There are minor differences between a processor package with two cores on a single unified die where there is some level of inter-core connectivity and sharing of resources (L2 or L3 cache, FSB) and one where two single core dies were "fused" together in the same package but function more like a SMP system (though in a single package, sigle socket solution). SMP (DP or 4-8 way) is only available from Xeons in Inteldom. For AMD it's the Opteron (2xx, 4xx, 8xx). If Apple knew of the predicted "Core 2 duo" performance/Mhz and performance/Watt when they decided the switch - They made a wise choice, but a risky one, as Intel might have not delivered as expected or timely...
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There are minor differences between a processor package with two cores on a single unified die where there is some level of inter-core connectivity and sharing of resources (L2 or L3 cache, FSB) and one where two single core dies were "fused" together in the same package but function more like a SMP system (though in a single package, sigle socket solution).
SMP (DP or 4-8 way) is only available from Xeons in Inteldom. For AMD it's the Opteron (2xx, 4xx, 8xx).
If Apple knew of the predicted "Core 2 duo" performance/Mhz and performance/Watt when they decided the switch - They made a wise choice, but a risky one, as Intel might have not delivered as expected or timely...