Lakefield

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  • Intel Lakefield

    Intel's '3D' Lakefield chips arrive for foldables and ultrathin laptops

    by 
    Devindra Hardawar
    Devindra Hardawar
    06.10.2020

    After years of anticipation, Intel is officially launching its Lakefield mobile processors today, its first chips to combine its Core i3 and i5 hardware together with low-power "Tremont" Atom cores.

  • Microsoft

    Microsoft's Surface Neo will use Intel's next-gen Lakefield CPU

    by 
    Steve Dent
    Steve Dent
    10.02.2019

    The flashiest PC that Microsoft unveiled at its event today has got to be the dual-screen Surface Neo, powered by the new Windows 10 X OS. It turns out that device will be the first one we've heard of to get Intel's next-generation Lakefield processor with a 10-nanometer primary Sunny Cove core, four 10-nanometer "Tremont" cores and Foveros 3D chip stacking technology.

  • Intel at CES 2019: Hybrid chips, AI and Project Athena

    by 
    Cherlynn Low
    Cherlynn Low
    01.10.2019

    Intel had a ton of news to share at CES 2019. From six new ninth-generation Core processors and new 10nm chips to intriguing hybrid architecture, AI processors and 5G networking cards, the company covered a broad spectrum with its launch. It also announced a curious program called Project Athena that's meant to drive innovation in PCs over the next few years, by working with industry partners like components makers and software giants to create new ways to prolong battery life, craft versatile designs and push performance further. The first Athena product is launching later this year. We caught up with general manager of innovation segments Josh Newman to find out how the new chips work, the benefits they bring, as well as Intel's plans for 2019.

  • Engadget

    Intel's Lakefield stacks desktop and Atom cores on a ‘3D’ chip

    by 
    Jamie Rigg
    Jamie Rigg
    01.07.2019

    Intel led its CES press conference today by announcing a lineup of no less than six new 9th-gen processors, but it's looking towards a future beyond these chips, too. The company shed some light on a platform that's still in development, codename Lakefield, which is expected to go into production in 2019. It's a hybrid design featuring a primary 10nm Sunny Cove core, complemented by four 10nm Atom cores. We assume it'll operate like many mobile chips do already, with different cores handling different tasks based on how resource-intensive they are, maximizing efficiency and power.