VerticalStacking
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Ex-Seagate CEO joins startup Vertical Circuits, learns secret of the silver, gadget-shrinking ooze
Bill Watkins, the oft-outspoken former CEO of Seagate, has thrown his support behind tech startup Vertical Circuits, who claim to have an uncanny knack for shrinking gadgets with the power of voodoo -- or rather, a patented silver ooze, but we prefer our theories. The goo works as a replacement for gold wires to connect vertically stacked chips, cleaning up the internal cable clutter and leaving more room for better processor, bigger batteries, larger displays, or just a tinier form factor. Right now the focus is on stacking flash memory, but the group says they can use the same technique for processors and other chips. At this stage, there's no product or partnership to show for it, but if they're as good as they say, we hopefully won't have to wait long to see the fruits of their labor.
IBM pushing vertical stacking in next wave of supercomputers
Next-generation cooling technology isn't the only thing IBM's R&D crew is spending time with, as the chip giant has recently made plans to hit up "vertical stacking technology" in order to make the next wave of supercomputers really crank. Supposedly, "laying chips vertically -- as opposed to side by side -- reduces the distance data has to travel by 1,000 times, making the chips faster and more efficient." The new format will place chips directly atop one another and connect them with "tungsten filled pipes etched through the silicon," which will subsequently eliminate the need for wires and increase the speed at which data can flow. The questionably-dubbed "3D chips" will reportedly operate around 40-percent more efficiently than existing renditions, and considering that Intel is purportedly cooking up a similar agenda in their own labs, that "end of 2007" release date is quite likely to be accurate.
