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Here's another reason you won't buy Intel's luxury wearable
Looking for a good way to alienate potential customers? Well, there's always the tried and true method: lock your device down to a specific carrier. Intel's MICA (My Intelligent Communication Accessory) $1,000 ballpark price tag and snakeskin coverings were bound to limit its customer base, but the company just announced it has one more barrier for entry -- the 3G enabled bangle is going to be exclusive to AT&T. Not that there's anything wrong with old Ma Bell, but some people find magenta just as fashionable.
Intel's Edison launches at IDF, and it's still tiny
Back in January, Intel CEO Brian Krzanich teased us with Intel Edison -- a tiny computer with a 22nm chip, on-board WiFi and Bluetooth and the footprint of an SD card. It was designed to be a lightweight and low-power development platform to help usher in the Internet of Things and the next generation of wearable devices. The company wouldn't give us a hard launch date for Edison back at CES, but Krzanich was happy to lay it out during today's IDF keynote: as of today, Intel Edison is shipping and available. Krzanich left it at that, short and sweet, and will be encouraging developers to adopt the program all weekend.
Hands-on with the Dell Venue 8 7000 tablet and Intel RealSense
If you've been on vacation even once in the last four years, you've seen it: tourists whipping out awkward tablets with subpar cameras to capture what can only be the worst photographs. Tablets aren't known for their stellar imaging capabilities, but Dell and Intel's next joint effort may change that, at least to some degree. During this morning's Intel Developer Forum keynote, Dell CEO Michael Dell and Intel CEO Brian Krzanich will preview a new tablet: the Dell Venue 8 7000 series. At 6mm thick, the new slate is purported to be the world's thinnest tablet. It's also the first device to feature Intel RealSense -- a photo technology that creates a depth map within every image it takes. Krzanich gave me a quick preview of the device before today's keynote.
Intel to support USB 3.0 alongside Thunderbolt, coming with Ivy Bridge in 2012
We were just pondering this very thing yesterday -- would Intel dedicate itself to Thunderbolt and give USB 3.0 the cold shoulder -- and now we have our answer from the Santa Clara crew, albeit delivered from Beijing. The Chinese capital is the site of Intel's currently ongoing developer conference, which is where Kirk Skaugen, VP of the company's Architecture Group, assured the world that the promise for native USB 3.0 support in Intel chipsets will be fulfilled. Not this year, mind you, but it'll be with us in 2012 as part of the Ivy Bridge CPU refresh. That matches AMD's plans to support USB 3.0 in Fusion APUs, and was augmented with a strong word of endorsement from Skaugen about the connector's future. He urged developers to embrace USB 3.0 on an equal footing with Intel's proprietary Thunderbolt interconnect, describing the two technologies as "complementary." If you say so, captain.
