3dTransistors
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Globalfoundries unveils 14nm-XM chip architecture, vows up to a 60 percent jump in battery life
Globalfoundries wants to show that it can play the 3D transistor game as well as Intel. Its newly unveiled 14nm-XM (Extreme Mobility) modular architecture uses the inherently low-voltage, low-leak nature of the foundry's FinFET layout, along with a few traces of its still-in-development 20nm process, to build a 14-nanometer chip with all the size and power savings that usually come from a die shrink. Compared to the larger processors with flat transistors that we're used to, the new technique is poised to offer between 40 to 60 percent better battery life, all else being equal -- a huge help when even those devices built on a 28nm Snapdragon S4 can struggle to make it through a full day on a charge. To no one's shock, Globalfoundries is focusing its energy on getting 14nm-XM into the ARM-based processors that could use the energy savings the most. It will be some time before you find that extra-dimensional technology sitting in your phone or tablet, though. Just as Intel doesn't expect to reach those miniscule sizes until 2013, Globalfoundries expects its first working 14nm silicon to arrive the same year. That could leave a long wait between test production runs and having a finished product in your hands.
ARM and Globalfoundries hammer out deal to promote 20nm mobile chips
Sure it's British, but ARM's mobile empire is being built through careful alliances rather than conquest. The chip designer's latest deal with Globalfoundries, which mirrors a very similar agreement signed with rival foundry TSMC last month, is a case in point. It's designed to promote the adoption of fast, energy-efficient 20nm processors by making it easy for chip makers (like Samsung, perhaps) to knock on Globalfoundries' door for the grunt work of actually fabricating the silicon -- since the foundry will now be prepped to produce precisely that type of chip. As far as the regular gadget buyer is concerned, all this politicking amounts to one thing: further reassurance that mobile processor shrinkage isn't going to peter out after the new 32nm Exynos chips or the 28nm Snapdragon S4 -- it's going to push on past the 22nm benchmark that Ivy Bridge already established in the desktop sphere and hopefully deliver phones and tablets that do more with less juice.
IBM and 3M join forces to fab 3D microchips, create mini-silicon skyscraper valley
3D hype is fast wearing out its welcome, but there's at least one area of industry where the buzzed about term could usher in true innovation. Announced today as a joint research project, IBM and 3M will work towards the creation of a new breed of microprocessors. Unlike similar three-dimensional semiconductor efforts by Intel, the two newly partnered outfits plan to stack up to 100 layers of chips atop one another resulting in a microchip "brick." Under the agreement, IBM will contribute its expertise on packaging the new processors, while 3M will get to work developing an adhesive that can not only be applied in batches, but'll also allow for heat transfer without crippling logic circuitry. If the companies' boasts are to be believed, these powerhouse computing towers would cram memory and networking into a "computer chip 1,000 times faster than today's fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices." That's a heady claim for a tech that doesn't yet exist, but is already taking swings at current faux 3D transistors. Official presser and video await you after the break.
Intel reveals skinny Ivy Bridge 'Ultrabooks,' Moore's Law-defying Atoms
Intel took the opportunity at Computex to update the tech-loving world on its processor plans, and it looks like those whispers we heard about low power and an accelerated Atom roadmap were spot on. Executive VP Sean Maloney didn't divulge specific TDPs but did confirm that we could look forward to reduced power consumption and sleek designs in 2012. The Intel exec declared that new class of PC, dubbed "Ultrabooks," will make up 40-percent of the market by the end of 2012. These machines, powered by the 22nm Ivy Bridge, will be less than 0.8-inches thick and start at under $1,000 -- which sounds just like the lines we were fed about CULV chips back in 2009. Maloney also confirmed that, going forward, the Atom line would be getting a die shrink every year, as opposed to every two. The upcoming, 32nm Cedar Trail will usher in the new Moore's Law-smashing era with promises of a 10 hour battery life and weeks of standby, and will be succeeded by 22nm and 14nm models. Intel even talked up Medfield, it's Atom variant designed specifically for smartphones and tablets, and showed off more than 10 tablets based on the Oak Trail-flavored Z670. With AMD merely a fading blip in the company's rearview mirror it looks like Chipzilla is gunning for all those ARM-touting manufacturers. Check out the full PR after the break. %Gallery-124884%
Next-next-gen Atom will be a system on a chip called 'Silvermont,' pack 3D transistors?
Last week, we were treated to an earful about Intel's plans for its future chips -- most notably, that it's committing to 3D transistors across the board. Well, that trickle of information hasn't run dry just yet -- today's tidbit gives us a peek not into the next-generation of Atom, but the one already in the works to come after that. The new processor, codenamed "Silvermont," will be a system-on-a-chip and is reportedly slated to ship sometime in 2013. CNET also cites unnamed sources who claim that it will be designed specifically to take advantage of Intel's 22nm technology and 3D transistors. As it stands, though, they boost the cost of wafers by two to three percent, so here's hoping that premium comes down before the netbooks of the future hit the market -- if we have netbooks in the future.
