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Split second power outage may lead to drop in Toshiba chip shipments
It's more than a little crazy to think about, but a 0.07-second power disruption in Japan yesterday may have just caused as much as a 20 percent drop in chip shipments from Toshiba. The root of the problem is that the backup system at Toshiba's Yokkaichi memory chip plant failed to kick in because the brief drop in voltage was more severe than the system was designed for, which has not only forced the plant to halt production until Friday, but may have caused irreparable damage to scores of chips in production at the time of the outage. As The Wall Street Journal reports, it's still not clear exactly how much damage was caused, but if, for instance, the systems controlling the so-called clean room were shut off, all chips inside would likely be ruined. The good news, such as it is, is that there isn't likely to be a worldwide shortage as a result of the outage -- Toshiba plans to adjust their output accordingly early next year, and it notes that demand is usually slow in January and February anyway following the holiday shopping season.
Samsung slims down NAND memory packaging, wafer-thin gadgets to follow
Good old Samsung and its obsession with thinness. After finally letting its 30nm 32Gb NAND chips out of the bag in May, the Korean memory maker has now successfully halved the thickness of its octa-die memory package to a shockingly thin 0.6mm (or 0.02 inches). The new stacks will start out at a 32GB size, though the real benefits are likelier to be felt down the line when the ability to pack bits more densely pays off in even higher storage capacities. Cellphones, media players and digital cameras will inevitably take the lion's share, but we're hopeful -- eternal optimists that we are -- that this could accelerate the decline of SSD prices to a borderline affordable level. Intel and Micron promised us as much, how about Samsung delivering it?
