32nm
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Intel invests $7 billion in Stateside 32nm manufacturing
You might not be getting you hands on that Calpella any time soon, but that isn't a sign that Intel is backing down -- if anything, the company has big things in store, including a newly announced $7 billion plan to upgrade four of its Stateside facilities so they can start rolling out those new-fangled 32nm chips we've been hearing so much about. This is good news for the struggling American manufacturing sector, and great news for fans of smaller, faster gadgets -- but not particularly great news for AMD, who entered the new year with a $1.4 billion loss and an eroding share of the x86 processor market.[Via Forbes]
Intel's 32nm chips ready for MIDs and netbooks in 2009
In 2005 Intel revealed its 65-nm manufacturing process, then 45-nm in 2007. Today, in keeping with its "tick-tock" strategy, Intel is announcing a further shrinkage to its manufacturing process as it ends the development phase for 32-nm chip circuitry. That puts the chips on a production schedule for Q4 2009 -- interesting as Intel's rumored 32-nm Medfield chip wasn't expected until the first half of 2010. According to Intel, the new chips incorporate second-generation high-k + metal gate technology with transistors that switch 22% faster than its current 45-nm Penryn chips. Why should you care? Well, the smaller chips are cheaper to manufacture which should translate to consumer savings. They also require less power than Intel's notoriously power-friendly Atom-class chips. As an interesting side note, the Wall Street Journal is reporting that Intel has also disclosed a variant of its 45-nm process (the Lincroft-based Pineview we presume) "that is tailored to create chips for portable computing devices that require low power consumption." Uh, those wouldn't be targeting ARM by any chance would they Intel? Wink wink, nudge nudge. [Via Wall Street Journal]
Panasonic, Renesas team to mass produce 32nm chips
We've seen some big names working on 32nm chips, and now we can add two more to the mix. According to Nikkei, Panasonic and Renesas have recently developed technology necessary to mass produce the little guys, using metal oxide film (instead of a silicon material) for the insulating layer and titanium nitride for the conducting layer. This has allowed the chips to consume less power, so the 32nm chips operate comparably to their 45nm siblings. Look for a street date sometime in 2011 -- but considering that Toshiba, IBM and others have set a target date of 2010 for their 32nm chips, and Samsung and Intel are aiming at 2009, Panny might be showing up to this party a little late.
Hitachi joins IBM's quest for sub-32nm semiconductor technology
As of this morning you can add Hitachi to the list of cohorts IBM has gathered in its quest for sub-32nm circuitry. Hitachi's 2-year semiconductor research agreement -- a first between IBM and Hitachi -- puts them under a loose-knit alliance with AMD, Chartered, Freescale, Infineon, Samsung, Sony, Toshiba and STMicroelectronics. The notable, non-member here is of course, Intel; that little company making "45-nm processes" and "Hi-K metal gate" house-hold terms amongst geeky, type-A adopters of consumer electronics. Yes, we're looking at you.
Toshiba, IBM, Samsung and others in pact with the 32-nm devil
Toshiba just announced its membership in an alliance to develop system chips using 32-nm circuitry. That's well below the existing 45-nm processes used in manufacturing Intel's Penryn, for example. The alliance includes IBM, AMD, Samsung (already pushing 30-nm NAND), Infineon, Freescale, and Singapore's Chartered Semiconductor Manufacturing. No surprise really, what with Tosh already in bed with IBM to develop chips using 32-nm processes. The agreement is good until 2010 and covers design, development, and the production of the itty bitty circuitry. A move which should reduce manufacturing costs for the alliance with the savings passed along to us consumers.
Samsung reveals first 30-nm 64Gb NAND chip -- and a bit of skin
We're not sure what's more impressive here: the fact that Samsung has produced the world's first 30nm-class 64Gb (bit, not byte!) NAND chip or that they're now roping defenseless product waifs into hawking their silicon wafers. Nevertheless, we're looking at a serious jump in density in just 10 months. A maximum of 16 of the new chips can be combined for cost-effective 128GB (byte, not bit!) MLC NAND-based flash cards used primarily for data storage. Sammy's faster SLC based flash cards will still be the preferred choice when speed is of the utmost priority and cost isn't an issue. As such, Samsung also announced a 32Gb SLC NAND chip based on the same SaDPT (Self-aligned double patterning technology) manufacturing process. Sadly, we'll have to wait until 2009 for production to begin. Still, he looks happy dontchathink?[Via AVING]
Intel touts 20x less power-hungry UMPCs, lays out processor roadmap
While we already have a pretty good idea of Intel's near-term processor plans, the company has now decided to give folks a glimpse a bit further into the future, laying out some its processor plans through the year 2010 at its spring analyst meeting this week. Among the more notable boastings by the company is a promised 20x reduction in UMPCs' power consumption by 2009-2010. That'll supposedly be made possible by its new "Moorestown" system on a chip, which is set to replace its still-to-be-released Menlow system. In addition to the lower power consumption, Moorestown also promises to reduce thermals by 9x and cut the actual size by the same amount. As for the rest of its roadmap, Intel is continuing to talk up its 45-nanometer manufacturing process, with the first such chip (code-named Penryn) still on track to ship this year. Don't get too used to those 45nm chips though, as Intel's says it's planning to release its first 32-nanometer chip, a Nehalem-based processor dubbed "Westmere," sometime in 2009.Read - RegHardware, "Intel web tablet SoC to cut power consumption by 20x"Read - InformationWeek, "Intel Road Map Stretches From Quad Cores To Mobile Internet"
