Broadcom Extends Family of 3G Smartphone Platforms for Android
Introduces Industry's First Dual-Core HSPA+ Processor for Entry-Level Smartphones
IRVINE, Calif., Dec. 4, 2012
Dual ARM Cortex A9 and VideoCore® graphics provide fast computing power and unsurpassed multimedia performance at affordable price point
Complete turnkey design integrates Broadcom's newest cellular baseband with advanced connectivity suite including Wi-Fi, Bluetooth, GPS and NFC
Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today introduced its newest smartphone platform optimized for the Android 4.2 Jelly Bean operating system (OS). Powered by the BCM21664T 1.2GHz HSPA+ cellular baseband, the 3G platform delivers strong performance capabilities at faster data speeds. The BCM21664T and its turnkey design features the industry's first dual-core HSPA+ processor for affordable smartphones and integrates Broadcom's leading connectivity suite, previously available only on higher-end Android devices. For more news, visit Broadcom's Newsroom.
The appetite for affordable smartphones has grown in parallel to the demand for increased functionality and a superior mobile broadband experience that provides users with the ability to concurrently run apps, download files and share and stream content. The new BCM21664T platform brings together the processing power of a dual core ARM Cortex A9 with increased graphics and imaging capabilities to enhance the Android 4.2 experience. The chip is supported by radio frequency (RF), a power management unit (PMU) and an advanced connectivity suite for a complete system solution.
21.1 Mbps (Megabits per second) of downstream connectivity, 5.8 Mbps of upstream connectivity
Graphics features of 720p HD recording and full 1080p playback supported by over 20GFLOPS of graphics processing capacity
Miracast enabled for HD playback over wireless
Industry leading, lowest power 3G/2G dual SIM-dual standby to enable global markets
Complete reference design including schematics, tools, software and carrier specific features
The BCM21664T is currently sampling with volume production expected early in the second quarter of 2013.
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Jeff Orr, Practice Director, Devices & Applications at ABI Research
"The expanding Android ecosystem combined with the complete platform approach championed by semiconductor manufacturers like Broadcom has helped put affordable, high-performing smartphones within reach of an even larger pool of consumers. By adding an advanced processor with HSPA+ enabled technology to its portfolio of 3G smartphone platforms, Broadcom will deliver an improved Android Jelly Bean experience that allows users to share and connect in meaningful ways."
Rafael Sotomayor, Vice President, Mobile Platform Solutions
"As the first dual-core, HSPA+ enabled platform for entry-level Android smartphones, BCM21664T provides not only a better mobile experience at faster download speeds, but also establishes a new standard in performance for the growing base of low-cost smartphones. Mainstream consumers will continue to seek affordable smartphones and the user experience expectations of these devices will continue to grow. Broadcom's new chipset platform will help handset manufacturers deliver this enhanced functionality at new price points and capitalize on the expansion of the mobile internet."