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Intel Silvermont: next-gen mobile CPU's three times as fast and more energy efficient
ARM's long been the dominant form of silicon in mobile devices, but Intel aims to change that with its next-generation Atom chip design codenamed Silvermont. According to Intel, the new architecture will enable CPUs that operate at up to three times the speed of existing models, while (in some cases) also offering chips that sip just one-fifth the amount of electricity to get computational jobs done. The keys to those improvements are Intel's 22nm process and Tri-Gate transistors tuned for SoCs. While Silvermont was designed with mobile in mind, the architecture supports up to eight cores and will find its way into data centers and Ultrabooks in addition to phones and tablets. When? Intel's not telling yet, but rest assured when Silvermont shows up in an actual product, we'll be there to put it through its paces.
Intel talks up work on 22nm SoCs with Tri-Gate tech geared for mobile devices
Now that Ivy Bridge processors with Tri-Gate tech are in the wild humming away inside PCs, Intel's used the 2012 International Electron Devices Meeting to discuss its work on SoCs that also use the 22-nanometer 3D transistor tech. The processor giant didn't rattle off much in the way of specs or name the product lines that'll make use of the mobile-centric silicon, but it expects the hardware to handily outperform its 32-nanometer SoCs by 20 percent to 65 percent. Ballpark estimates on price are also MIA, so it's still unclear how the folks in Santa Clara will fare against ARM-based solutions with the new chips under their belts. In any case, Intel anticipates the fresh components will find their way into smartphones and tablets once they're ready to roll. [Image credit: huangjiahui, Flickr]
Intel's Ivy Bridge will offer '20 percent more performance with 20 percent less average power'
So, there's still a little while to go before Intel gives Ivy Bridge a full unveiling, with official benchmarks, pricing and all those trimmings. But in the meantime, the BBC has detailed just how different this new architecture is compared to 32nm chips like Sandy Bridge and also AMD's coming Trinity processors. Most of this stuff we already knew -- like the fact that Intel has switched to a 3D or 'tri-gate' transistor design -- but what's new is a direct and official boast about performance. According to Kirk Skaugen, Chipzilla's PC chief, we can expect Ivy Bridge to deliver "20 percent more processor performance using 20 percent less average power." Now, judging from leaked desktop and laptop benchmarks, this broad-brush claim masks some very different realities depending on what type of CPU or GPU workloads you want throw at the chip, so stay tuned for more detail very soon.
Intel plans exascale computing by 2018, wants to make petaflops passé
Sure, Fujitsu has a right to be proud of its K supercomputer -- performing over 8 petaflops with just under 70,000 Venus CPUs is nothing to sneeze at. Intel isn't giving up its status as the supercomputing CPU king, however, as it plans to bring exascale computing to the world by the end of this decade. Such a machine could do one million trillion calculations per second, and Intel plans to make it happen with its Many Integrated Core Architecture (MIC). The first CPUs designed with MIC, codenamed Knights Corner, are built on a 22nm process that utilizes the company's 3D Tri-Gate transistors and packs over 50 cores per chip. These CPUs are designed for parallel processing applications, similar to the NVIDIA GPUs that will be used in a DARPA-funded supercomputer we learned about last year. Here we thought the war between these two was over -- looks like a new one's just getting started. PR's after the break.
Intel will mass produce 3D transistors for all future CPUs, starting with 22nm Ivy Bridge (video)
Looks like 3D isn't just a fad, folks, so long as we're talking about silicon -- Intel just announced that it has invented a 3D "Tri-Gate" transistor that will allow the company to keep shrinking chips, Moore's Law naysayers be darned. Intel says the transistors will use 50 percent less power, conduct more current and provide 37 percent more speed than their 2D counterparts thanks to vertical fins of silicon substrate that stick up through the other layers, and that those fancy fins could make for cheaper chips too -- currently, though, the tri-gate tech adds an estimated 2 to 3 percent cost to existing silicon wafers. Intel says we'll see the new technology first in its 22nm Ivy Bridge CPUs, going into mass production in the second half of the year, and it's planning 14nm chips in 2013 and 10nm chips in 2015. Also, 3D transistors won't be limited to the cutting edge -- Intel reps told journalists that they "will extend across the entire range of our product line," including mobile devices. Three videos and a press release await you after the break. Chris Trout contributed to this report.
