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  • Julius Blank, chip-making pioneer and Fairchild co-founder, dies at 86

    by 
    Amar Toor
    Amar Toor
    09.26.2011

    Somber news coming out of Palo Alto today, where Julius Blank, the man who helped found the groundbreaking chipmaker Fairchild Semiconductor Corporation, has passed away at the age of 86. The Manhattan-born Blank (pictured third from left, above) began his engineering career in 1952, when he joined AT&T's Western Electric plant in New Jersey. As a member of the engineering group at the plant, Blank helped create phone technology that allowed users to dial long-distance numbers without going through an operator. It was also at Western Electric where he met fellow engineer Eugene Kleiner. In 1956, Blank and Kleiner left AT&T to work at the lab of Nobel Prize-winning physicist William B. Shockley, but departed just one year later (amid to start Fairchild, alongside a group of six other computer scientists that included future Intel Corporation founders Robert Noyce and Gordon Moore. At their new labs, Blank and his peers developed an inexpensive method for manufacturing silicon chips, earning them $1.5 million in capital from a single investor. As the only two with any manufacturing experience, Blank and Kleiner were charged with bringing the dream to fruition -- a task that required them to build the chips from scratch, beginning with the machinery for growing silicon crystals. They succeeded, of course, and in 1969, Blank left Fairchild to start Xicor, a tech firm that Intersil would later buy for $529 million, in 2004. But his legacy will forever be linked to those early days at Fairchild, where, as Blank described in a 2008 interview, he and his colleagues were able to experience the unique thrill of "building something from nothing." Julius Blank is survived by his two sons, Jeffrey and David, and two grandsons. [Photo courtesy of Joan Seidel / AP 1999]

  • Active Book microchip provides hope for exercising paralyzed limbs

    by 
    Ben Bowers
    Ben Bowers
    11.25.2010

    Scientists have been experimenting with muscles and technology to solve both human and robotic mobility issues for years. Now it looks as though a team of researchers from University College London, Freiburg University, and the Tyndall Institute in Cork have made a significant leap forward for paraplegics, thanks to a revolutionary microchip the team has dubbed "Active Book." What's notable about the chip is that it stimulates more muscle groups than existing technology without the need for external connections. This was accomplished via micro-packing and precision laser processing, which allowed tiny electrodes to be cut from platinum foil and rolled into a 3D book shape. These platinum foil "pages" close in around nerve roots, and are micro-welded to a hermetically sealed silicon chip. Once embedded into areas within the spinal canal, the chip can work to stimulate paralyzed muscles, implying patients could even "perform enough movement to carry out controlled exercise such as cycling or rowing." A press release from the Council which sponsored the research says the Active Book will begin trials sometime next year -- we can't wait to see the results.

  • Silicon chips get speed boost with a lead start

    by 
    Ross Miller
    Ross Miller
    07.20.2010

    In tennis, the materials of the tennis court affect the performance of the ball. Such is the case, on a much, much smaller scale, for electron movement across circuitry. Silicon chips give resistance that lowers the speed limit, while atom-thick sheets of carbon (a.k.a. graphene) have a special property whereby free electrons are almost weightless and can travel up to 0.003 times the speed of light -- sounds great, but it's hard to produce in bulk. Cut to Han Woong Yeom and Pohang University of Science and Technology in South Korea. His team has added a thin layer lead on a silicon chip, lowering the electron mass (and thus proportionally raising its speed) to 1/20th compared to standard silicon. Still a ways to go for graphene speeds -- by a factor of three, according to Yeom -- but it's also more likely to mass production.

  • MIT researchers cram optical circuitry on a silicon chip

    by 
    Darren Murph
    Darren Murph
    02.14.2007

    It looks like MIT is raising the bar yet again, as this time it's taking a break from crafting autonomous UAVs and stackable vehicles to cram optical circuitry on your everyday silicon chip. In an effort to "integrate the optical circuitry with electronic circuitry" on the same silicon wafer, researchers have devised a method which will harness the "enormous power of light waves in networks" while offering up a way to manufacture the circuitry cheaply. The crew has reportedly already been playing around with a working prototype, and suggests that it could eventually "redefine how optical networks are built." Moreover, the development addresses the existing "signal weakening over distance" issue in fiber optic transmissions by "splitting the light beams as they pass through a circuit, rotating one of the polarized beams, and finally rejoining them on their way out of the circuit, which retains the signals' strength." While there's no projection of when this technology could actually hit the mainstream, anything that makes it less expensive to rollout FiOS (and similar networks) to more people most definitely has our vote.