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NC State patents multifunctional smart sensors, looks to 'revolutionize energy and communications infrastructure'
Bold words coming from a program that choked in epic fashion this past Saturday in front of 58,000+, don't you think? Thankfully for those who are actually involved in the global energy and communications infrastructure (not to mention depressed alumni), NC State's athletics department is far removed from its research labs, and the university's latest development was born and bred in the latter. A team of researchers have managed to patent a new technology that is expected to enable the development of "high-power, high-voltage and high-current devices that are critical for the development of energy distribution devices, such as smart grid technology and high-frequency military communications." The secret? Integrating gallium nitride (GaN) sensors and devices directly into silicon-based computer chips, a feat that hasn't been accomplished by any team prior. According to Dr. Jay Narayan, this newfangled integration has "enabled the creation of multifunctional smart sensors, high-electron mobility transistors, high-power devices, and high-voltage switches for smart grids," and it also makes a broader range of radio frequencies available -- something that'll obviously be beneficial in the advancement of communications. Best of all, a US-based corporation is already in the process of licensing the technology, so it's likely that we'll see this in use in the not-too-distant future. An ACC championship, however, remains far more elusive.
Metamaterials used to focus Terahertz lasers, make them useful
Forget old and busted X-rays, T-rays are the future, man! It was only recently that we were discussing Terahertz lasers and their potential to see through paper, clothes, plastic, flesh, and other materials, but that discourse had to end on the sad note that nobody had managed to make them usable in a practical and economically feasible way. The major hurdle to overcome was the diffusion of Terahertz radiation -- which results in weak, unfocused lasers -- but now researchers from the universities of Harvard and Leeds seem to believe they've managed to do it. Using metamaterials to collimate T-rays into a "tightly bound, high powered beam" will, they claim, permit semiconductor lasers (i.e. the affordable kind) to perform the duties currently set aside for sophisticated machinery costing upwards of $160,000. Harvard has already filed a patent application for this innovation, and if things pan out, we might be seeing body scanners (both for medical and security purposes), manufacturing quality checks, and a bunch of other things using the extra special THz stuff to do their work.
ARM and TSMC team up for tinier 20nm Cortex SOCs
It's no secret that ARM ideas are powering much of the mobile revolution these days, but the company doesn't print its own systems-on-a-chip, that duty gets outsourced to silicon foundries -- like TSMC, who just got all buddy-buddy with the firm to transition future smartphone chips to the 28nm and obscenely tiny 20nm high-k metal gate processes. (We're not sure what this means for GlobalFoundries, who had a similar deal earlier this year.) As per usual with a die size reduction, ARM chips will see higher speed and have decreased power consumption, but since 20nm is (relatively) unexplored territory it could be years before chips hit the market. PR after the break, or hit the more coverage link for further explanation by an ARM VP of Marketing.
TSMC begins construction of new $9.3b foundry, wants to sate our constant hunger for chips
TSMC might not necessarily be a household name, but the product of its labors tends to be all over home electronics. Aiming to keep that trend going, the Taiwanese chipmaker has just broken ground on its third 300mm wafer plant, located in Taichung's Central Taiwan Science Park. The new Fab 15 will have a capacity of over 100,000 wafers per month -- earning it the prestige of being described as a Gigafab -- and once operational it'll create 8,000 new skilled jobs in the area. Semiconductors built there will also be suitably modern, with 40nm and 28nm production facilities being installed, and lest you worry about such trivial things as the environment, TSMC says it's doing a few things to minimize the foundry's energy usage and greenhouse gas emission. Then again, if you're going to spend nearly $10 billion on something, would you expect anything less?
Germanium lasers offer ray of hope for optical computing
Bandwidth scarcity, is there any more pressing global issue that we're faced with today? We think not. Given the exponential growth in both computing power and software's exploitation and expectation of greater resources, it's no surprise that at some point we'll have to look beyond simple electrical currents as the transporters of our data. One bold step taken in that direction has been the demonstration of an operational germanium-on-silicon laser by researchers at MIT. By tweaking the electron count in germanium atoms with the help of some added phosphorous, they've been able to coax them into a photon-emitting state of being -- something nobody thought possible with indirect bandgap semiconductors. Perhaps the best part of this is that germanium can be integrated relatively easily into current manufacturing processes, meaning that light-based internal communication within our computers is now at least a tiny bit closer to becoming a reality.
NEC and Renesas looking to join forces against semiconductor evil
We're always up for a good semiconductor merger, and it looks like NEC Electronics and Renesas are prepping the biggest one we've seen this week. The two companies have agreed to team up, creating a combined force of $13 billion in yearly sales, and the largest chip company in Japan -- Renesas was already the product of a chip merger between Hitachi and Mitsubishi Electric. They'll still be behind Intel and Samsung in the overall game, but we won't hold that against them. Tokyo analysts believe this might lead to other "defensive" mergers by other Japanese chipmakers, but we'll have to wait and see. NEC and Renesas hope to finish talks by July and become a single company by April of next year.[Via Electronista]
IBM, Samsung, Globalfoundries, and more looking to beat Intel to 28nm market
Sure, Intel's one-upping AMD in the 32nm department, but IBM and its merry band of Technology Alliance members -- including Samsung, STMicroelectronics, and AMD chipmakers Globalfoundries -- are looking to ramp up the competition and develop even smaller, low power 28nm processors before Intel gets a chance to size down. The group additionally promises migration plans for companies who've got 32nm on their roadmap and want to maybe shrink a few of the later, already planned models. Early risk production for the 28nm chips are planned for second half 2010, which means it's very unlikely we'll be seeing them in consumer gadgets until at least 2011.
Fujitsu will spin off chip division, say reports (now official)
Fujitsu Limited, which is known for many fine products from laptops to degaussers, is allegedly poised to spin off one business it is not so well known for, its semiconductor division. Both NHK and the Asahi Shimbun are reporting that the Japanese firm will cut loose the organization "in a few months and form a new company by consolidating its chip production bases in Japan." According to Japan Today, while accounting for 10% of the multinational conglomerate's sales, the division continues to see heavy losses due to steep development costs, and may eventually have to merge with one of its rivals in order to survive.Update: It's official. Fujitsu says it will form a new subsidiary in March. The consolidation efforts will be complete in September to a tune of ¥10 billion (about $93 million).
Intel researching "carbon nanotubes" for chip design
While Moore's Law has held up pretty well over the last 40 years, it may not be able to stay true forever. It turns out that as the components inside semiconductors get smaller and smaller, electrical resistance goes up, thereby reducing performance; experts say that eventually there will be a breaking point for "copper interconnects," reaching the point where Moore's Law falls apart. Scientists have been well aware of this roadblock, and have invested heavily in everything from quantum computing to optical processors. Intel is also working on a solution for this electrical engineering problem by attempting to determine whether these semiconductor interconnects can be replaced by carbon nanotubes. The ubiquitously researched microscopic tubes can conduct electricity far better than metals, due to their "ballistic conductivity," a property where no electrons are dispersed or blocked. But, the problem with carbon nanotubes, as CNET reports, is that they're really tough to mass produce; once created, some act as great semiconductors, while others don't. So now, Intel has to figure out how to get carbon nanotubes to act more uniformly, or to separate the bad ones from the good. Thankfully, consumers won't have to worry about this problem for about another decade, which is why Intel has brainiacs working on a solution as we speak.[Via Slashdot]
Self-healing chips could function forever
Although you may have never given a thought to what transistors do to repair themselves when certain sectors fail, there are a few organizations who make it their life's work. Researchers from the National Science Foundation, the Semiconductor Research Corporation, and the University of Michigan have a mission to complete before their grant money runs dry: to create semiconductors that can heal themselves without the burdensome redundancy currently used. The goal here, which could seem a tad superfluous until you consider these chips operate in things like airplanes and medical devices -- you know, fairly critical applications -- is to design a semiconductor that runs more efficiently and can be counted on to function no matter how crucial the situation. By designing a chip that can auto-detect a problem, then shift the resources to a functioning area while the chip diagnoses and repairs the issue with help from "online collaboration software," you'll get a slimmer semiconductor that suffers no noticeable loss in performance while self-repairing. If this circuitry talk has your wires all crossed up, here's the skinny: more dependable chips will make everyone's life a bit easier, and if the team's plan is free of defects, we can expect to see prototypes within the next three years. [Via Mobilemag]
