Renesas MP5232 SoC promises dual-core processing and LTE connectivity for less cash
There's a trend underfoot to bring high-end smartphone capabilities down to a price that even Joe Sixpack is willing to swill. We saw evidence of this from MediaTek earlier in the week, and now the crew at Renesas is looking to join the race with its MP5232 system on a chip (SoC). This entrant touts a 1.5GHz dual-core CPU, along with HSPA+ and LTE radios on the same chip -- much like offerings from competitors Qualcomm and ST-Ericsson. Renesas estimates that with its SoC, a smartphone can be delivered to the customer for as little as $150 -- mind you, carrier subsidies should be able to swallow the rest. Renesas is also pushing its chip to tablet makers, and expects products with its internals to reach consumers in as little as six to nine months. If you're an OEM (or just wanna pretend), you'll find the full PR after the break.
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Renesas Mobile Introduces First Integrated LTE Triple-Mode Platform Optimised for Full-Featured, High Volume Smartphones
MP5232 Dual 1.5GHz core Communications Processor to Drive LTE Growth with Best-in-Class User Experience for High Volume LTE Smartphones and Tablets
TOKYO, February 15, 2012 /PRNewswire via COMTEX/ -- Renesas Electronics Corporation and its subsidiary, Renesas Mobile Corporation ( http://www.renesasmobile.com ), a leading supplier of advanced cellular semiconductor solutions and platforms, today announced the availability of the MP5232, the first single-chip, high-performance, scalable smartphone platform optimised to address the US$150-300 range device market. The MP5232 platform is designed to enable OEMs to accelerate the creation and delivery of high volume LTE/HSPA+ capable smartphones, tablets and mobile Internet devices the industry requires to deliver the full potential of LTE.
The MP5232 platform sets a new benchmark in terms of levels of integration and performance for fully featured high-volume LTE devices. At its heart, the Renesas Mobile modem, deployed in over two billion devices to date, delivers the industry's highest throughput and low power multi-mode FDD and TDD-LTE Category 4 capabilities. Combined with a state-of-the-art application processor the platform delivers a no-compromise user experience with multi-core computing power, industry-leading graphics, video and imaging capabilities. The platform also includes advanced RF transceivers, power management and audio solutions. This highly integrated smartphone platform is delivered fully tested and certified to enable customers to bring new generations of fully-featured LTE/HSPA+ smartphones to market in as little as six to nine months.
