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Infineon teams with Intel for high-density (HD) SIM cards

Darren Murph

After buddying up with IBM earlier this year on a 32-nanometer semiconductor, Infineon is now teaming with none other than Intel to produce high-density (HD) SIM cards. Announced today at the Cartes Trade Show in Paris, the agreement will spark a "strategic technology collaboration" which will see Infineon producing modular chip solutions while Intel offers up memory capacities from 4MB to 64MB. More specifically, a 32-bit security microcontroller will be provided by Infineon, while the partnership's other half throws in its "leading-edge flash memory technologies, capabilities and manufacturing." Apparently, the HD SIM will play nice with "data-intensive mobile applications, services and over-the-air downloads" which are likely to become more pervasive in the coming years, and current market research shows that these very devices will account for "six- to eight-percent of the total SIM card market in 2010." As for availability, look for samples to land in Q2 of next year, but don't expect 'em to be manufactured en masse until the first half of 2009.

[Via EETimes]

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