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AMD announces next-gen Radeon HD 7970 for $549, says it 'soundly beats' rivals
A fresh contender for your blow-out 2012 Olympic gaming rig: AMD's first 28nm GPU, the Radeon HD 7970. It's scheduled to arrive on January 9th, priced at $549 -- nearly $200 more than its direct ancestor, the 6970. Then again, this newcomer packs some supremely athletic specs, including a 925MHz engine clock that can be readily OC'd to 1.1GHz, 2,048 stream processors and an uncommonly muscular 384-bit memory bus serving 3GB of GDDR5. At the same time, AMD hopes to make the card more practical than the dual-processor 6990 by bringing the card's power consumption down to less than 300W under load and a mere 3W in 'long idle' mode, and promising quieter cooling thanks to improved airflow and a bigger fan. We'll have to wait for benchmarks in January before we hand out any medals, but in the meantime NVIDIA's forthcoming 28nm Kepler GPU might want to step up its training schedule. Update: Pre-release reviews are out already and our round-up will follow imminently.
Apple's A6 processor may come courtesy of TSMC, Samsung left to wonder why
Apple's fondness for anorexic handhelds knows no bounds, and if this alleged deal with the Asian foundry holds water, expect to see its waistband tighten further. Rumoured back before the iPad 2 launch, the house-that-Steve-built's reportedly been eyeing Taiwanese Semiconductor Manufacturing Corp to produce an 'A6' for its upcoming iPhone refresh. While it's easy to dismiss this purported move as a direct diss to Samsung, what's more likely is that Cupertino's engaging in a competitive bit of size does matter -- specifically, the A5's 45nm process. A transition to newer, lower power 28nm ARM chips would give Jonathan Ives' employer a distinct market advantage, dwarfing even TSMC's current 40nm in the process. While it's all still just speculation for now, only time and an iPhone 5 tear-down will tell for sure.
Qualcomm teases 28nm dual-core Snapdragons, pixel-punching Adreno 300 GPU
By the time Qualcomm's 1.5GHz QSD8672 Snapdragon finally makes it to market, it might be obsolete -- the company just announced that the new 28nm dual-core MSM8960 system-on-a-chip will have five times the performance and consume 75 percent less power than the original Snapdragon when it arrives in 2011. It's got the usual WiFi, GPS, Bluetooth and FM radio modules but also a multi-mode LTE / 3G modem too, and reportedly four times the graphical muscle on board. Speaking of graphics, Qualcomm separately took the time to detail a new GPU: the Qualcomm Adreno 300 series, which will allegedly offer the gaming performance of an Xbox 360 or PS3. We'd say "We'll believe it when we see it," but that would imply doubt -- the reality is that we just want to feast our eyes on mobile gaming bliss as soon as humanly possible. [Thanks, PhineasJW]
Globalfoundries takes ARM Cortex-A9 into 28nm land, looks forward to 20nm chips in 2013
Forget the numbers, here's what matters: Globalfoundries' new production capabilities will lead to "smooth production ramp-ups and faster time-to-market" for its customers. Now consider that this promise relates to scrumptious 28nm Cortex-A9 SOCs and feel free to rejoice. The chip fabricator has just declared itself ready to take orders for ARM's systems-on-chip built using its high-k metal gate 28nm fab process. This fulfills its pledge for mass production in the latter half of 2010, but lest you think Globalfoundries is resting on any nanoscale laurels, it also has a 20nm roadmap to tell you about. It's very simple, really: expect even smaller, even more power-efficient silicon in 2013. We don't know if the future will be bright, but it sure looks like it's gonna be small.
ARM and TSMC team up for tinier 20nm Cortex SOCs
It's no secret that ARM ideas are powering much of the mobile revolution these days, but the company doesn't print its own systems-on-a-chip, that duty gets outsourced to silicon foundries -- like TSMC, who just got all buddy-buddy with the firm to transition future smartphone chips to the 28nm and obscenely tiny 20nm high-k metal gate processes. (We're not sure what this means for GlobalFoundries, who had a similar deal earlier this year.) As per usual with a die size reduction, ARM chips will see higher speed and have decreased power consumption, but since 20nm is (relatively) unexplored territory it could be years before chips hit the market. PR after the break, or hit the more coverage link for further explanation by an ARM VP of Marketing.
TSMC begins construction of new $9.3b foundry, wants to sate our constant hunger for chips
TSMC might not necessarily be a household name, but the product of its labors tends to be all over home electronics. Aiming to keep that trend going, the Taiwanese chipmaker has just broken ground on its third 300mm wafer plant, located in Taichung's Central Taiwan Science Park. The new Fab 15 will have a capacity of over 100,000 wafers per month -- earning it the prestige of being described as a Gigafab -- and once operational it'll create 8,000 new skilled jobs in the area. Semiconductors built there will also be suitably modern, with 40nm and 28nm production facilities being installed, and lest you worry about such trivial things as the environment, TSMC says it's doing a few things to minimize the foundry's energy usage and greenhouse gas emission. Then again, if you're going to spend nearly $10 billion on something, would you expect anything less?
ARM and Globalfoundries partner up for 28nm Cortex-A9 SOCs, invite great expectations
This one slipped the net during the excitement that was MWC this year, but it's such a promising development that we have to give it its due attention. ARM and Globalfoundries have announced plans to start building new systems-on-chip using the latter's ultramodern 28nm high-k metal gate production process, with the resultant chips offering up to 40 percent greater computational power, 30 percent greater power efficiency, and a terrific 100 percent improvement in battery longevity relative to their current-gen siblings. Mass production of these Cortex-A9-based units is expected in the second half of 2010, which means they should be among the very first chips off Globalfoundries' 28nm assembly line. The good news, though, is that the technology is described as "ready for high-volume implementation," so there should be no shortages when things finally get rolling. Let the wild-eyed anticipation begin.
Nanometer wars heat up, Toshiba and Intel enter unofficial race
Think the megapixel race is bad? Now we've another to worry about, with both Toshiba and Intel hastily approaching 0.01nm technology in order to make chips faster, more nimble and smaller. According to undisclosed sources at Digitimes, Intel has actually canned production plans for its 45nm Havendale processors, which were originally slated to slip into machines later this year. The cause? It's heading straight to 32nm, reportedly hoping to ship its Clarkdale line in Q1 2010 with entry-level prices ranging from $60 to $190. In related news, Toshiba is joining the likes of IBM, Samsung and Globalfoundries in an effort to dish out chips based on 28nm process technology. Needless to say, the move is being made in an effort to "stay relevant in an area dominated by the likes of Intel Corp and Texas Instruments." Now, if only we could get one of these potent, low-power chips inside of a netbook, we'd be pleased as punch.Read - Intel cans Havendale in move to 32nmRead - Toshiba speeds to 28nm
NEC and Toshiba hop on IBM's Semiconductor Alliance train for the ride to 28nm
IBM seems seriously intent to beat Intel to the tiny, 28nm processor punch, and has enlisted even more help to get there first. After securing deals with Samsung, Globalfoundries, and a few other merry chipmakers in April, NEC and Toshiba are now joining in on the Semiconductor Alliance fun to create next-generation processors before the biggest name in current-generation processors. Goals are smaller footprints, lower power consumption, and of course greater performance. Mind you, that greater performance is still likely two years away from anything we can hope to buy.
IBM, Samsung, Globalfoundries, and more looking to beat Intel to 28nm market
Sure, Intel's one-upping AMD in the 32nm department, but IBM and its merry band of Technology Alliance members -- including Samsung, STMicroelectronics, and AMD chipmakers Globalfoundries -- are looking to ramp up the competition and develop even smaller, low power 28nm processors before Intel gets a chance to size down. The group additionally promises migration plans for companies who've got 32nm on their roadmap and want to maybe shrink a few of the later, already planned models. Early risk production for the 28nm chips are planned for second half 2010, which means it's very unlikely we'll be seeing them in consumer gadgets until at least 2011.
