We've seen some big names working on 32nm
chips, and now we can add two more to the mix. According to Nikkei, Panasonic and Renesas have recently developed technology necessary to mass produce the little guys, using metal oxide film (instead of a silicon material) for the insulating layer and titanium nitride for the conducting layer. This has allowed the chips to consume less power, so the 32nm chips operate comparably to their 45nm
siblings. Look for a street date sometime in 2011 -- but considering that Toshiba, IBM and others have set a target date of 2010 for their 32nm chips, and Samsung and Intel are aiming at 2009, Panny might be showing up to this party a little late.