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Intel Silvermont: next-gen mobile CPU's three times as fast and more energy efficient
ARM's long been the dominant form of silicon in mobile devices, but Intel aims to change that with its next-generation Atom chip design codenamed Silvermont. According to Intel, the new architecture will enable CPUs that operate at up to three times the speed of existing models, while (in some cases) also offering chips that sip just one-fifth the amount of electricity to get computational jobs done. The keys to those improvements are Intel's 22nm process and Tri-Gate transistors tuned for SoCs. While Silvermont was designed with mobile in mind, the architecture supports up to eight cores and will find its way into data centers and Ultrabooks in addition to phones and tablets. When? Intel's not telling yet, but rest assured when Silvermont shows up in an actual product, we'll be there to put it through its paces.
Intel talks up work on 22nm SoCs with Tri-Gate tech geared for mobile devices
Now that Ivy Bridge processors with Tri-Gate tech are in the wild humming away inside PCs, Intel's used the 2012 International Electron Devices Meeting to discuss its work on SoCs that also use the 22-nanometer 3D transistor tech. The processor giant didn't rattle off much in the way of specs or name the product lines that'll make use of the mobile-centric silicon, but it expects the hardware to handily outperform its 32-nanometer SoCs by 20 percent to 65 percent. Ballpark estimates on price are also MIA, so it's still unclear how the folks in Santa Clara will fare against ARM-based solutions with the new chips under their belts. In any case, Intel anticipates the fresh components will find their way into smartphones and tablets once they're ready to roll. [Image credit: huangjiahui, Flickr]
Intel Y-level Ivy Bridge chips may dip below 13W, lead to speedy Windows 8 tablets
Intel historically swings its attention to its latest generation of processors along with a new year, very nearly leaving the old platform by the wayside. There's hints, however, that the current Ivy Bridge architecture may have one last gasp. VR-Zone has published claimed specs for the Y level, a new tier of Ivy Bridge chips that would draw less energy than even the ultra-low voltage U roster. A range of processors from a 1.1GHz Pentium through to a 1.5GHz Core i7 would normally demand 13W or less of power, already lower than the 17W we know today, but step down further depending on the situation -- to a downright miserly 7W, in some scenarios. While the semiconductor giant hasn't confirmed the reasons for the new tier, it's suspected that the line is destined for Windows 8 tablets that need more grunt than an Atom without steep drops in battery life. If talk of early 2013 availability proves true, there may be a few computing surprises to be had in Las Vegas.
Intel roadmap leak outlines Bay Trail-based Atom for tablets in detail: 3D cameras, half the energy draw
Intel isn't having much success keeping its upcoming Bay Trail-era Atom platform under wraps. If the previous overview leak wasn't enough, a roadmap uncovered by Mobile Geeks has just explored the finer points of the tablet-oriented Bay View-T and its Valleyview-T processors. The most surprising leap may be in graphics: while we knew the GPU core would be much faster, we're now seeing that the new Intel hardware can output to as much as a 2,560 x 1,600 display and record stereoscopic, 1080p 3D video in the event that 3D-capable tablets come back into vogue. Likewise, battery life should be rosier than you'd expect; Bay Trail-T can reach the same performance at half the power, which should lead to about two extra hours of video playback for at least some of the 1.6GHz to 2.1GHz processors in the lineup. Don't get too excited by the potential, however. If the leak is accurate, Bay Trail for tablets isn't expected until early 2014, by which point 22-nanometer Atoms will be a step behind the cutting edge.
Intel finishes crossing the Ivy Bridge with new desktop Core i3 models
Intel has been staggering the rollout of its Ivy Bridge processors over the space of nearly half a year, starting with its higher-end quad-core chips; it's finally time for the company to complete the story and ship some budget Core i3 desktop parts. The semiconductor giant is coy about the new roster at this stage, but it does promise both regular (s-series) and low-power (t-series) Core i3 chips at clock speeds between 2.8GHz and 3.4GHz. If the past is an indicator, the new components will be mostly or exclusively dual-core and lack extras like Hyperthreading -- they will get Intel's newer integrated graphics and other perks through the upgrade, however. Bulk pricing and other details haven't yet been aggregated in one place, although we're seeing that even the faster 3.3GHz Core i3-3220 is selling at retail for $130. We wouldn't expect anything from Intel's new offerings to break the bank.
Intel's full Atom 'Bay Trail' roadmap leaked: 22nm, Ivy Bridge graphics, quad-core
We saw a leaked hint of what was coming for Intel's Valleyview system-on-a-chip (SoC), but now the full plan appears to have been outed by Chinese blog Expreview. The lineup will feature four models of the 22nm chips, with the D- and M-series looking to replace the Cedar Trail 32nm SoC chips used in current netbook and low-end desktop devices. The I-series is for embedded and industrial use, while the T-series would appear in tablets and other small form-factor devices, according to the leaked slides. That model would supersede the Clover Trail SoCs, which are only just arriving themselves in upcoming Windows 8 slates like the Acer W510 or Asus Tablet 810. The chips should offer a burly horsepower bump over their predecessors, with up to four cores and clock speeds topping out at 2.4Ghz. The icing on the cake will be the integrated Gen 7 graphics engines of Ivy Bridge fame, featuring the same HD 4000 and HD 2500 GPU's as the grownup chips, but with only four "execution units" instead of the 16 you'd find there. That would offload functions like video decoding and 3D rendering from the CPU and allow simultaneous display to a TV or monitor. Bay Trail would also support 8GB of DDR3 RAM, double that of the "last" gen, as well as USB 3.0, SATA 2.0 and a host of other connection options. If the leak is accurate, the processors would arrive sometime next year, we'll just have to wait and see if that's soon enough for Intel to take a run at its formidable competition.
Intel christens its 'Many Integrated Core' products Xeon Phi, eyes exascale milestone
Been wondering when the next big leap in high performance computing would hit? Well, Intel would like you to believe the time is now and the name of that revolution is the Xeon Phi. Formerly codenamed Knights Corner, the Many Integrated Core product is pushing the field of supercomputers into the era of the exaflop by squeezing a teraflop of performance into a package small enough to plug into a PCIe slot. The Phi brand will, at first at least, be applied to specialized coprocessors designed for highly parallel tasks. The chips are built using Intel's 22nm manufacturing process and 3-D TriGate transistors, piling in more that 50 cores in an effort to combat the inroads made by GPU companies like NVIDIA in the supercomputing space. For more info check out the presentation (PDF) and blog post at the source links.
Intel leaks: ValleyView chip could bring 4x graphics boost to netbooks in 2013
One of many reasons to still be excited about Ivy Bridge is the integrated HD4000 graphics, which are zippy enough to handle Skyrim at modest settings. Desktoppers may not be so enthused if they stick to discrete GPUs anyway, but the potential for better graphics in cheaper, low-power mobile PCs is huge. That's why we're hyped to hear talk of a forthcoming 22nm "ValleyView" processor, described by Intel insider Jesse Barnes as a "CedarView-like chip but with an Ivy Bridge graphics core". That implies HD4000 may not only be destined for desktops, laptops and Project Fionas, but for future netbooks too. Meanwhile, leaked slides (shown above and after the break) from an outfit called Advantech spill more beans. Listed under a chipset codenamed "Balboa Pier", the Cedar Trail successor is described as fanless, packing "4x Gfx performance" compared to current PowerVR-equipped Atoms, and scheduled to arrive early next year. Will it be enough to bring netbooks back into vogue? It can't hurt.
New Intel Ivy Bridge i5 details leaked in Intel sales book
Word on the street is Ivy Bridge has been delayed, but that doesn't mean you have to wait till June to get the low down on some of the shiny new silicon Intel has in store for you. Chipzilla posted a sales book, presumably on accident since it's been pulled, with details about upcoming i5 and i7 refreshes. The only page we were able to find was loaded with Core i5s, including third generation parts like the 3.4GHz 3570K which packs the new HD4000 and, most likely, an unlocked multiplier. Most of the rest of the lineup, save the 3475S, is rocking Intel's HD2500 IGP, while the lone dual-core part is the 3470T, which is also the only chip to sport Hyper-Threading and ship with only 3MB of cache. Now, as far as when you can buy these processors or how much they'll cost, we're still in dark, but at least we've got a better idea of what we'll be shopping for. Head on after the break for a slightly better look at the new parts.
Intel teaches Haswell the core values of teamwork, optimism
Sure you can make wild, individualistic boasts about having a 22nm fabrication process and three different GPUs, but that stuff counts for nothing without the magic of cooperation. The Amish know that and so does Intel, which is why its forthcoming Haswell cores will support Transactional Synchronization Extensions (TSX) -- a new instruction set designed to allow cores to work together more closely without hammering each others' fingers. TSX takes greater responsibility for the division of labor between cores at the hardware level, relieving the software programmer of some of this burdensome duty and hopefully allowing for finer-grained threading as a result. The system also relies on inherent optimism, with each core assuming that the others have handled their part of the work successfully. Inevitably, there'll be occasions when this happy belief gets splintered and a bad job has to be started again from scratch, but on average things should get done quicker and leave more energy for the barn dance.
Intel springs another leak, mobile Ivy Bridge CPUs abound
Just yesterday, we caught a glimpse of what Intel has in store for Ivy Bridge, and it seems those details were but a prelude to a bevy of details that leaked out today. It seems the folks over at VR Zone got their hands on some of Chipzilla's internal documents showing a host of changes for its post-Sandy Bridge mobile CPUs. Apparently, we can expect quite a few new full-power models, including a 2.9GHz Core i7-3920XM -- clocked at 200MHz faster than the Core i7-2960XM that's Intel's presiding mobile chipset champion -- along with two other quad-core Core i7s and a couple of Core i5 chips as well. For those who cherish battery life above all else, there's a dual-core Core i7-3667U clocked at 2.0 GHz and a 1.8GHz Core i5-3427U coming down the pipe. All the speedy new silicon comes with upgraded Intel HD graphics 4000, and is slated for release in April and May of next year. If you can't wait until then for your next-gen CPU fix, head on over to the source for a heaping helping of Ivy Bridge charts and specs.
Intel plans exascale computing by 2018, wants to make petaflops passé
Sure, Fujitsu has a right to be proud of its K supercomputer -- performing over 8 petaflops with just under 70,000 Venus CPUs is nothing to sneeze at. Intel isn't giving up its status as the supercomputing CPU king, however, as it plans to bring exascale computing to the world by the end of this decade. Such a machine could do one million trillion calculations per second, and Intel plans to make it happen with its Many Integrated Core Architecture (MIC). The first CPUs designed with MIC, codenamed Knights Corner, are built on a 22nm process that utilizes the company's 3D Tri-Gate transistors and packs over 50 cores per chip. These CPUs are designed for parallel processing applications, similar to the NVIDIA GPUs that will be used in a DARPA-funded supercomputer we learned about last year. Here we thought the war between these two was over -- looks like a new one's just getting started. PR's after the break.
Compal's 'Ultra Mobile' Ultrabook eyes-on
Intel's already teased Compal's "Ultra Mobile" Ultrabook from afar, but when this Ivy Bridge laptop popped up on the show floor after the Computex keynote, we decided to give it a closer look. While this prototype isn't quite in the same league as ASUS' gorgeous UX21, do bear in mind that we're still looking at a relatively slim package for a 14- to 15-inch Core i7 rig. Also visible around the machine are a couple of USB 3.0 ports, an HDMI-out port, a LAN socket, and an SD card reader. Until we hear more about this Ultra Mobile, enjoy our eyes-on photos below. %Gallery-125292%
Intel reveals skinny Ivy Bridge 'Ultrabooks,' Moore's Law-defying Atoms
Intel took the opportunity at Computex to update the tech-loving world on its processor plans, and it looks like those whispers we heard about low power and an accelerated Atom roadmap were spot on. Executive VP Sean Maloney didn't divulge specific TDPs but did confirm that we could look forward to reduced power consumption and sleek designs in 2012. The Intel exec declared that new class of PC, dubbed "Ultrabooks," will make up 40-percent of the market by the end of 2012. These machines, powered by the 22nm Ivy Bridge, will be less than 0.8-inches thick and start at under $1,000 -- which sounds just like the lines we were fed about CULV chips back in 2009. Maloney also confirmed that, going forward, the Atom line would be getting a die shrink every year, as opposed to every two. The upcoming, 32nm Cedar Trail will usher in the new Moore's Law-smashing era with promises of a 10 hour battery life and weeks of standby, and will be succeeded by 22nm and 14nm models. Intel even talked up Medfield, it's Atom variant designed specifically for smartphones and tablets, and showed off more than 10 tablets based on the Oak Trail-flavored Z670. With AMD merely a fading blip in the company's rearview mirror it looks like Chipzilla is gunning for all those ARM-touting manufacturers. Check out the full PR after the break. %Gallery-124884%
Intel's Ivy Bridge coming Q1 2012, growing festive moss while you wait
If you were religiously awaiting the fruition of last month's Intel leak, brace yourself: we've got another one. Although Intel's updated roadmap hasn't changed anything per se, it does offer a few specifics. Whereas the previous schedule only suggested we'd be crossing the Ivy Bridge in the first half of 2012, the new roadmap shows the 22 nanometer processor penned in at the end of the first quarter. The Sandy Bridge E series is still on schedule for Q4 however, so unless you just have to have native USB 3.0 and DirectX 11 support, you still have plenty to look forward to. Otherwise, we'll see you in April.
Intel goes ULV for laptops to combat the oncoming tablet horde
Intel has been talking up its x86-powered smartphones and battery-sipping Atoms for tablets quite a bit recently, but the company hasn't forgotten its roots in traditional PC form-factors. At an investor event in San Francisco, CEO Paul Otellini announced a significant change to its line of notebook CPUs -- ultra low voltage will be the new norm, not just a niche chip for high-end ultra-portables. The baseline TDP for future CPUs will be in the 10 to 15 watt range, a huge drop from the 35w design of the mainstream Core line and lower than even current-gen ULV chips (which bottom out at 17w). The company also plans to make NVIDIA eat its words by putting the pedal to the metal on die shrinks -- releasing a 22nm Atom next year followed by a 14nm version in 2013. That could mean our fantasy of true all-day battery life in a sleek and sexy laptop will finally come true. Don't crush our dreams Intel!
Intel will mass produce 3D transistors for all future CPUs, starting with 22nm Ivy Bridge (video)
Looks like 3D isn't just a fad, folks, so long as we're talking about silicon -- Intel just announced that it has invented a 3D "Tri-Gate" transistor that will allow the company to keep shrinking chips, Moore's Law naysayers be darned. Intel says the transistors will use 50 percent less power, conduct more current and provide 37 percent more speed than their 2D counterparts thanks to vertical fins of silicon substrate that stick up through the other layers, and that those fancy fins could make for cheaper chips too -- currently, though, the tri-gate tech adds an estimated 2 to 3 percent cost to existing silicon wafers. Intel says we'll see the new technology first in its 22nm Ivy Bridge CPUs, going into mass production in the second half of the year, and it's planning 14nm chips in 2013 and 10nm chips in 2015. Also, 3D transistors won't be limited to the cutting edge -- Intel reps told journalists that they "will extend across the entire range of our product line," including mobile devices. Three videos and a press release await you after the break. Chris Trout contributed to this report.
Intel's next CPU refresh will include DirectX 11 graphics support
Tick, the CPU and GPU get integrated into the same 32nm die, tock, they both go down to 22nm with the latter gaining DirectX 11 support. Intel's only just unveiled its Sandy Bridge processors, but the next update to the company's desktop and laptop hardware has already gained an important detail. Mooly Eden, general manager for the PC Client Group, has disclosed the news that Ivy Bridge -- the die shrink of the Sandy Bridge microarchitecture -- will include DX 11 graphical capabilities when it arrives late in 2011. We're inclined to agree with Intel that DirectX 11 really wasn't a necessary implementation for Sandy Bridge given its humble gaming credentials, but Mooly expects a lot more applications will have harnessed the available APIs by the time we come to cross the Ivy Bridge. Let's hope it is so.
Intel providing 22nm fabrication capacity to semiconductor start-up
Well, there sure are interesting things afoot in the land of Intel these days. Just last month the chipmaker announced a $6 to $8 billion dollar investment in factory upgrades to push ahead with hits 22nm manufacturing process, and it's now announced that its struck a first of its kind deal with upstart semiconductor company Achronix. That deal involves Intel actually giving Achronix access to its 22nm fab process, which Achronix will use to manufacture its 22i Speedster FPGAs (said to boast a 300% higher performance and 50% lower power than FPGAs using any other process technology). While that arrangement is notable in and of itself, Intel seems to be going out of its way to downplay the size of the deal. In a blog post discussing the matter, Intel's Bill Kircos notes that the deal "would only make up a tiny amount of our overall capacity, significantly less than one percent, and is not currently viewed as financially material to Intel's earnings." He does add that it is an "important endeavor" for Intel, though, which could possibly suggest that Intel is using the company as a testbed of sorts for its new manufacturing process.
Intel announces plans to spend up to $8 billion on U.S. factory upgrades
Apple and Google may be sitting on their piles of cash, but Intel sure is dipping into its reserves in a big way these days -- the company has just announced that it's following up its nearly $8 billion acquisition of McAfee with a multi-billion dollar investment in upgrades to its factories in Arizona and Oregon. That investment will total between $6 billion and $8 billion, and include the development of an entirely new fabrication plant in Oregon, in addition to upgrades at the two existing facilities that will allow Intel to move forward with its 22-nanometer manufacturing process. As you can no doubt guess, the investment will also be quite a boon to both areas -- Intel says that the upgrades, which will take place over "several years," will create as many as 8,000 construction jobs and between 800 and 1,000 permanent jobs at the facilities. Head on past the break for the full press release.
