Kyocera develops ultrathin FWMG0-03 mobile WiFi module

We've got all sorts of incredibly tiny chips serving very unique purposes, but Kyocera has developed a 10- x 8-millimeter wireless LAN wafer that should feel right at home in those oh-so-cramped innards of certain diminutive mobiles. The FWMG0-03 module comes in at just 1.25-millimeters thick, and provides full support for 802.11b/g protocols; aside from mounting all of the circuity on a single side of the board, compactness has been aided by the low temperature cofired ceramic (LTCC) used, "resulting in an enhanced bending strength of 400 MPa which is approximately double that of the general LTCC." The chip draws just 0.85 milliwatts while in standby, 550 milliwatts when transmitting data, and 291 (802.11b) / 345 (802.11g) milliwatts when receiving. While we aren't sure which cellphone manufactures are vying for batches of these minuscule modules, we do know that a trio of operating voltages will be available when these start "volume production within 2006," and SDIO / SPI will be the supported interfaces.