I'm just guessing but, I think that's why Lenovo is only using SSD's in their X300 and a slower processor. ...they can't possibly create enough airflow to vent out such a small space. If you read the Lenovo engineering blog, they talk about how much effort went into the creation...it's pretty interesting.
I've got my doubts about an ultra-thin laptop being able to handle a 2.0+gHz processor with today's current cooling solutions...
One of the first "tear apart" articles stated that fact, which is entirely incorrect. The inside of the bottom aluminum piece is coated with an insulating plastic above the heatsink, as well as the logicboard under the heatsink is coated.
Now that we've thrown 'em off the trail, use the form below to get in touch with the people at Engadget. Please fill in all of the required fields because they're required.
Shouldn't Apple wait to "push well past the 2.0GHz mark" until they fix their overheating issues with the Macbook Air?
That's already taken care of, All you need to do is install a copper plate, yes, I did... and I love it!
Doesn't that void your warranty?
I'm just guessing but, I think that's why Lenovo is only using SSD's in their X300 and a slower processor. ...they can't possibly create enough airflow to vent out such a small space. If you read the Lenovo engineering blog, they talk about how much effort went into the creation...it's pretty interesting.
I've got my doubts about an ultra-thin laptop being able to handle a 2.0+gHz processor with today's current cooling solutions...
Warranty died when I put in the EVDO card, so it's all fun and games until I short something out!
I've heard the body itself of the Macbook Air is part of the cooling system, hence the reason the notebook gets hot.
One of the first "tear apart" articles stated that fact, which is entirely incorrect. The inside of the bottom aluminum piece is coated with an insulating plastic above the heatsink, as well as the logicboard under the heatsink is coated.
You'll find a brilliant article here:
http://techon.nikkeibp.co.jp/english/NEWS_EN/20080306/148608/?ST=english_PRINT