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NVIDIA confirms Intel chipsets won't support USB 3.0 until 2011
What was once an unverifiable rumor from an anonymous source has now, sadly, become a confirmed fact. Intel won't be integrating USB 3.0 support into its chipsets until at least 2011. Motherboard makers such as ASUS can still opt to add discrete 3.0 controllers at an extra cost, but Intel -- already accused of dragging its heels on the standard's development -- won't be. NVIDIA spokesman Brian Burke has expressed, in no uncertain terms, his company's disappointment with Intel, while also claiming that chipsets by NVIDIA are more feature-rich and just plain better than Intel's own efforts. We'll add this to our ever-growing collection of things NVIDIA doesn't like about Intel, but we also hope that the immature outburst doesn't obscure the real issue. NVIDIA is correct in noting that Intel needs competition in the chipset space, and the new interconnect's dependence on Intel's whims demonstrates the market-altering powers that reside in Santa Clara, CA. Unless another chipmaker gets serious about competing with Intel, we could face plenty more of these seemingly arbitrary delays in tech rollouts.
NVIDIA dropping 790i mobo, quitting chipset business?
We don't take much stock in Digitimes rumors, but the negative chatter about NVIDIA just keeps getting louder -- in addition to that nasty defective GPU situation, word is that problems with the nForce line might lead the company to exit the chipset business entirely. According the Inquirer, mobos based on the high-end 790i line have already been pulled by several manufacturers, including Foxconn and Gigabyte, and apparently NVIDIA is asking motherboard makers if it should stay in the chipset game at all and getting lukewarm reactions. Of course, NVIDIA was talking about taking Intel head-on just a few short months ago, so it would be backing down pretty hard if it went back to just making GPUs -- not to mention that SLI would essentially die without mobo support and platform initiatives like Tegra would lose tons of momentum. We seriously doubt that the situation is that dire, but right now NVIDIA needs to come out and take control of this mess -- where are all the trash-talking execs now?Update: NVIDIA says the rumors are groundless and that its chipset business is as "strong as it ever has been," and that the 790i chipset is still being made. That's that, we suppose -- but until NVIDIA comes right out and explains what's going on, these types of rumors aren't going away. Read - Inquirer report on 790i chips being discontinued Read - Digitimes report on chipset rumors
Rumor: Next Xbox 360 chipsets are Opus, Valhalla
We know it's a little weird to be pumped for Xbox 360 chipsets, but we here at Joystiq HQ are all pretty excited about "Jasper". When we see each other in the halls we'll often exchange a look and we don't even need to speak it, we just know: It's Jasper. Now, if Jacob Metcalf (the guy who broke the Bungie/Microsoft split story) is right, we'll have to start exchanging an additional two looks for the upcoming "Opus" and "Valhalla".The first, "Opus" is basically a third-generation ("Falcon") board built to fit first generation ("Xenon") cases, primarily for the recycling of red-ringed systems, giving them cooler, more dependable guts (though no HDMI). The second, "Valhalla", is rumored to combine the 65nm CPU and 65nm GPU into one awesome super chip. It would only require one cooling system, meaning Valhalla would be quieter and (one would hope) more dependable. It would also be considerably cheaper.Both chips (again, if Metcalf is on the money) are a ways off, with Opus coming in 2008 or 2009 and Valhalla following a year later. As excited as we are for the new builds (even though our eyes are getting sore from exchanged looks) we'll be happiest if this news means Microsoft won't euthanize the 360 as quickly as its predecessor.
Broadcom wins major injunction against Qualcomm
In the latest major twist in this epic battle between wireless chipmakers, a US District Judge has slapped a permanent injunction on any products containing those Qualcomm 3G chips ruled to be infringing on Broadcom's so-called '686 patents. Not only can Qualcomm no longer offer infringing devices nor the chips themselves in the US, the retroactive nature of the ruling means that the company can't even provide service or technical support for '686 products already on the market. At this point, with a voluntary licensing agreement seemingly off the table, the next move for Qualcomm is establishing a plan of action to show Judge James Selna how it plans to redesign its products into compliance. [Warning: PDF link][Via Reuters]
Intel poised to unveil new UMPC platform?
If slides released today by hardware site HKEPC turn out to be accurate, Intel is preparing to launch a new UMPC platform and CPU on the 18th that promises a much smaller footprint than the current architecture while almost doubling the devices' battery life. Known only by its codename "McCaslin," the chipset will reportedly occupy a space of 975 square millimeters (as opposed to the relatively enormous 2915 square millimeters of today's models) and feature power-sipping 600MHz and 800MHz processors known as "Stealey" that are targeting four to five hours of run time. Also sporting additional comm ports for devices such as GPS, 3G, and DTV, McCaslin is said to be Intel's response to Via's small form factor C7M, which has been adopted into models like Samsung's Q1 and continues to provide advantages over offerings from Santa Clara. Hit the Read link for a few more deets and another slide, and obviously stay tuned, as this rumor should be validated or debunked within a matter of days.[Via The Inquirer]
