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HP and Calxeda's Moonshot ARM servers will bring all the boys to the yard (video)
HP and Calxeda's indiscreet partnership has been revealed to the world: Project Moonshot is a new server based around a brand new ARM-based EnergyCore system-on-chip. These new units are so efficient that a four core version, packing 4GB DRAM, consumes just five watts at full pelt -- for perspective, that's less than your average tablet. The other funky innovation is that all the server nodes now share a single power, cooling, management and storage system rather than carrying it themselves. In terms of space saving, the Redstone four unit chassis you can see in the image above can hold 288 of the little blighters. If you set your alarm clock early to learn more about efficient server architecture, head on past the break for two videos, including a tour of HP's server labs and some press release goodness.
HP to announce ARM-based servers next month, throw Intel a curveball
Sources close to Bloomberg and the Wall Street Journal say that HP is primed to help ARM wrestle its way into the server game next month, citing unannounced plans that may challenge Intel's corner on the market. HP is said to be working with Calxeda, an outfit with dreams of outclassing today's servers by selling OEMs an ARM-based system on a chip that can be used to build high performance racks with low energy footprints. ARM, HP and Calxeda all declined to comment, although a spokesperson for Calxeda mentioned that it has a product release event scheduled for November 1st. Intel doesn't seem too concerned, and told the Wall Street Journal that ARM architecture still had a few hurdles to jump before it was ready for the server game. "We believe the best-performing platform will win." Spoken like a true sportsman, Intel. Game on.
Freescale expands its family of i.MX50 chips, goes beyond e-readers this time
We had a feeling that Freescale was onto something when it debuted the i.MX508, a system-on-a-chip that carried the promise of $150 e-readers (and the reality of $129 ones). Given that, we can see where the execs at Freescale would be feeling a bit heady, and might wonder where else they could help push down prices. That's exactly what we have here: the outfit is trotting out three new i.MX50 processors and, as you can see in that handy chart up there, they all sit even lower in the lineup than the low-cost i.MX508. Like the i.MX508, they all pack an 800HMz ARM Cortex-A8 processor, among other similar specs. The new i.MX507, in particular, resembles the i.MX508 in that it's designed to work with E Ink displays, though it lacks graphics acceleration, and Freescale imagines it'll instead find a home in outdoor signs and smart labels. Moving on down the line, the i.MX502 and the i.MX503 were both intended for devices with LCD -- not electronic paper -- displays, with the latter offering OpenVG graphics acceleration. If Freescale's predictions are on the money, you'll find the lower-end i.MX502 in DECT phones and vending machine displays, and the i.MX503 in personal navigators and medical monitoring tablets, among other use cases. For now, companies are sampling the chips, but they'll start shipping later this quarter for a song -- less than $10 for the i.MX502 at volume cost. Full PR after the break, and lots more technical details at the source link.
Apple reportedly leaves Samsung for A6 production
Apple may drop Samsung and switch to Taiwan Semiconductor Manufacturing Company (TSMC) for the production of its next generation A6 chipset. The Cupertino Company is reportedly working with TSMC to move to a 28 nm ARM SoC in 2012. Rumors of this TSMC partnership surfaced earlier this year before Apple filed a trademark infringement suit against Samsung. Though the A4 and A5 are still being produced by Samsung, the Korean company may be out of the loop in future Apple hardware. This move away from Samsung may have a deleterious effect on the Korean manufacturer as Apple is reportedly one of its biggest customers. Apple has secured LCD displays, chipsets and NAND flash memory from Samsung that are used in its iOS devices. If the impending legal battle between the two companies sours the relationship, Apple may be forced to turn to costlier options for its device components, and Samsung may lose one of its biggest customers.
AMD confirms tablet-friendly Z-series APU, next-gen Trinity APU for bigger devices
AMD likes to take its time before stepping inside the ring, but it's turned up at Computex with its gown off and mouthguard in. Its much-leaked Z-series Fusion APU (aka "Desna") for tablet devices is now official and could well steal some of ARM's thunder. Whereas ARM chips will get along with the next version of Windows, AMD's Z-series is already tuned into the here-and-now. Its integrated dual 1Ghz Bobcat chips and Radeon HD 6250 graphics should allow the full Windows 7 experience on a tablet, from USB peripheral compatibility right down to XBOX 360 Media Extender functionality. What's more, it drinks less than 6W of power so is significantly leaner than the 9W Ontario APU powering Acer's Iconia W500 Windows 7 tablet. Additionally, AMD claims MSI has already made that leap with its new WindPad 110w (though we can't be sure if the pre-release device we just handled was carrying a Z-series chip). Meanwhile, AMD left any traces of shyness far behind as it went on to confirm plans for a range of A-series and E-series chips with which it hopes to tackle Intel's dominance in the laptop and desktop spheres -- right up to the level of the Core i7. This includes the leaked high-end quad-core A8 and, more surprisingly, a new Trinity APU. Looking way into the future, AMD intends Trinity to be a successor to the mid-range A-series Llano, which isn't even out yet but is expected imminently. Unfortunately we have no concrete specs for the Trinity -- AMD thought it was sufficient to wave the thing around at the press conference and declare it "2012's best APU". Depending on how you look at it, that's either fighting talk or plain posturing.
Next-next-gen Atom will be a system on a chip called 'Silvermont,' pack 3D transistors?
Last week, we were treated to an earful about Intel's plans for its future chips -- most notably, that it's committing to 3D transistors across the board. Well, that trickle of information hasn't run dry just yet -- today's tidbit gives us a peek not into the next-generation of Atom, but the one already in the works to come after that. The new processor, codenamed "Silvermont," will be a system-on-a-chip and is reportedly slated to ship sometime in 2013. CNET also cites unnamed sources who claim that it will be designed specifically to take advantage of Intel's 22nm technology and 3D transistors. As it stands, though, they boost the cost of wafers by two to three percent, so here's hoping that premium comes down before the netbooks of the future hit the market -- if we have netbooks in the future.
NVIDIA acquiring wireless chip manufacturer Icera, doubling-down on the post-PC era
NVIDIA, a company once focused entirely on giant graphics cards for home computers, has already quite successfully re-positioned itself as a player in the mobile graphics world. Now it's poised to really shake things up, announcing the acquisition of Icera. The UK-based company you've probably never heard of has a line of 3G and 4G baseband processors used in wireless devices and USB modems -- chips that are said to be smaller, more flexible, and more efficient than the competition from Qualcomm and ST-Ericsson. Icera seems to have been focused heavily on LTE of late, which puts NVIDIA in a good place to not only manage what happens to the data when its inside your next-gen phone or tablet, but to also control just how it gets there in the first place. A future Tegra SoC that handles wireless data too? Color us intrigued.
Marvell unveils Avastar 88W8797, first wireless SoC for mobile devices with 2x2 MIMO
The days of the shotgun modem live on with MIMO -- multiple-input and multiple-output adapters that offer numerous antennas to aggregate numerous parallel connections. Marvell just became the first to put such a solution on a tiny SoC, debuting its Avastar 88W8797 with dual 802.11n connectivity for transmission and receiving. This allows for 300Mbps transfers along with Bluetooth 4.0 and even FM transmission and reception, all built into a single chip with "advanced power management designed specifically for handheld products such as smartphones and tablets." You know what that means: shotgun WiFi in next-gen mobile devices. Yee haw!
Broadcom announces yet another Android-friendly dual-core processor
Broadcom is giving Google a lot of love of late, with the announcement of its second Android-ready processor in as many months hitting us today. The new BCM28150 is a big step up from its predecessor (released in December), and sports a dual-core ARM Cortex-A9 at 1.1GHz; an HSPA+ modem doing 21Mbps; and Broadcom's VideoCore IV VPU (vector processing unit). What's more, it touts 12-megapixel camera imaging, 3D video and gaming at 1080p, HDMI out, and the obligatory Bluetooth, WiFi, and GPS amenities. If the BCM28150 is your bag, Broadcom plans to demo the thing in Barcelona next week, but if a trip to Spain is too rich for your blood, you can always check out the PR after the jump (and keep it locked right here for our own MWC coverage, of course).
Alcatel-Lucent's lightRadio shoves a base station in a box, minimalists cheer
They've been fashioned after palm trees, Christ on the cross, and what look to be Dyson Ball vacuum attachments. But now, Alcatel-Lucent is giving cellphone towers a makeover that might actually stick. The company's new broadband base station solution, known as lightRadio, eliminates the need for cumbersome huts at the base of cellphone towers and packs antennas into a series of 2.5-inch boxes, while simultaneously improving capacity and reducing cost. These so-called radio cubes combine 2G, 3G, and LTE antennas with an SoC for processing, making them small enough to prop up on a lamp post. They're firmware upgradable, and utilize beamforming to more efficiently connect to wireless devices; according to the company, groups of 'em can not only increase broadband capacity by 30 percent, but also cut operation costs and CO2 emissions in half. Clearly, lightRadio makes a compelling case for narrowing the digital divide, but it won't be available broadly until 2012, which means the creative cover ups will just keep on coming. Sorry, JC. [Thanks, Nathan]
Mediaroom rumors could put Microsoft IPTV on the fast track to success
We're hearing rumors today that Microsoft's already hardworking Mediaroom could be putting in overtime in the near future. According to ZDNet, not only is Microsoft working on a Mediaroom client for Windows Phone (aka Rome), but it's also got a Silverlight-for-Mediaroom project (aka Taos) in the pipeline, with a possible Silverlight-for-Mediaroom STB (aka Santa Fe) also on the way. As if it didn't already have a heavy workload, the platform is also up for a possible tie-in with Windows Media Center (aka Monaco). All this comes on the heels of chatter that the software giant is considering a new Xbox 360 TV service, incorporating Mediaroom, and news of a Silverlight SOC that could be worked into an STB like Santa Fe. All code names and acronyms aside, it looks like Microsoft is gearing up to give Apple and Google some serious internet TV competition, which means Mediaroom's going to have say goodbye to happy hour and hello to some serious all-nighters.
IBM forms new partnership with ARM in hopes of developing ludicrously small chip processing technology
We've seen IBM and ARM team up before, but this week both companies announced a new joint initiative to develop 14nm chip processing technology. That's significantly smaller than the 20nm SoC technology ARM hopes to create in partnership with TSMC, and makes the company's previous work with IBM on 32nm semiconductors look like a cake walk. The potential benefits, though, are faster processors that require less power, and feature lower per unit manufacturing costs Who knows if or when we'll see tangible results from the tag team, but if IBM's Watson can beat Jeopardy champions, further reducing the average size of a feature that can be created on a chip should be elementary, right? To read over the full announcement check out the press release after the break.
Qualcomm unveils dual-core Snapdragon reference handset at CES 2011
NVIDIA's Tegra 2 was tearing it up on the CES 2011 show floor in a host of new tablets, but unbeknownst to us, Qualcomm's long-awaited dual-core Snapdragon made a pair of cameo appearances as well. The first was in ASUS' Eee Pad MeMO, which showed off its pressure-sensitive stylus action on the floor, and the second is in the new Qualcomm reference design you see immediately above. According to a video released on Qualcomm's website -- which you can watch after the break -- Qualcomm attempted to distract tech journalists from Verizon's press conference by giving them a sneak peek at the HTC Thunderbolt here instead. Then, we like to imagine, the company brainwashed the lot into believing the 1.2GHz MSM8660 with Adreno 220 graphics is destined for a host of tablets and phones. Of course, if that's actually the case, we'll gladly join the throng. Where do we sign up?
Freescale Semiconductor and RealD working to improve active shutter 3D
Passive 3D seems to be the new home entertainment hotness at CES this year, but that doesn't mean the industry has given up on active shutter. Case in point, Freescale Semiconductor and RealD have announced they're developing an "enhanced 3D active eyewear solution" that combines Freescale's RF4CE platform for the over-the-air 3D synchronization with RealD's switching, filtering, and optical technology. Powered by Freescale's MC1323x System on a Chip, the new system hopes to eliminate many the problems plaguing IR-based active shutter like line-of-sight and of field-of-vision limitations. It should also allow 3D glasses to operate from longer distances, and since it takes advantage of the same radio frequency used by remotes, it could lower overall costs for manufacturers to boot. Keep in mind though that unlike NVIDIA's RF-based 3D Vision Pro Tech, all of these wondrous promises are just talk with no walk -- so we'll throttle our excitement until we can go eyes-on with some actual gear. For all the details hit up the PR after the break.
Microsoft confirms ARM support is coming in Windows, will play nice with SoCs too
Looks like the rumors were true: Microsoft has just confirmed that the next major revision of Windows, what we'll call Windows 8 for now, will include ARM support. The company also is throwing a little love to all the system on a chip (SoC) makers out there, indicating they'll be getting support out of the box as well. This is the sort of thing we've come to expect from Windows Embedded, but it's something new for the company's flagship product, and is something of a continued sign that the concept of a "personal computer" is only going to keep changing. Full details are in the release after the break, but be warned those details don't include anything even resembling a date. There are, however, about a zillion quotes from companies like ARM, which says: Windows combined with the scalability of the low-power ARM architecture, the market expertise of ARM silicon partners and the extensive SoC talent within the broad ARM ecosystem will enable innovative platforms to realize the future of computing, ultimately creating new market opportunities and delivering compelling products to consumers. Yep, it's a press release all right. Update: Want some more of that kind of language? Here's a whole second release full of it. Update 2: See that version 6.2.7867? It's what follows 6.1.7600, aka, Windows 7.
Samsung Orion dual-core ARM Cortex-A9 chip spotted in the wild
We know it's a little tough to get excited about a chip, even if that chip is the hotly anticipated Samsung Orion. Still, bear with us, because this isn't your average slab of cellphone silicon -- the Orion's got a dual-core 1GHz ARM Cortex-A9 CPU and a quad-core Mali 400 GPU on board. We spotted it at the ARM Technology Conference this week where it was pimping "Linaro" Linux middleware, as well as some stock Android 2.2. Unfortunately, the development boards still have a few kinks, so representatives couldn't show it pumping all those pixels to nearby HDTVs -- though we did get a butter-smooth demo of Futuremark's old Cyber Samurai benchmark running on the smaller screen. There are still rumors of this chip hitting some products late this year, but next year is much more likely. Either way, we're expecting some pretty impressive benchmarks from this thing when it inevitably winds up in the next Galaxy Tab or a flagship phone of some sort. %Gallery-107245%
Caption Contest: NVIDIA CEO flaunts tattoo on stage, still serving cans of whoop-ass
Oh sure, NVIDIA might not have had any physical chips to show off at the GPU Technology Conference earlier this week, but CEO Jen-Hsun Huang did have one very, very special exhibit up his sleeve. Paul: "And below the logo is a picture of all the shipping devices running Tegra 2." Don: "Here are the new logo designs we've been working on, Mr. Huang." Ross: "Take a cue from Peter Moore and go with temporary. You never know where you'll be in even just a few years' time." Chris: "Huang's Boxee Box tramp stamp, of course, would remain a secret." Joanna: "And this is why I hate gun, er GPU shows." Darren: "Whatever. At least it's not a Zune tattoo." Richard Lai: "Yo Intel, this is how embedded is done." Vlad: "Jen-Hsun's displays of support for Notion Ink are starting to get out of hand..."
NVIDIA CEO: Tegra 3 almost done, Tegra 4 on the way, expect a new Tegra annually
Though NVIDIA's GPU Technology Conference is primarily about the applications of GPU computing, CEO Jen-Hsun Huang hasn't shied away from revealing new silicon, and he just promised something quite unexpected to attending press: new Tegra chips. Though the Tegra 2 has yet to leave a single dent on the consumer marketplace -- the Boxee Box famously tossed it out -- Huang told us that not only is a Tegra 3 almost done and a Tegra 4 currently underway, but that we should expect a new Tegra SOC "every single year." Forgive us for being a mite skeptical of the company's ability to attract customers, but the only notches we see on Tegra's belt are the Zune HD... and Microsoft's failed Kin.
Intel plans to shrink its Atom chip circuits to just 15 nanometers, and other glorious tales of wonder
Earlier this week at IDF Intel dropped some very, very tiny news on us... namely that the Atom SoCs will soon include circuits which are 22 and 15 nanometers in size. The smaller, 15 nanometer width is the size of about 60 atoms -- seriously. Intel's processors, which are categorized by the size of their circuitry, are currently 32 nanometers at their smallest. So, we'd say you should be on the lookout for them but... yeah, well, you know where we're going with this.
Intel retires Tunnel Creek codename, debuts E600-series Atom System on a Chip
The light at the end of Intel's Tunnel Creek? The E600-series platform. As expected, this is an Atom-based system on a chip designed for embedded devices, offering up to 2GB of DDR2 RAM, integrated USB and gigabit Ethernet support, plus an Ion-enabling PCIe bus. The processor itself is a 45nm chip available in speeds ranging from .6 to 1.6GHz, too slow to really rock anyone's proverbial socks, but these could make for a some mean little MIDs or perhaps a hot infotainment system for your next-gen Camry.
