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Intel talks up 3-Series chipset, Core 2 Extreme CPU for laptops
Shortly after revealing that a quad-core laptop chip was indeed in Intel's pipeline for 2008, the firm has decided to go public with even more laptop-based processor details over at Computex. Intel's executive vice president Sean Maloney had the honors of "unveiling" the 3-Series chipset family (formerly known as Bearlake), which will of course support DDR3 RAM, PCI Express 2.0, HDMI, and can come stocked with G33 / G35 Express integrated graphics. More importantly, the outfit formally introduced plans for an Intel Core 2 Extreme mobile processor that should be released in Q3 of this year. According to Mr. Maloney, the chip is targeted to be the company's "highest-performing mobile dual-core processor that still includes energy-saving power features for laptop designs." No word just yet on whether or not this CPU will cost more than the rest of your laptop components combined (but we wouldn't be surprised).[Via Laptoping]
The future of console hardware design
The next generation has just barely become the new generation, but the folks at Semiconductor Insights are already thinking about what might be under the hood of the next generation of consoles. In an article at TechOnline, SI manager Allan Yogasingam discusses how the focus of system design has tilted from simple cosmetics for the Atari 2600 to "cost, heat [management], cooling and [efficiency] test." in the 30 years since.That cost bit might be the most important -- SI manager Greg Quirk predicts Sony and Microsoft will soon introduce 65 nanometer processors to reduce the costs associated with their current, 90-nanometer-chip systems. Yogasingam also predicts that the drive for cost reduction might lead console makers to look towards "second- and third-tier chip and software vendors " for the next generation. Someone better warn IBM that their gravy train might be in jeopardy. What else is likely to be in the next generation of hardware? The SI team thinks 802.11n wireless, tilt-sensitive MEMS controller sensors and other entertainment features are likely to stay hot, but that's not exactly rocket science. Where are the bold predictions for things like laser cannon attachments and Holodeck-style projectors.
OC Team Italy takes P4 to 8.18GHz
Nah, 8,180MHz can't hold a candle to 500GHz, but on the long road of overclocking Intel's Pentium 4 where there is an increasingly brief amount of time available to brag before being trumped, the zany Italians have crowned themselves champs once more. Not content with just hitting 8GHz with a "Cedar Mill" Pentium 4 631, OC Team Italy managed to push that very model an additional 179MHz by tweaking the FSB. The final results yielded a 173-percent overclock, and while this here setup may run stable for a continued period if placed at the depths of Antarctica, we can't imagine this being too feasible for the common man to replicate and actually utilize.
NVIDIA's CUDA turns GPUs into high-powered CPUs
NVIDIA's been dancing around the general-purpose processor market for a while now -- we've heard reports that the company is developing an x86 chip, and it bought PortalPlayer last year for $357 million. Well, at this year's Microprocessor Forum the company took another small step by announcing that the final release of CUDA, its framework for utilizing high-end NVIDIA GPUs as CPUs, which will be available to developers in the second half of the year. While the idea of using a GPU as a secondary high-performance processor isn't a new one -- Folding@Home already runs on NVIDIA and ATI chips, and the Peakstream system already leverages GPUs -- CUDA should make it easier for developers to tap into high-performance graphics devices whenever they're available, without having to specifically tailor their apps to do so. CUDA, which stands for "compute unifed device architecture," currently only supports the GeForce 8800 and 8600 and Quadro FX 4600 and 5600, so it's of limited appeal right now, but here's hoping the next gen of NVIDIA chips supports CUDA from the get-go -- the Engadget Folding@Home team is looking for a few new recruits.
IBM kicks out energy-efficient 4.7GHz POWER6 processor
Nah, it's no BlueGene L supercomputer, but IBM's latest dual-core microprocessor runs at a cool 4.7GHz while sporting 8MB of total cache per chip. The device reportedly runs "twice as fast" and packs four times the cache as the POWER5, and boasts a processor bandwidth of 300Gbps. Interestingly, the massive power increase doesn't seem to come with a boost in energy requirements, as IBM claims that the 65-nanometer POWER6 somehow ups its game while "using nearly the same amount of electricity" as its predecessor. The company plans on shoving the new darling into the System p570 server, and preliminary testing showed that all four of the "most widely used performance benchmarks for Unix servers" were shattered by its CPU. Unfortunately, there's no word on pricing nor availability just yet, but we're anticipating a bit of sticker shock when it does finally land.[Via LinuxDevices]
AMD Phenom FX, X4, X2 Stars to shine in Q3 / Q4
When it's been nearly six months since we've seen an elusive PowerPoint slide pointing to future AMD processors, it's been far too long, but it looks like the forecasting can begin again thanks to information about AMD's star-packed Q3. According to a roadmap slide charting out the future of AMD's "Stars" family of processors, a number of dual- and quad-core processor options will be headed to the desktop market sometime in the third and fourth quarters, and while the firm's "value" Athlon 64 X2 and Sempron chips will also see minor overhauls headed into Q1 of 2008, the focus seems to be on the Phenoms in the crew. The flagship quad-core Phenom FX (dubbed Agena FX) will clock in from 2.2GHz to 2.6GHz, sport 4 x 512KB of L2 cache, 2MB of L3 cache, and sport bus speeds of 3,200MHz or 3,600MHz. The X4 chips ratchet down in speed a bit, and only handle the AM2+ socket while the top-end FX plays nice with the 1207+. The X2 CPUs go the dual-core route, top out at 2.8GHz, but won't be ready for ordering until Q4 of this year. Be sure to hit the read link for a (larger) peek at the chart -- unless you just completed an order for a current-generation chip, that is.[Via RegHardware]
IBM apes Mother Nature for faster, more efficient chips
Someone should seriously tell IBM's research and development team to take a much-deserved vacation, as these folks have been cranking out the goods at an alarming rate of late. Most recently, the company has announced the "world's first application of self assembly used to create a vacuum around nanowires for next-generation microprocessors," which just so happens to mimic the natural pattern-creating process that forms seashells, snowflakes, and enamel on teeth. Essentially, the process forms "trillions of holes to create insulating vacuums around the miles of nano-scale wires packed next to each other inside each computer chip," which should aid electrical current in flowing around 35-percent faster while it eats up about 15-percent less energy. This newfangled approach to insulation, dubbed airgaps, creates vacuums that enable the substantial boost in speed, and the self assembling process is reportedly "already integrated" into IBM's manufacturing line in New York. The chips will initially be used in the firm's server lineup sometime near 2009, and shortly thereafter, we can expect IBM to start cranking these out for other companies that rely on its CPUs.[Via BBC, thanks Josh]
The amazing 360 GPU shrinks to 65nm this Fall
According to sources close to equipment manufacturers, later this year we'll be ushering in a new and improved Xbox 360 GPU. A Chinese report in the Commercial Times is stating that the new 65nm 360 GPU will be sent to production in May and make its way into Xbox 360 consoles later this Fall. And we all know the benefits of 65nm technology. So, anyone in the market for a new 360 or jumping in for the first time and going to hold out until the new 65nm technology makes it into the console? Or could you care less unless it would involve an Xbox 360 price cut?[Via Joystiq]
High frequency processors could put your GPS on the fritz
Just when you think things couldn't get any more gloomy in the world of in-car navigation systems, here comes news that high frequency processors surrounding your GPS system could actually cause some seriously screwy routing. According to a study by the Swedish Defense Research Agency, "computers used near a NAV could disturb the signals utilized in the GPS receiver." More specifically, Intel CPUs with clock speeds of 1.7GHz, 3.0GHz, and 3.2GHz were pinpointed as potential troublemakers, but a member of the study actually went so far as to suggest that a variety of other (untested) chips could indeed wreak the same havoc. The study showed that "modern computers produce interfering signals that reach as far as the frequency bandwidths used for GPS systems," and while specific reactions weren't apparent, testers did suggest to move any computer equipment further away from the GPS unit if it began to "play up" for no ostensible reason. Of course, we've huddled our own laptops and GPS systems together on many occasions with no ill consequences, so as always, your miles may vary.[Via NaviGadget]
Xilinx, Altera showing off FPGA coprocessors at IDF
While Field Programmable Gate Arrays (FPGA) haven't benefited from a good deal of buzz just yet, things could be taking a turn, as both Xilinx and Altera caught a few eyes at IDF. We've already seen the unique, albeit highly specific chips in a supercomputer, but the dedicated coprocessor / accelerator modules could be landing beside your Intel Xeon CPU. Essentially, the devices plug "directly into the processor socket of dual- or quad-socket servers" in order to provide "high performance application acceleration ranging from 10x to 100x compared to processors alone, while simultaneously reducing overall system power consumption." The modules act as targeted CPUs, effectively computing very specific tasks in a much more efficient fashion than a general microprocessor can alone, which could boost the speed of scientific, financial, and life science applications that rely on very particular calculations. Of course, mainstream adoption still has quite a ways to go, but the quicker we get dedicated physics and AI coprocessors to go along with these snazzy new GPUs, the happier (and poorer) we'll be.[Via RobotSkirts]Read - Altera demonstrates FPGA at IDFRead - Xilinx demonstrates FPGA at IDF
Forget Santa Rosa, how about a quad-core Penryn?
Honestly, we don't exactly know how to take the news that Intel's already looking beyond next month's Santa Rosa release to a reported quad-core Penryn mobile processor. On one hand, our eyes relish the opportunity to play the latest titles at the highest resolutions whilst bragging aimlessly to our online pals, but then again, we don't look forward to the presumed third-degree burns that could likely develop from tossing these in such tight quarters. Nevertheless, Intel managed to drop a few more details in regard to its mobile CPU plans, and noted that Santa Rosa's successor would likely be based on the 45-nanometer Penryn design and offer high-end gaming notebooks a ridiculous amount of power. Additionally, an Intel exec showcased the future chip's ability to be user-overclocked, suggesting that it would be "your responsibility to take care of cooling." Of course, if Intel could buddy up with IBM's miracle-working cooling solutions, the forthcoming chip could manage to breathe a bit easier, but we've got until "the first half of 2008" to see about all that.
IBM pushing vertical stacking in next wave of supercomputers
Next-generation cooling technology isn't the only thing IBM's R&D crew is spending time with, as the chip giant has recently made plans to hit up "vertical stacking technology" in order to make the next wave of supercomputers really crank. Supposedly, "laying chips vertically -- as opposed to side by side -- reduces the distance data has to travel by 1,000 times, making the chips faster and more efficient." The new format will place chips directly atop one another and connect them with "tungsten filled pipes etched through the silicon," which will subsequently eliminate the need for wires and increase the speed at which data can flow. The questionably-dubbed "3D chips" will reportedly operate around 40-percent more efficiently than existing renditions, and considering that Intel is purportedly cooking up a similar agenda in their own labs, that "end of 2007" release date is quite likely to be accurate.
Lenovo's ThinkPad X60 convertible goes Core 2 Duo
Admittedly, it feels a bit strange to praise a machine for getting a Core 2 Duo in April of 2007, but Lenovo's highly-regarded convertible has finally remedied the one gripe that nearly everyone seemed to have about it. While we've seen the C2D hit high-end lappies rather late in the game, we're fairly sure this one takes the cake for belatedness, but if you've been patiently anxiously awaiting for the overdue processor upgrade, your wait is finally over. Right now, you can order up an X60 Tablet PC with a 1.5GHz L7400V Core 2 Duo CPU, 12.1-inch SXGA+ display, 1GB to 4GB of DDR2 RAM, up to 120GB of hard drive space, Bluetooth, 802.11a/b/g/n, and an eight-cell Li-ion battery to boot. Of course, such "fresh" luxuries apparently don't come cheap, as a fairly well-spec'd machine will run you upwards of $2,000, and should arrive "within one to two weeks" from now.[Via Slashgear]UPDATE: Well you can officially color us confused, as it appears that the Core 2 Duo mention on Lenovo's official webstore is, um, bogus. According to "sources at Lenovo" cited by TabletPCTalk, "there are no Core 2 Duo ThinkPad X60s available as of this moment," but alas, we've no idea when this moment will end and the next will begin. Stay tuned.
360 may boost Rosetta@Home project
We previously reported on the idea of bringing the Playstation 3's Folding@Home project to our Xbox 360s and the impact it could have. But now it isn't looking like the Folding@Home project will be receiving any 360 love, instead Gizmodo thinks Microsoft may be supporting another folding project called Rosetta@Home. Rosetta@Home is very similar to the other folding project where computing power helps with protein folding which in turn helps find cures for various diseases. What's most interesting is that on the project's forums, a project scientist acknowledged the possibly of a Xbox 360 partnership by saying they "have been discussing this idea with Microsoft quite a bit over the past several weeks". Interesting, no?We're still interested in this whole donating CPU power to a good cause thing and still think it's a pretty good idea. It would give those of us who want to an option to donate our 360's computing power to ultimately help disease research. Can you say teamwork FTW?[Thanks, AoE]
More dirt on Intel's Penryn / Nehalem architecture
While you've been off dreaming of long-range WiFi, Intel's not forgotten about its Penryn / Nehalem architectures, and thanks to an uber-boring slideshow presentation, we now know more than ever about the forthcoming duo. As expected, there isn't much new on the oft detailed Penryn front, but the fresher Nehalem most certainly piqued our interest; while built on the same 45-nanometer technology as its predecessor, Nehalem is being hailed as "the most dramatic architecture shift since the introduction of the front-side bus in the Pentium Pro in 1996." Attempting to back up such bold claims came news that HyperThreading would be native to Nehalem, and it would "share data at the L1 and potentially, the L3 cache levels," allow eight-core CPUs to clock down to two / four, and boast scalability options to satisfy a wider market. Most intriguing, however, was the "optional high performance integrated graphics" that could reportedly be included on the same processor die, which could certainly prove interesting if crammed into, say, a UMPC. So if you're still not satisfied with the highlights, and don't get enough mundane PowerPoint action from your corporate employment, be sure to hit the read link when your friends aren't looking.
IBM's thermal paste cooling innovations detailed
It was but a few months back that IBM was tooting its own horn in regard to a "breakthrough" technology sure to revolutionize the processor cooling realm as we know it, and while miraculous claims often vanish after their bold declarations, it looks like this invention is moving forward. While we'd already heard the typical techie hub bub that goes along with such systems, IBM is now explaining a bit more about how the process will eventually work. Essentially, researchers have created a system in which "tree-like branched trenches" are placed in the copper cap, where a newly-thinned thermal paste can be applied with half the pressure of current renditions, netting a "twofold increase in cooling performance." The micrometer-sized channels basically act as an "irrigation system" to allow the toasty particles to homogeneously escape rather than building up in the self-proclaimed "magic cross" section. We know, this still isn't spelling things out in layman's terms, but if you're truly interested in knowing precisely how IBM plans on slashing the heat emitted by your future CPUs, grab your reading glasses and hit the read link.
AMD integrates ATI Radeon X1250 into Vista-certified 690 chipset
Although ATI's R600 graphics chip may have hit a recent snag, it seems that the company's Radeon X1250 GPU is coming along just fine, as it claims the proud title of "world's first" integrated graphics unit to receive Vista certification. The chip, of course, is a critical piece of AMD's latest 690-series chipset, which integrates Aero-capable graphics, 1GHz HyperTransport interface speeds, and support for Sempron, Athlon 64/64 FX/64 FX X2 processors, PCI Express, Microsoft's DirectDraw, hardware acceleration for MPEG-2/4 and WMV9, TV output, HDCP-compatible DVI / HDMI outputs, and the general smorgasbord of connectors we're all used to seeing these days. Putting the resources of the ATI / AMD merger to full use, the 690 family claims to be the first chipset from the pair that supports ATI's Avivo technology, which purportedly makes your multimedia experiences within Vista a smooth ordeal. AMD's latest should be available right now for an undisclosed price, but we'd wait for a few hands-on opinions before rushing out and skipping over a dedicated GPU in your next rig.[Via 64-Bit-Computers]
Intel prepping Core 2 Extreme laptop CPUs
Intel looks to be set to give its mobile CPU offerings a shot in the arm, with HKEPC Hardware reporting that the chip maker has a pair of new Core 2 Extreme processors in the pipeline, aimed squarely at laptops catering to the more demanding gamers among us. Both processors fall under the "Mermon XE" codename, coming in at the 65nm level, and packing 4MB of shared L2 cache and an 800MHz frontside bus, along with support for SpeedStep, Virtualisation Technology, and 64-bit addressing. Look for the Core 2 Extreme X7800 to be the first of the two out of the gate sometime in Q2 or Q3 of this year, clocking in at 2.6GHz and running $795. It'll be followed shortly thereafter in Q4 by the X7900, which will raise the stakes to 2.8GHz, although it's not yet known how much it'll cost.[Via Reg Hardware]
Intel to ship 45nm Core 2 chips by end of year
It's front-page news today in the NYT and elsewhere: transistor jockeys at Intel will be the first to market with processors based on a 45-nanometer process, dramatically boosting performance and/or lowering power requirements for the new devices compared with the current 65nm parts. With the use of "high-k gate dielectrics" made with hafnium metal, Intel is implementing the biggest improvement in fundamental semiconductor technology in 40 years, according to company co-founder Gordon Moore (long retired, but sending in his two cents from Hawaii).Intel is building two entirely new fabrication facilities to build the new process chips, in Arizona (up and running midyear) and Israel (early 2008). Of course, the part of this news we care most about 'round here: the new chips, codenamed "Penryn," are already running Mac OS X in the lab, will most likely be completely compatible with the existing Core 2 processors (with the addition of SSE4), and Intel expects a double-digit performance boost for media applications. Now that's what I'm talking about.
AMD introduces DTX open standard to boost SFF adoption
Although vanilla desktop PCs have (generally) been the same size and shape for years, the small form factor world has never really settled down, and while various other protocols have been thrown out there, no one has actually stepped up the task of standardized an SFF chassis until now. AMD has just announced the DTX "open standard," which the firm hopes will "enable broad adoption" of the SFF PC in order to deliver "innovative solutions to market that are smaller, quieter, desktop-friendly," and less taxing on the ecosystem. Reportedly, the DTX standard "will be designed to embrace energy-efficient processors and allow an optimally designed small form factor system to consume less power and generate less noise." Additionally, an open standard that's widely embraced will make the lives of OEMs much easier, and will hopefully give us folks looking for those wee PCs a bit more choice when it comes to picking one up. Notably, it seems that Asus has latched on already, boasting that it will start busting out DTX-compliant motherboards here shortly, likely to be bundled in some fashion with an AMD chip. If all goes as planned, this open standard should actually decrease manufacturing costs across the board over time, and AMD stated that a "review copy of the DTX specifications" should be made available sometime this quarter.[Via Inquirer]
