e-MMC
Latest
Samsung aggressively aggregating acronyms as eMCP assembly activated
Samsung's started foundries rolling for its new embedded multi-chip package memory for budget smartphones -- after the success of the high-end modules that were released in October. eMCP jams together 30-nanometer low-power DDR2 DRAM and 20-nanometer NAND flash memory into a single slice of silicon. In real terms, this means that there's a 4GB e-MMC (embedded MultiMediaCard) flash chip with a 256MB, 512MB or 768MB DDR2 DRAM module bolted on the side. According to the company, it'll consume 25 percent less power with 30 percent better performance, cost less to jam into your telephone and probably make you smell better, too. If you're starting your own phone company, or just curious about embedded systems, head past the break for the PR.
Toshiba cooks up 128GB NAND flash for next-gen phones and PMPs
Leave it to Toshiba to make even the latest smartphones feel somewhat undernourished. Quadrupling the current high-end standard of 32GB of embedded memory, the Japanese company has announced an all-new 128GB slab of storage, built on a 32nm production process. It's somehow managed to fit sixteen 8GB NAND chips, plus their controller, inside a 1.4mm tall structure, and samples are about to exit the factory doors this September. A 64GB variant will also be making an appearance, with both scheduled to enter mass production sometime during the fourth quarter. Should go pretty nicely with that 2GHz beastphone Moto is planning, don't you think?
