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Apple A6 investigation shows highly customized dual-core, triple-GPU layout
There's been a significant mystery lingering around the A6 processor found in the iPhone 5, even as it became clearer that Apple was veering further than usual from the basic ARM formula. A microscope-level inspection by Chipworks and iFixit is at last identifying the key elements of the 32nm, Samsung-assembled chip and revealing just how far it strays from the beaten path. The examination confirms earlier suspicions of a dual-core design with triple-core graphics -- it's how that design is shaped that makes the difference. Apple chose to lay out the two processor cores by hand rather than let a computer do the work, as most ARM partners do. The procedure is expensive and slow, but also gives the A6 a better-optimized design; it explains why the chip is noticeably faster than much of its competition without needing the brute force approaches of higher clock speeds or extra cores. Some mysteries remain, such as the exact PowerVR graphics that are at work, but it's evident Apple now has the design talent and resources to speed up mobile devices on its own terms rather than wait for off-the-shelf layouts like the Cortex-A15.
Intel slips details of Poulson-based Itanium 9500 in advance, teases a big boost to 64-bit servers
If you think Intel took awhile to roll out the Xeon E5, imagine the mindset of Itanium server operators -- they haven't had any kind of update to the IA-64 chip design since February 2010, and they're still waiting. Much to their relief, Intel just dropped a big hint that the next-generation, Poulson-based Itanium is getting close. Both a reference manual and a Product Change Notification have signaled that the new, 32-nanometer part will get the Itanium 9500 name as well as a heap of extra improvements that haven't been detailed until now. We knew of the eight processing cores, but the inadvertent revelation also confirms about a 50 percent hike in the interconnect speed and a matching increase in the cache size to 32MB. Clock speeds also start where current Tukwila-running Itaniums stop, with four processors between 1.73GHz and 2.53GHz giving the line a much-needed shot of adrenaline. Few of us end users will ever directly benefit when Poulson ships to company server farms later this year; after these increases, though, don't be shocked when the database at work is suddenly much quicker on its toes.
Rumors give 2012 iPhone shiny new chip, 1GB of RAM, mystery iOS app
We've potentially seen a lot of the next iPhone's exterior; it may be the interior's time for a shakedown, as an unusually detailed rumor out of 9to5 Mac has claimed scads more about the processor and iOS 6. Going by the tips, the 2012 design would use an S5L8950X, a processor with unknown specs but likely a step ahead of what we've seen in the iPhone 4S (8940X) and new iPad (8945X). There would likewise be a new spin on the PowerVR SGX543 graphics from the iPad as well as 1GB of RAM -- which doesn't sound like much next to a 2GB Galaxy S III, but stands to produce a similar speed boost for a lightweight platform like iOS. As for iOS 6 itself, the software is supposedly using underlying code newer than recent OS X Mountain Lion builds and is dumping Google Maps, as some have claimed ever since iPhoto for iOS made that step in the spring. The new Maps app (possibly pictured here) is said to be rough, but the OS as a whole could be coming along so swimmingly that Apple might have no trouble shipping on time. As always, we're skeptical when so much detail is in flux. The rumor still jives with much more tangible behavior from Apple, such as its experimentation with 32-nanometer processors and a tendency for Apple to refine the chip from the current year's iPad for the iPhone months later. We may know the accuracy soon enough: more leaks are promised in the next two weeks, including an "entirely new iOS app."
AMD ships 32nm quad-core Llano APU, expects systems 'later this quarter'
Whoa, Nelly! AMD, a company that has struggled to nail its ship dates in years past, has just pulled the ultimate 180. If you'll recall, we heard last month that its quad-core Llano APU was on track for a Q3 2011 release, but now, we've word straight from the equine's mouth that the action will be going down far sooner. In fact, AMD's Singapore plant just celebrated the first shipment of the company's 32nm Llano A-series APUs, complete with discrete-level graphics and a promise to change the way we think about netbook / nettop / ultraportable performance. Of course, just because these chips are headed out to OEM partners doesn't mean that they'll be gracing the pages of your favorite PC maker tomorrow; Chief Financial Officer and Interim CEO Thomas Seifert notes that AMD is looking forward to seeing Llano-based machines during this quarter, but given that Q2 just got going, we may be waiting awhile still. Nothing like a little Zacate to tide you over in the meantime, right?
Dell, HP, and Lenovo bringing SDXC to laptops alongside 32nm Intel chipsets?
Those incredibly sexy (as far as portable storage capacities are concerned) 64GB SDXC cards coming on the horizon? You're gonna want some hardware to work with it, and according to DailyTech, three of the largest computer manufacturers are looking to bring the upgrade with Intel's forthcoming Arrandale CPUs. Lenovo, HP, and Dell are reportedly working on new designs that'll contain both the new 32nm chipsets and SDXC readers. Not that we're surprised to see new SDHC's time running out, but it does give you something to look forward to.
IBM, Samsung, Globalfoundries, and more looking to beat Intel to 28nm market
Sure, Intel's one-upping AMD in the 32nm department, but IBM and its merry band of Technology Alliance members -- including Samsung, STMicroelectronics, and AMD chipmakers Globalfoundries -- are looking to ramp up the competition and develop even smaller, low power 28nm processors before Intel gets a chance to size down. The group additionally promises migration plans for companies who've got 32nm on their roadmap and want to maybe shrink a few of the later, already planned models. Early risk production for the 28nm chips are planned for second half 2010, which means it's very unlikely we'll be seeing them in consumer gadgets until at least 2011.
Panasonic, Renesas team to mass produce 32nm chips
We've seen some big names working on 32nm chips, and now we can add two more to the mix. According to Nikkei, Panasonic and Renesas have recently developed technology necessary to mass produce the little guys, using metal oxide film (instead of a silicon material) for the insulating layer and titanium nitride for the conducting layer. This has allowed the chips to consume less power, so the 32nm chips operate comparably to their 45nm siblings. Look for a street date sometime in 2011 -- but considering that Toshiba, IBM and others have set a target date of 2010 for their 32nm chips, and Samsung and Intel are aiming at 2009, Panny might be showing up to this party a little late.
Sony continues to shed chip responsibilities
Although they inked a 5-year deal back in January 2006, Sony is bailing on at least part of its commitment to the development of chips with 32-nanometer (or less) circuitry. The research required to developed the manufacturing technology now rests squarely on the shoulders of Toshiba and IBM. A move which certainly makes sense now that Tosh has manufacturing responsibility for Sony's Cell processor. Sony will continue to assist with "the design work" and making post-lunch runs to Starbucks.
