Novel Concepts is probably just hopping on the "stop the overheating
" bandwagon, but nevertheless, the firm's latest, um, novel idea is to eliminate those bulky, air-sucking PC fans
by creating an ultrathin heat spreading material to coat toasty parts. Dubbed IsoSkin, the material comes in at just 500-microns thick, and the company insinuates that it could eventually be used to replace the "outer skin of portable electronics," further doing away with the need for internal heatsinks and fans. Notably, the sheets are purportedly able to "dissipate heat
20 times more effectively than copper," or transferring about 250-watts, while weighing in 60-percent lighter than the material it hopes to leapfrog. Utilizing planar capillary technology, the IsoSkins could reportedly be "manufactured for pennies per square centimeter," and considering that several microprocessor and electronics companies are already testing this stuff out, maybe the next wave of lappies won't require firefighter-grade pants
to use safely.