The next-generation of consoles has finally and fully arrived here at E3, and the companies building the Xbox One, PS4 and Wii U are doing their best to differentiate their consoles from the competition. However, there is a common thread that connects them under the hood: AMD silicon. Naturally, we wanted to know more about the process of building chips for these next gene consoles. So, we spoke with AMD VP Saeid Moshkelani -- who heads up the Semi-Custom Business Unit that built those SoCs -- to get the inside scoop.
Moshkelani wouldn't get into the details of the differences between the chips he built for the consoles. Instead, he talked about how AMD developed custom silicon for each and the necessity of secrecy in the process. In fact, Sony, Nintendo and Microsoft had no idea that they were each going to the AMD well to get silicon for their next-gen platforms until they were announced. So, head on down past the break to hear Moshkelani discuss what it's like working with the big three and AMD's role in making next-gen gaming a reality.
- Key specs
- Reviews • 85
- Game format Optical disc, Downloadable
- Online features Multiplayer, Voice chat, Video chat, Store, Browser
- Drive capacity 500 GB
- Controller type Wired, Wireless
- Motion controls Accelerometer, Gyroscopic, Camera / optical
- Video outputs HDMI
- Weight 6.17 lb
- Released 2013-11-15
Nintendo Wii U
Microsoft Xbox One