ray drive you already own won't be able to do the trick, so start saving your change for a hardware upgrade once these things become commercially available. PR after the break.
Wi-Fi Alliance and WiGig sync up for 60GHz WiFi
We already heard that Hitachi, Panasonic and Toshiba would be delivering 60GHz wireless products in the latter half of this year, but it looks like a whole heap of other companies will be as well after this bombshell drops. The Wi-Fi Alliance and WiGig (which just nailed down a final spec in December) have finally got their respective ducks in a row, and thanks to a new partnership announced today, 60GHz WiFi products are now possible. For those unaware, 60GHz airwaves are typically reserved for high-bandwidth applications -- think streaming a Blu-ray flick from a player to an HDTV sans any cabling. The two will be working in unison in order to create a next-generation certification program for products operating in the 60GHz band, and best of all, a "significant portion, if not all, of these devices are expected to also support traditional WiFi networking in the 2.4GHz and 5GHz bands." There's no mention of when exactly the first 60GHz WiFi wares will begin to ship, but we can certainly say we're eager to update this here tutorial when tri-band becomes reality. Update: The rival WirelessHD alliance (updated to 1.1 today with support for 3DTV, HDCP 2.0, data applications and data rates in excess of 10Gbps) says it will support WiGig with dual-mode WirelessHD/WiGig silicon now available from SiBeam for sampling. Hey, what would a standard be if we didn't have options?
Bluetooth 4.0 with low energy (almost) finally ready to roll
Molasses, snails and glaciers: none are slower than an organization developing a new wireless standard. The Bluetooth Special Interest Group (SIG) is no exception -- it's been nearly three years since it announced it would roll Wibree into Bluetooth and four months since it made Bluetooth 4.0 official, but still no dice. This week, the SIG says the low-power specification is ready for action, its minutiae finalized. However, fine print in the org's press release disagrees. The main reason for Bluetooth 4.0 was to include lower power devices, but that all-important integration is still pending a "before June 2010" completion date. That means we still won't see Bluetooth-toting cats till the end of the year, and we have no idea what SIG has accomplished in the meanwhile. Press release after the break.
Mobile High-Definition Link supergroup upgrades to Consortium status
The Nokia / Samsung / Toshiba / Sony / Silicon Image team hoping to bring a standard to the world of high definition outputs on mobiles just got a bit official-er, shifting from the old working group title to the newly formed MHL (Mobile High-Definition Link) Consortium. If you haven't been paying attention over the last couple of years (we understand, we've been caught up in the Twilight series too -- Bella's life is so complex) Silicon Image has been pushing a 5-pin alternative to pared down HDMI jacks that are capable of outputting 1080p to connected displays while also providing power to the mobile device over a single cable. A 1.0 draft of the spec is due in the first half of the year, but an early peek is available now for $100. Since we're not CE companies looking to implement the jack or build cables and docks we'll pass but you might be interested in perusing the FAQ on the site if you're still not sure why we need yet another type of connector to feed HD from our pocketable devices to the big screen.
Blu-ray Discs expand to 128GB under new BDXL spec
This probably isn't a response to the 3D onslaught or even "superbit" releases like the upcoming Avatar 2D disc, but just in case the standard 50GB Blu-ray discs were beginning to feel a bit -- how do you say... cramped? -- the Blu-ray Disc Association's rolling out a new BDXL format capable of holding up to 128GB (write-once) or 100GB (rewriteable). Before you get too excited, you should know that you'll need a new player to access these -- even a firmware update won't save the PS3 this time -- since they go up to three or four layers deep and will likely need a more powerful laser. While our home movies can be compressed just fine, corporations currently still using other mediums for archiving might appreciate the extra space, as well as the new IH-BD discs, designed with one 25GB read-only layer, and one 25GB rewritable layer on the same platter. If you're looking for a place to permanently back up that super high-res "amateur photography," take heart -- a consumer version is in the works, though it will first be aimed at markets where Blu-ray Disc recorders are popular, or available at all (read: maybe Japan, definitely not the US). No word when the new hardware will actually hit the market, but final specs are due "in the next few months." In the meantime, check out the full details after the break.
CompactFlash 5.0 specification promises faster speeds, crazy 'theoretical' storage
If there's one thing that sounds more impressive than actual capabilities, it's theoretical capabilities -- and it looks like the CompactFlash Association has come through on both counts with its new CF5.0 specifications. While any actual cards or cameras supporting the spec are still a ways off, the new standard does pave the way for 48-bit addressing (up from 28-bit), along with an increased data transfer unit size of 32MB/s (up from 128KB/s) and, best of all, a theoretical maximum capacity of 144 petabytes (up from a mere 137GB with the current spec). Other advancements include a so-called "Video Performance Guarantee" aimed at professional video cameras, and a new Interface Electrical Specification that complies better with the ATA standard, and promises to allow for "easier and better" card design.
Blu-ray 3D specifications finalized, your PS3 is ready
In case plans by AMD and a slew of other tech vendors planning to showcase 3D Blu-ray compatible products at CES wasn't a tip-off, the updated specifications are done. The key details? First, that the Blu-ray Disc Association has chosen the Multiview Video Coding (MVC) codec to store 3D, so that even though it is now providing a full 1080p frame for each eye, it will only require about 50% more storage space compared to the 2D version, and all discs will be fully backwards compatible, in 2D, on existing players. Better than backwards compatibility, the PlayStation 3 will be forwards compatible with the new discs -- a new HDTV setup (the spec promises to work with plasmas, LCDs or projectors equally well) with IR emitters and glasses will still be necessary. According to the PR (after the break) we can expect Blu-ray 3D-stickered products in 2010, our only advice is to keep those responsible for the Cowboys Stadium abomination far, far away from it.
