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Intel unveils a groundbreaking way to make 3D chips
As it's getting more difficult to cram transistors next to each other in chips, and we near the end of Moore's Law, the only choice is to go vertical. Literally. That's the essence of 3D chip design, and it's the crux of a major Intel announcement this morning: It's developed the first 3D chip architecture that allows logic chips -- things like the CPU and graphics -- to be stacked together. This isn't just a far-flung research project, either. Intel claims we'll see the first products to use Foverus in the second half of next year.
