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Xbox 360 to get CPU upgrade in 2007
In a joint announcement, Microsoft and the manufacturer of the Xbox 360's CPU, Chartered Semiconductor, have announced that the console's processor will receive an upgrade in 2007. The upgrade will move the chip's design to a 65nm manufacturing process (the existing CPU is based on 90nm technology) which will provide lower power consumption and a smaller heat output. It's expected that the upgrade will not alter the processor's performance as this could cause compatibility issues with games already released or currently under development for the Xbox 360.Although the launch of the Xbox 360 was touted by Microsoft as a successful one, a vocal minority of people reported that their consoles were crashing due to overheating. VNUNet points out that console manufacturers often take advantage of new processor technology as it becomes available, so this may not be a direct response to Xbox 360 overheating issues.[Thanks, SloopyDrew. Via VNUNet]
Over a million 360s per month by end of '06
Winstron, one of Microsoft's three manufacturing partners (in addition to Flextronics and the recently recruited Celestica) has announced they will be roughly tripling their production capacity to "reach a capacity of one million units per month by the end of the year." With all three partners pumping out 360s, Microsoft's manufacturing troubles will seem like a thing of the past come holidays '06. With Sony's PlayStation 3 due to launch in November, Microsoft's major tactical advantage (in addition to polished, second-wave titles) will be an abundance of consoles. With Sony facing a worldwide launch, with a technologically impressive system, they face the same risk Microsoft is just now overcoming: shortages. When little Billy wants next-gen gaming, Mom and Dad might see the possibly cheaper and readily available Xbox 360 as an adequate substitute. Who knows, maybe little Billy won't even mind so much when he's playing Gears of War or Too Human.
Germans foiled again?
Microsoft has issued a semi-heated response to the German sprockets who wondered if a curious piece of foil on the 360 heatsink may be the cause of the console's much-discussed toaster oven issues. From Gamerccore Blog (run by Xbox employees): The video and photos posted by German blog GameStore24.de show thermal interface pads that are not installed incorrectly. They are installed per specification. This foil eliminates the need of a protective liner, which simplifies the final assembly process and minimizes shipping concerns and contamination issues. The manufacturing team pointed me to the exact part we used. The part in question can be found here at Chromerics.com: THERMFLOW T558 is recommended for applications where rework and ease of disassembly are important. This new material provides the high performance properties typical of free-film phase change materials with the added benefit of easy removal. T558 is the same phase material as T557 which has been coated on one side of a conformal metal foil carrier. It is easily attached onto a heat sink or heat spreader, leaving the metal foil surface exposed. This foil eliminates the need of a protective liner, which simplifies the final assembly process and minimizes shipping concerns and contamination issues. Note the spec sheet above that refers to gray/silver foil. The Xbox-Scene forums have some interesting discussion on the matter. So were the Germans off base? Is MS off the hook? Is it possible some 360s got the T558 and some the "foil-free" T557? [Previously: Achtung! Xbox 360 overheating explained!]
CES: New manufacturer to address 360 shortage
One interesting snippet to come out of Microsoft's CES keynote is the addition of a third manufacturing partner--Celestica will join Flextronics and Wiston manufacturing 360s. Hopefully this will help the shortage somewhat.Microsoft's Peter Moore also said that 50 games will be available for the 360 by June, giving a glimpse of the 360's plans for dominance.
