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Reuters: Sony in talks to sell chip manufacturing to Toshiba
Reuters is reporting that a Sony is in talks to sell its chip production facilities to Toshiba, according to "sources close to the matter." The 100 billion yen (about $870 million) deal is reportedly set to finish in a few months and will include the lines for Sony's PS3-powering Cell processor.Does this mean Sony is giving up on its much-hyped computer-on-a-chip? Not likely -- Reuters says any deal would probably include a Sony/Toshiba joint venture to ensure a steady supply of Cells for Sony systems. The transfer of ownership would provide a cash influx for Sony and probably help Sony cut overhead costs related to staffing and upkeep at the plants.The move isn't totally out of left field for Toshiba, which helped in the development of the Cell chip along with Sony and IBM and has expressed interest in using the Cell in non-gaming devices
HTC to soldier on with Qualcomm chips
Apart from Verizon, it seems that carriers and manufacturers alike have kept a pretty steady stance on Qualcomm's far-from-over spat with Broadcom -- and in light of the most recent ruling allowing Qualcomm customers to ship products containing its chips, that stance may be paying off. HTC is the latest major manufacturer to reaffirm its relationship with the chip maker and patent holder extraordinaire, saying that it intends to release ten new models sporting Qualcomm innards by year's end. Big man Peter Chou himself chimed in on the issue, proclaiming "we are pleased to have a close strategic relationship with Qualcomm and look forward to bringing continued industry-changing devices to market." 'Course, you won't be bringing those industry-changing devices to the US if the court system ultimately rules against your bedfellow, Peter. Just thought you should know.
US Prez upholds Qualcomm chip ban, Verizon snickers
Qualcomm -- a company that's arguably more used to suing than being sued -- isn't finding much luck in its protracted quest to avoid a Broadcom-led ban of its 3G hardware from coming into the States. Following a recent denial of its motion to stay the ban in the court system, the President of The United States himself (or his administration, anyway) has swooped in to render an executive judgment, and it ain't looking any better for Qualcomm. Saying that the importance of protecting IP rights outweighs the inconvenience of the ban, the Bush folks have stood by the ITC's decision to impose the ban in the first place, making it seem all that much smarter now for Verizon to have sidestepped the whole ordeal and paid Broadcom itself. Barring any last minute antics, the ban gets enforced starting tomorrow.
Toshiba set to release best-ever 3D chip for handsets
Wireless handsets are becoming better gaming machines, although we're not seeing PSP-level playability yet on that slim-n-fast handset just yet. Toshiba, though, may want to change that -- and it's announced that a new 3D LSI chip that can render 100 mega-polygons per second to take mobile gaming and realism to the next level. As such, Toshy's new "TC35711XBG" chip is slated to be available to OEMs and ODMs in October. With 38 times the performance of existing solutions, built-in shading and reflectivity and WVGA support, we're chomping at the bit to see what this brings to the handset gaming table soon.
iPhone CPU up close and personal
We've seen a bevy of pics featuring the iPhone's internals, but this set goes a step further and gets us into the action microscope-style. The gents at μblog sliced and diced some poor specimen and discovered that the chip contains both CPU and RAM, and while both have serial numbers, no brand markings can be made out. These pics are rather beautiful in some ethereal, deep-sea way, though aside from blowing them up and draping them on a wall, we're not too sure what else can be done with them. A reader pointed out that the images look like Legend of Zelda maps, though we're convinced they are definitely more Gauntlet-esque. Thoughts?[Via Hacked Gadgets]
AMD readies quad-core Barcelona for August shipment
Those eager to lay down for the "industry's first" native x86 quad-core processor have but a few months left to wait, as AMD just announced that its quad-core Opteron's would begin shipping in August. Codenamed Barcelona, these CPUs will be launching in both "standard and low power versions," hit frequencies of up to 2GHz, and should provide performance increases of up to "70-percent" over existing Opterons in select applications. Additionally, those who can hold off a bit can look forward to even speedier chips in Q4 of this year, and an elusive "Special Edition" version should also be just around the bend. Per usual, no hints on what kind of premium you'll pay for this wee piece of silicon come August, but AMD did note that the processors wouldn't hit mainstream systems until September.
AMD getting out of fabrication?
What do you do when you're always playing catch-up to Intel, watching your workstation market share slip, and piling up something like $2 billion in debt? Well if you're AMD, you seriously consider dropping your fabrication business. According to reports, the company is currently investigating its options for outsourcing more (or all) of its manufacturing to third-party firms in deals similar to the ones it has with Chartered Semiconductor and Taiwan Semiconductor. There are drawbacks, of course, including the possibility of longer development times due to the separation of design and manufacturing (the last thing AMD wants, considering recent Barcelona delay rumors). Regardless of what its final decision will be, it's clear that the news has already hurt the struggling chipmaker in the short-term by causing several market analysts to downgrade the company's stock.[Via Techmeme]
Clock ticking for ITC to justify Qualcomm chip ban
It seems the feds agree with us that a broad, sweeping ban on little morsels of 3G goodness is just flat-out uncool. The US Court of Appeals for the Federal Circuit has turned the proverbial hourglass upside down, giving the US International Trade Commission two weeks to justify its partial halt on the import of devices equipped with 3G chipsets manufactured by Qualcomm. The spat originates over a Broadcom claim that Qualcomm's silicon infringes on its patents, and the court system is interested in hearing why the USITC thinks the ban should remain in place while Qualcomm appeals. Intellectual property issues aside, the ITC's cold-turkey ban stands to have a significant impact on carriers, handset manufacturers, and customers (that's us, by the way) as the selection suddenly dries up -- so at the very least, we're hoping everyone affected has a little more time to get their ducks in a row while the patent suit navigates the legal system (please?).
Intel CEO compares Silverthorne criticality with original Pentium
Intel's been throwing so many mobile processor codenames around in the past 12 months or so that we've resorted to hiring droids to constantly update pivot tables as chips are named and nixed from its ever-evolving roadmap. But being the weekend and all, it looks like we're stuck telling you about yet another presumably vital processor that's likely destined to hit cellphones, UMPCs, and other handheld computing platforms sometime in the not too distant future. According to an interview by Germany's FAZ, Intel's CEO compared the chip "to the original Pentium" in terms of importance to the company, and while Mr. Otellini didn't go into too much detail beyond that (can't blame him for keeping us curious), he did note that the firm hopes the 45nm CPU can infiltrate "10 to 20-percent of the mobile phone market."[Via TGDaily]
Intel talks up 3-Series chipset, Core 2 Extreme CPU for laptops
Shortly after revealing that a quad-core laptop chip was indeed in Intel's pipeline for 2008, the firm has decided to go public with even more laptop-based processor details over at Computex. Intel's executive vice president Sean Maloney had the honors of "unveiling" the 3-Series chipset family (formerly known as Bearlake), which will of course support DDR3 RAM, PCI Express 2.0, HDMI, and can come stocked with G33 / G35 Express integrated graphics. More importantly, the outfit formally introduced plans for an Intel Core 2 Extreme mobile processor that should be released in Q3 of this year. According to Mr. Maloney, the chip is targeted to be the company's "highest-performing mobile dual-core processor that still includes energy-saving power features for laptop designs." No word just yet on whether or not this CPU will cost more than the rest of your laptop components combined (but we wouldn't be surprised).[Via Laptoping]
The future of console hardware design
The next generation has just barely become the new generation, but the folks at Semiconductor Insights are already thinking about what might be under the hood of the next generation of consoles. In an article at TechOnline, SI manager Allan Yogasingam discusses how the focus of system design has tilted from simple cosmetics for the Atari 2600 to "cost, heat [management], cooling and [efficiency] test." in the 30 years since.That cost bit might be the most important -- SI manager Greg Quirk predicts Sony and Microsoft will soon introduce 65 nanometer processors to reduce the costs associated with their current, 90-nanometer-chip systems. Yogasingam also predicts that the drive for cost reduction might lead console makers to look towards "second- and third-tier chip and software vendors " for the next generation. Someone better warn IBM that their gravy train might be in jeopardy. What else is likely to be in the next generation of hardware? The SI team thinks 802.11n wireless, tilt-sensitive MEMS controller sensors and other entertainment features are likely to stay hot, but that's not exactly rocket science. Where are the bold predictions for things like laser cannon attachments and Holodeck-style projectors.
Currently unused component found in Wiimote
Before you go running off to troll post on various message boards, we'd like to give you some specifics. A recent CNN technology feature details some of the various chips and components found within the forty-dollar Wiimote. Among the Bluetooth converters and accelerometers is a component listed as an "audio translator," which "converts analog data such as human speech into a digital data stream. This feature is unused now but will probably be employed in future games." The approximate cost is listed at $2.00.So, what's the deal? First, there is no actual microphone (a device capable of converting vibrational energy into electrical signals) found within the Wiimote. Though basic electrical engineering principals allow a standard speaker to act in such a fashion, the signal quality and frequency response would be unacceptably low. This chip actually requires an expansion device for it to be used at all. So why add it? It's only two dollars, but this rather unnecessary addition has cost the company several dozen million dollars. We can only assume that Nintendo or significant third parties are planning a title utilizing an expansion microphone, which will be presumably cheap enough to bundle with a title and incur no markup in price.God knows the masses need a mainstream karaoke game (we know about Karaoke Revolution for the PS2, but it never really took off), and the Wii is just the system to do it. Like a Virginnnnn ... hey!
Sharp crafts chip with T-DMB and DVB-H support
One of the most fragmented up and coming technologies in the mobile segment appears to be mobile TV. Europe's converging on DVB-H, Korea likes T- and S-DMB, Japan does one-seg, and the US seems to be moving toward MediaFLO. We can't necessarily expect a single device to support reception around the globe any time soon (if ever), but two in one is a good start -- and that'll soon be a reality thanks to a newly-developed chip from Sharp. The so-called VA3B5EZ915 (catchy name, if we do say so ourselves) supports both T-DMB and DVB-H while at the same time setting a new record for minimal power consumption. Theoretically, we guess this means travelers could get reception in both Europe and South Korea, though we're betting the more immediate application will be to unify Europe's few deployed T-DMB networks with the more popular DVB-H format without needing different lineups of phones for both. No word on when we might see the new chip in production handsets.
IBM and friends buddy up on 32-nanometer semiconductor
IBM has most certainly been on a tear of late when it comes to microprocessors, as this tidbit comes right on the heels of the firm's 4.7GHz POWER6 and self-assembling CPUs. Presumably thinking that two five heads are better than one, IBM has garnered support from Chartered, Samsung, Infineon, and Freescale to "develop and manufacture advanced 32-nanometer semiconductors." Of course, we're still not sure if the loose ends surrounding IBM's 65-nanometer team effort are all tied off, but onward and upward they go regardless. The collaborative agreements between the firms "include 32-nanometer bulk complementary metal oxide semiconductor (CMOS) process technologies and joint development of process design kits (PDKs) to support that technology," which basically means that the companies will attempt to work together at IBM's East Fishkill plant through 2010 to produce "high-performance, energy-efficient chips at 32nm." Unfortunately, we've no idea when these speedsters will be ready for the commercial world, but it's pretty safe to assume it won't be soon.[Via PCWorld, photo courtesy of Semiconductor-Technology]
IBM kicks out energy-efficient 4.7GHz POWER6 processor
Nah, it's no BlueGene L supercomputer, but IBM's latest dual-core microprocessor runs at a cool 4.7GHz while sporting 8MB of total cache per chip. The device reportedly runs "twice as fast" and packs four times the cache as the POWER5, and boasts a processor bandwidth of 300Gbps. Interestingly, the massive power increase doesn't seem to come with a boost in energy requirements, as IBM claims that the 65-nanometer POWER6 somehow ups its game while "using nearly the same amount of electricity" as its predecessor. The company plans on shoving the new darling into the System p570 server, and preliminary testing showed that all four of the "most widely used performance benchmarks for Unix servers" were shattered by its CPU. Unfortunately, there's no word on pricing nor availability just yet, but we're anticipating a bit of sticker shock when it does finally land.[Via LinuxDevices]
Pirates rule the Philippine seas
After a tour of the country last year, Indian President Abdul Kalam described the Philippines as a "smiling republic." Wherever he went, Kalam was met with smiling faces. Well, you'd be grinning too if you saw how cheap their games are. Thanks to the black market, popular Nintendo Wii titles are priced as low as $5 in some shops. Piracy has become so widespread in the Southeast Asian country, even Sony admits that most of its Playstation software sold in the Philippines are bootlegged copies.Filipino site GameOPS found that many stores also offer modchip installations. For about $51, you can have your system hacked to play these counterfeit games at the local mall or market. Furthermore, some shops advertise console bundles, selling imported and modded US Wiis with five copied games of your choice for around $450. Similar deals for chipped Xbox 360 systems with 10 pirated titles are actually cheaper at $388.With such a high level of piracy already in place, Nintendo will have a lot to work against when -- or if -- it decides to finally launch the Wii in the Philippines.
Solderless Wii modchips on the way?
If you've been curious about fixing your Wii to dabble with homebrew or play titles from other regions, but don't trust your abilities enough to mess with the console's innards, there might be a solution in the works for you. WiiNewz forum member Takrin recently posted photos of his hardware project in progress, a prototype modchip that requires no soldering to install. With nothing to attach the modchip to though, how does it stay in place? Takrin suggests "double sided tape on one side" and "foam which presses it to your drive on the other." That doesn't sound like a very stable setup, but we hope to see this development spawn more sophisticated and accessible mods in the future. To be honest, if a monkey can't install it, we probably wouldn't be able to either. [Via MaxConsole]
IBM apes Mother Nature for faster, more efficient chips
Someone should seriously tell IBM's research and development team to take a much-deserved vacation, as these folks have been cranking out the goods at an alarming rate of late. Most recently, the company has announced the "world's first application of self assembly used to create a vacuum around nanowires for next-generation microprocessors," which just so happens to mimic the natural pattern-creating process that forms seashells, snowflakes, and enamel on teeth. Essentially, the process forms "trillions of holes to create insulating vacuums around the miles of nano-scale wires packed next to each other inside each computer chip," which should aid electrical current in flowing around 35-percent faster while it eats up about 15-percent less energy. This newfangled approach to insulation, dubbed airgaps, creates vacuums that enable the substantial boost in speed, and the self assembling process is reportedly "already integrated" into IBM's manufacturing line in New York. The chips will initially be used in the firm's server lineup sometime near 2009, and shortly thereafter, we can expect IBM to start cranking these out for other companies that rely on its CPUs.[Via BBC, thanks Josh]
Forget Santa Rosa, how about a quad-core Penryn?
Honestly, we don't exactly know how to take the news that Intel's already looking beyond next month's Santa Rosa release to a reported quad-core Penryn mobile processor. On one hand, our eyes relish the opportunity to play the latest titles at the highest resolutions whilst bragging aimlessly to our online pals, but then again, we don't look forward to the presumed third-degree burns that could likely develop from tossing these in such tight quarters. Nevertheless, Intel managed to drop a few more details in regard to its mobile CPU plans, and noted that Santa Rosa's successor would likely be based on the 45-nanometer Penryn design and offer high-end gaming notebooks a ridiculous amount of power. Additionally, an Intel exec showcased the future chip's ability to be user-overclocked, suggesting that it would be "your responsibility to take care of cooling." Of course, if Intel could buddy up with IBM's miracle-working cooling solutions, the forthcoming chip could manage to breathe a bit easier, but we've got until "the first half of 2008" to see about all that.
IBM pushing vertical stacking in next wave of supercomputers
Next-generation cooling technology isn't the only thing IBM's R&D crew is spending time with, as the chip giant has recently made plans to hit up "vertical stacking technology" in order to make the next wave of supercomputers really crank. Supposedly, "laying chips vertically -- as opposed to side by side -- reduces the distance data has to travel by 1,000 times, making the chips faster and more efficient." The new format will place chips directly atop one another and connect them with "tungsten filled pipes etched through the silicon," which will subsequently eliminate the need for wires and increase the speed at which data can flow. The questionably-dubbed "3D chips" will reportedly operate around 40-percent more efficiently than existing renditions, and considering that Intel is purportedly cooking up a similar agenda in their own labs, that "end of 2007" release date is quite likely to be accurate.
