wafers
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Intel confirms Oregon plant will be ready to make 450 mm wafers
Intel's already boasted of its massive investment in a new 22 nanometer manufacturing process, and it's now confirmed that it's new plant in Hillsboro, Oregon, dubbed D1X will be ready to produce 450 millimeter wafers. Of course, "ready" seems to be the keyword here -- Intel will apparently stick with 300 mm wafers for a while yet, but have all the necessary preparations put in place to kick start 450 mm production when the industry is ready for it. That shift promises to both increase efficiency and cut costs by allowing more chips to be produced at a time, but it will likely still be years before we see any actual results -- one analyst speculates it could be 2018 at the earliest before 450 mm fabrication tools are ready.
TSMC begins construction of new $9.3b foundry, wants to sate our constant hunger for chips
TSMC might not necessarily be a household name, but the product of its labors tends to be all over home electronics. Aiming to keep that trend going, the Taiwanese chipmaker has just broken ground on its third 300mm wafer plant, located in Taichung's Central Taiwan Science Park. The new Fab 15 will have a capacity of over 100,000 wafers per month -- earning it the prestige of being described as a Gigafab -- and once operational it'll create 8,000 new skilled jobs in the area. Semiconductors built there will also be suitably modern, with 40nm and 28nm production facilities being installed, and lest you worry about such trivial things as the environment, TSMC says it's doing a few things to minimize the foundry's energy usage and greenhouse gas emission. Then again, if you're going to spend nearly $10 billion on something, would you expect anything less?
Penn State busts out 100mm graphene wafers, halcyonic dream inches closer to reality
Yes, we've been marching on this road to graphene-based superconductive electronics for a long, long time. But in the space of one week, we've now seen two significant advancements pop up that rekindle our hope for an ultrafast tomorrow. Hot on the heels of IBM's recent bandgap achievement comes Penn State University with a 100mm wafer of pure graphene gorgeousness. Built using silicon sublimation -- a process of essentially evaporating the silicon away from the carbon layer -- these are the biggest graphene wafers yet, and field effect transistors are being built atop them now to start performance testing early this year. Naturally, nobody's sitting on this laurel just yet, with further plans afoot to expand beyond 200mm wafers in order to integrate fully into the semiconductor industry, whose current standard wafer size is around 300mm in diameter. On we go then.
