supercomputing
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US Air Force orders up 2,200 more PS3s -- for thinking, not gaming
We were as surprised as anyone when the USAF threw down the cash for 300-odd PlayStation 3s back in March of last year, but what's more shocking is that it's now back for more -- seven times more, in fact. Already employing its PS3 cluster for research into high-def video processing, the Air Force Research Lab wants to expand its capabilities significantly and it seems that Sony's Cell processor is still its weapon of choice. We would use this opportunity to make a few jibes about lazy engineers upgrading their setups in time for Modern Warfare 2, but we're better than that. We'll also totally avoid noting that the US government's skimping on costs now is leading it to commit to an instruction set tailored specifically to the Cell processor, which contrary to the latest Xeons -- pricier though they may be -- is not guaranteed to keep updating in pace with the USAF's needs. Those are things we'll leave for someone who isn't afraid of death lasers and autonomous attack drones to say.
IBM PowerXCell-8i processor said to be last of its kind, but Cell will live on
IBM's Cell processor may have helped break a few records and find its way into everything from video game consoles to TVs at the same time, but it looks like things could be about to change in a fairly big way for Big Blue's groundbreaking chip. According to Heise Online, IBM Vice President of Deep Computing David Turek has confirmed that the company's current PowerXCell-8i processor will be the last of its kind, and that there will not be a successor with dual PowerPC processors and 32 SPEs as originally planned. Slightly less clear, however, is the future of the Cell program in general, which will apparently live on in "another form" -- to which Turek reportedly added, somewhat vaguely, "the future is hybrid," although we're fairly certain he's not talking about cars.
NVIDIA Tesla 20-series GPUs promise to dramatically cut supercomputing costs
Sure, you've been hearing NVIDIA toss around names like CUDA, Fermi and Tesla for what seems like ages now, but we're guessing this is the sort of thing that'll get most folks to really take notice: a promise to cut supercomputing costs by a factor of ten. That rather impressive feat comes courtesy of the company's new Tesla 20-series GPUs, which come in the form of both single GPU PCI-Express Gen-2 cards and full-fledged GPU computing systems, and promise a whole host of cost-saving benefits for everything from ray tracing to 3D cloud computing to data analytics. Of course we are still talking about "cheap" in supercomputing terms -- look for these to run between $2,499 and $18,995 when they roll out sometime in the second quarter of 2010.
Shall we play a game?
When you think of a rapidly developing Asian nation, fast becoming a global superpower and now harnessing the potential of supercomputing, what's the first purpose for this supercomputer that comes to mind? Hint: think video games, not war games. Regardless of your first thought, we're betting you wouldn't have guessed "World of Warcraft"... but it's true. China's World of Warcraft servers are run by The9, who own Blizzard's distribution rights in the country. "Earlier this year, The9 boasted of hosting more than one million World of Warcraft players online at the same time.To support the complex calculations required to create the game's graphics, The9 owns more than 10 supercomputer systems," Ashlee Vance reports for The New York Times.
Researchers tout breakthrough in single chip parallel processing
Researchers at the University of Maryland's A. James Clark School of Engineering have developed a prototype of what they say could be the "next generation" of personal computers, one that's apparently 100 times faster than current desktop PCs. That considerable feat was made possible though the use of parallel processing on a single chip, in this case, cramming 64 processors onto a circuit board the size of a license plate. Just as importantly, the researchers also developed the necessary software to ensure all that computing muscle gets along, which they say makes the system "feasible for general-purpose computing tasks" for the first time. They don't appear to be content with things just yet though, saying that the same principles could one day be applied to systems with 1,000 processors on a chip the size of a finger nail.
Xilinx, Altera showing off FPGA coprocessors at IDF
While Field Programmable Gate Arrays (FPGA) haven't benefited from a good deal of buzz just yet, things could be taking a turn, as both Xilinx and Altera caught a few eyes at IDF. We've already seen the unique, albeit highly specific chips in a supercomputer, but the dedicated coprocessor / accelerator modules could be landing beside your Intel Xeon CPU. Essentially, the devices plug "directly into the processor socket of dual- or quad-socket servers" in order to provide "high performance application acceleration ranging from 10x to 100x compared to processors alone, while simultaneously reducing overall system power consumption." The modules act as targeted CPUs, effectively computing very specific tasks in a much more efficient fashion than a general microprocessor can alone, which could boost the speed of scientific, financial, and life science applications that rely on very particular calculations. Of course, mainstream adoption still has quite a ways to go, but the quicker we get dedicated physics and AI coprocessors to go along with these snazzy new GPUs, the happier (and poorer) we'll be.[Via RobotSkirts]Read - Altera demonstrates FPGA at IDFRead - Xilinx demonstrates FPGA at IDF
IBM pushing vertical stacking in next wave of supercomputers
Next-generation cooling technology isn't the only thing IBM's R&D crew is spending time with, as the chip giant has recently made plans to hit up "vertical stacking technology" in order to make the next wave of supercomputers really crank. Supposedly, "laying chips vertically -- as opposed to side by side -- reduces the distance data has to travel by 1,000 times, making the chips faster and more efficient." The new format will place chips directly atop one another and connect them with "tungsten filled pipes etched through the silicon," which will subsequently eliminate the need for wires and increase the speed at which data can flow. The questionably-dubbed "3D chips" will reportedly operate around 40-percent more efficiently than existing renditions, and considering that Intel is purportedly cooking up a similar agenda in their own labs, that "end of 2007" release date is quite likely to be accurate.
