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Prototype '3D' chip from MIT could eliminate memory bottlenecks
Future CPUs will have to deal with growing amounts of data, but all too often they are slowed down by bandwidth issues between the processor and RAM. A prototype chip built by researchers at Stanford and MIT can solve the problem by sandwiching the memory, processor and even sensors all into one unit. While current chips are made of silicon, the prototype processor is made of graphene carbon nanotubes, with resistive RAM (RRAM) layered over it.
IBM sees stacked silicon sitting in fluid as the way to power future PCs
Generally, the combination of microchips, electricity and fluids is usually considered an incredibly bad thing. IBM, however, thinks it can combine those three to make super small and super powerful computers in the future. The idea is to stack hundreds of silicon wafers and utilize dual fluidic networks between them to create 3D processors. In such a setup, one network carries in charged fluid to power the chip, while the second carries away the same fluid after it has picked up heat from the active transistors. Of course, 3D chips are already on the way, and liquid cooled components are nothing new, but powering a PC by fluids instead of wires has never been done before. Bruno Michel, who's leading Big Blue's research team, has high hopes for the technology, because future processors will need the extra cooling and reduced power consumption it can provide. Michel says he and his colleagues have demonstrated that it's possible to use a liquid to transfer power via a network of fluidic channels, and they to plan build a working prototype chip by 2014. If successful, your smartphone could eventually contain the power of the Watson supercomputer. Chop, chop, fellas, those futuristic fluidic networks aren't going to build themselves.
Researchers create first true 3D processor, turns chips into cubes
While others have touted 3D processors in the past, a group of researchers from the University of Rochester are now claiming that they've developed the first true 3D processor (with a little help from MIT), and they've got it running at a decent 1.4GHz, no less. Dubbed the "Rochester Cube," the processor was apparently designed from the ground up to optimize all key processing functions vertically, unlike other 3D processors which simply stack a bunch of regular processors on top of one another. Among other things, the researchers say that allows the processors to be shrunk to as much as a tenth their size of their traditional counterparts, while also increasing their speed tenfold. Unsurprisingly, they aren't making any promises as to when such a magical processor might find its way into some actual products, but whenever it does, it'll no doubt be facing some stiff competition from some other purported processor breakthroughs.[Via DailyTech, image courtesy 3DStereo.com]
