Now that you know everything there is to know about the forthcoming rendition of your favorite port, there's just one little question left to be answered: how does it perform in the real world? Fresco Logic demonstrated a data transfer using the newfangled technology at IDF 2008 via a "self-developed software development platform." The results? Just over 350MBps. Not bad for a dry run, huh?

What's with all the hate, guys? For months now, AMD, NVIDIA and a host of other caps-locked companies have been harshing on the chip maker for withholding critical information in relation to the USB 3.0 controller specification. At long last, Intel can finally throw up its left hand and ask those pundits to talk to it, as the outfit has finally unveiled the Extensible Host Controller Interface (xHCI) draft specification revision 0.9 in support of the USB 3.0 (SuperSpeed USB) architecture. The spec hopes to provide a "standardized method for USB 3.0 host controllers to communicate with the USB 3.0 software stack," and it's being made available under RAND-Z (royalty free) licensing terms "to all USB 3.0 Promoter Group and contributor companies that sign an xHCI contributor agreement." So, are we all happy now?

Somewhere in a dark corner at CeBIT, PCMCIA managed to let out a whisper that informed a few flies on a nearby wall that ExpressCard Standard 2.0 was on the way. Today, however, we've received confirmation that said update is on track for a "second-half 2008 / early 2009" delivery. Put simply, v2.0 is "being developed to accommodate the significantly faster speeds increasingly demanded by today's high-performance mobile technologies," and we're also told that it will comply with PCI-Express 2.0 and SuperSpeed USB, which is "planned for release later this year as part of the USB 3.0 specification." For the paranoid, you can rest assured that the new release will be very backwards compatible, though we aren't told when to expect hardware that will reflect the changes.

Intel's announced USB 3.0 specification could push throughput beyond 4Gbps (300MBps) at the application level while introducing Quality of Service in support of HD video streams. Besides supplanting Firewire once and for all, a clear goal of the new "SuperSpeed USB" is to keep up with the transfer speeds of flash chips. "We don't want to be the bottleneck in the system," says Intel's Jeff Ravencraft who is overseeing the 3.0 initiative. Intel, HP, Microsoft, NEC, NXP, and TI will present the initial spec for a design review in November with first silicon to be stamped in "early 2009." While the new interconnect (pictured) will remain backward compatible with USB 2.0 and prior devices, new cables laced with an optical link and a max length of 2-meters will be required to take advantage of those high speeds according to a senior engineering manager with NEC. Meanwhile, a 1Gbps throughput is being targeted with Ravencraft's other baby: Wireless USB 1.1. Sounds great, but with existing 480Mbps Wireless USB silicon only achieving about 40Mbps in practice, Intel would be wise to focus on efficiency, not theory. Of course, it's all just a lot of smack-talk 'til they deliver, but with Apple running Intel inside now, Sony putting USB in their camcorders, and eSATA proliferating for external disks... well, Firewire's days sure seem numbered.

[Via EETimes and The Inquirer]