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Harvard makes distortion-free lens from gold and silicon, aims for the perfect image (or signal)
Imaging has been defined by glass lenses for centuries, and even fiber optics haven't entirely escaped the material's clutch. Harvard's School of Engineering and Applied Sciences might have just found a way to buck those old (and not-so-old) traditions. A new 60-nanometer thick silicon lens, layered with legions of gold nanoantennas, can catch and refocus light without the distortion or other artifacts that come with having to use the thick, curved pieces of glass we're used to -- it's so accurate that it nearly challenges the laws of diffraction. The lens isn't trapped to bending one slice of the light spectrum, either. It can range from near-infrared to terahertz ranges, suiting it both to photography and to shuttling data. We don't know what obstacles might be in the way to production, which leads us to think that we won't be finding a gold-and-silicon lens attached to a camera or inside a network connection anytime soon. If the technology holds up under scrutiny, though, it could ultimately spare us from the big, complicated optics we often need to get just the right shot.
IBM sees stacked silicon sitting in fluid as the way to power future PCs
Generally, the combination of microchips, electricity and fluids is usually considered an incredibly bad thing. IBM, however, thinks it can combine those three to make super small and super powerful computers in the future. The idea is to stack hundreds of silicon wafers and utilize dual fluidic networks between them to create 3D processors. In such a setup, one network carries in charged fluid to power the chip, while the second carries away the same fluid after it has picked up heat from the active transistors. Of course, 3D chips are already on the way, and liquid cooled components are nothing new, but powering a PC by fluids instead of wires has never been done before. Bruno Michel, who's leading Big Blue's research team, has high hopes for the technology, because future processors will need the extra cooling and reduced power consumption it can provide. Michel says he and his colleagues have demonstrated that it's possible to use a liquid to transfer power via a network of fluidic channels, and they to plan build a working prototype chip by 2014. If successful, your smartphone could eventually contain the power of the Watson supercomputer. Chop, chop, fellas, those futuristic fluidic networks aren't going to build themselves.
TSMC begins construction of new $9.3b foundry, wants to sate our constant hunger for chips
TSMC might not necessarily be a household name, but the product of its labors tends to be all over home electronics. Aiming to keep that trend going, the Taiwanese chipmaker has just broken ground on its third 300mm wafer plant, located in Taichung's Central Taiwan Science Park. The new Fab 15 will have a capacity of over 100,000 wafers per month -- earning it the prestige of being described as a Gigafab -- and once operational it'll create 8,000 new skilled jobs in the area. Semiconductors built there will also be suitably modern, with 40nm and 28nm production facilities being installed, and lest you worry about such trivial things as the environment, TSMC says it's doing a few things to minimize the foundry's energy usage and greenhouse gas emission. Then again, if you're going to spend nearly $10 billion on something, would you expect anything less?
Penn State busts out 100mm graphene wafers, halcyonic dream inches closer to reality
Yes, we've been marching on this road to graphene-based superconductive electronics for a long, long time. But in the space of one week, we've now seen two significant advancements pop up that rekindle our hope for an ultrafast tomorrow. Hot on the heels of IBM's recent bandgap achievement comes Penn State University with a 100mm wafer of pure graphene gorgeousness. Built using silicon sublimation -- a process of essentially evaporating the silicon away from the carbon layer -- these are the biggest graphene wafers yet, and field effect transistors are being built atop them now to start performance testing early this year. Naturally, nobody's sitting on this laurel just yet, with further plans afoot to expand beyond 200mm wafers in order to integrate fully into the semiconductor industry, whose current standard wafer size is around 300mm in diameter. On we go then.
IBM develops greener method for recycling silicon
IBM is looking to save around $1.5 million per year and be a kinder citizen to the environment by instituting a greener method for recycling silicon. Previously, IBM would sandblast defunct wafers to make sure no trade secrets left the premises when they were sold off to solar-panel outfits or used as "monitors." The new process, however, involves defacing the circuitry with an abrasive pad and water, which saves a few bills and leaves the silicon in much better shape for reuse. Reportedly, Big Blue has already implemented the new approach in its Essex Junction, Vermont facility, and the East Fishkill, New York plant is all set to follow suit shortly.
Samsung Wafer now available at Alltel shop
The recently announced Samsung SCH-r510 Wafer -- and at just 8.4 millimeters thin, this moniker is well deserved -- has landed at the Alltel shop, dear friends. This uber svelte XM Radio packin', EV-DO speedin' device has hit the shelves with the anybody-can-afford-it price of $49 dollars. If you aren't happy with just the XM Radio features, the Wafer also packs a memory slot (microSD) for music storage and stereo Bluetooth functionality to listen sans wires. For an entry level device and price, we're loving this tiny feature-packed handset.
Alltel rolls out Samsung "Wafer" and "Snap"
We recall (vaguely) a time when CDMA phones were notoriously clunky compared to their GSM brethren; they were thick, built like tanks, and frequently sported aerial antennas flying shamelessly beyond the hinge. Well, yeah, those days are long gone. Exhibit A: the Samsung SCH-r510 "Wafer" candybar, just introduced by Alltel, clocking in at a ridiculous 8.4 millimeters thick. For the record, that's a solid half millimeter thinner than the A727 being passed around at CES this year, a phone allegedly destined for AT&T that's still nowhere in sight. Besides EV-DO, features include a 1.3 megapixel cam and the soothing knowledge that your carrying the thinnest durned cellphone your Alltel dollars can buy. On the low end, the SCH-u340 "Snap" (known simply as the u340 on Verizon) keeps it simple, offering a monochrome external display and nothing more than 1xRTT to speed those bits along. Look for the Wafer for $70 after rebates and the Snap for $10 -- both on contract, obviously.[Thanks, Jeff]Read - Samsung r510 WaferRead - Samsung u340 Snap
Cheaper blue lasers on the way?
Whether the format war is over or not, one thing that would definitely get more buyers off the fence and owning more high definition players would be lower prices. Aonex Technologies and Kyma Technologies are the latest to announce they've found a better (and cheaper) way to pump out the blue laser diodes necessary in every Blu-ray and HD DVD player. Aonex claims its A-Sapph wafer technology improves on current sapphire based processes, enabling an increase in the number of chips per wafer and improving yields substantially. As fans of lasers in general, and not just in relation to HDTVs and lower prices, we're excited, but without even the hint of an expected release date it will probably be a while before these are ready for the market.
AMD shows off Barcelona server chips, garners mixed reviews
With Intel giving its shareholders some awfully great news to savor over the holidays, AMD had to hit back with some news of its own, but you'll definitely get a different vibe from reading ExtremeTech's take on the firm's recently showcased Barcelona than from the horse's own mouth. While AMD parades its 65nm chip as "the world's first native quad-core x86 server processor," and boasts about its "significant advancements in performance per watt capabilities," we've reason to wonder if things aren't a bit sugarcoated. While the wafer was demonstrated as utilizing "all 16 cores" and being a seamless upgrade from "dual-core to quad-core", hard facts (read: the much anticipated benchmarks) were curiously absent. Aside from injecting onlookers with more of the same technical minutiae we've seen over the past few months, AMD didn't exactly flesh out a lot of new details to chew on, but ExtremeTech's reference system "was the loudest they'd ever had in their office," and sucked down nearly 600 watts of power with just two HDDs and a single graphics card. So while we're firmly withholding judgment until its officially released, we'd say AMD still has a bit of tweaking to do before the competition rolls in.UPDATE: Looks like we mistook the quad-core Opteron and the Quad FX (announced on the same day, nonetheless) chips as one in the same, when (thankfully) they're not, but those eying the recently-released FX-based desktops may want to think about how much noise they're willing to put up with before throwing down on a new machine.Read - AMD Press ReleaseRead - ExtremeTech's Hands-on Testing
Kyocera develops ultrathin FWMG0-03 mobile WiFi module
We've got all sorts of incredibly tiny chips serving very unique purposes, but Kyocera has developed a 10- x 8-millimeter wireless LAN wafer that should feel right at home in those oh-so-cramped innards of certain diminutive mobiles. The FWMG0-03 module comes in at just 1.25-millimeters thick, and provides full support for 802.11b/g protocols; aside from mounting all of the circuity on a single side of the board, compactness has been aided by the low temperature cofired ceramic (LTCC) used, "resulting in an enhanced bending strength of 400 MPa which is approximately double that of the general LTCC." The chip draws just 0.85 milliwatts while in standby, 550 milliwatts when transmitting data, and 291 (802.11b) / 345 (802.11g) milliwatts when receiving. While we aren't sure which cellphone manufactures are vying for batches of these minuscule modules, we do know that a trio of operating voltages will be available when these start "volume production within 2006," and SDIO / SPI will be the supported interfaces.
