It's been a tick since anyone 'round these parts has taken Peltier cooling seriously, but sure enough, North Carolina-based Nextreme Thermal Solutions is giving us reason to spark that conversation up once more. Its Ultra-High Packing Fraction (UPF) OptoCooler module utilizes "thin-film thermal bump technology at its core," essentially enabling it to be "integrated directly into electronic and optoelectronic packaging to deliver more than 45°C of cooling." Initially, the outfit hopes to have its product embedded within LED packages to "control temperatures and maintain proper operating conditions," and while we'd certainly be more awestruck if these were headed straight for microprocessors of some sort, we've all ideas Nextreme's already working on that endeavor.

[Via Slashdot]