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The future of console hardware design
The next generation has just barely become the new generation, but the folks at Semiconductor Insights are already thinking about what might be under the hood of the next generation of consoles. In an article at TechOnline, SI manager Allan Yogasingam discusses how the focus of system design has tilted from simple cosmetics for the Atari 2600 to "cost, heat [management], cooling and [efficiency] test." in the 30 years since.That cost bit might be the most important -- SI manager Greg Quirk predicts Sony and Microsoft will soon introduce 65 nanometer processors to reduce the costs associated with their current, 90-nanometer-chip systems. Yogasingam also predicts that the drive for cost reduction might lead console makers to look towards "second- and third-tier chip and software vendors " for the next generation. Someone better warn IBM that their gravy train might be in jeopardy. What else is likely to be in the next generation of hardware? The SI team thinks 802.11n wireless, tilt-sensitive MEMS controller sensors and other entertainment features are likely to stay hot, but that's not exactly rocket science. Where are the bold predictions for things like laser cannon attachments and Holodeck-style projectors.
ARM holdings confirms iPhone chips
InformationWeek reports that Warren East, president and CEO of ARM Holdings, confirmed that the iPhone will use at least three ARM processors. The main CPU will reportedly be a PXA320. So does this tell us anything new and important about the iPhone internals? Er, probably not much. But for those of you who enjoy these kinds of chip reveals, we seriously encourage you to go wild with the news.
Intel, IBM announce insulation "overhaul" for faster, cooler chips
Intel and IBM are acting oh-so-smug right now about their respective achievements in insulating 45nm transistors, allowing the chips to run faster, leak less power and generate less heat. Intel, which hinted at such improvements in June, knocked out the first press announcement, promising to start implementing the technology in the second half of 2007, and IBM scrambled to catch up, announcing that it was "on the verge" of a similar discovery, and was working with AMD to start building comparable chips in Q1 2008. Intel is calling this the "biggest change in computer chips in 40 years," and while that sounds like hyperbole to us, there's no denying that 45nm is the new hotness, and bully for Intel for making it work. The actual technology -- at least Intel's method -- replaces the silicon dioxide insulators which leak too much energy when sliced too thin, but when made thicker reduce the electrical charge that passes through, reducing performance. Now Intel is using a hafnium-based insulator, which improves conductivity and reduces leakage simultaneously. Just for kicks, Intel is also tossing in a new metal alloy for its gate electrode, to replace the old silicon gate. IBM confirmed it is also using hafnium insulators, but couldn't help getting in a cheap-shot metaphor: "It's the difference between can openers and Ferraris," according to Bernard S. Meyerson, VP and chief technologit for systems and technology at IBM. Man, those technologists can really bring the smack.[Thanks, Lee G.]
Samsung executive fixed pricing for chips in Apple computers
A Samsung executive will pay a quarter-million dollar fine and serve almost a year in prison after pleading guilty to memory chip price fixing. He violated the Sherman Antitrust Act when Samsung colluded with other companies to fix DRAM chip prices. Four other memory makers have been charged as well. The memory sales in question date back almost five years and were used in Apple, HP and Gateway computers.
California crooks nab 100,000 microchips
Proving that Malaysian industrial complexes aren't the only venues where shoddy security can facilitate the theft of thousands of PC components, a pair of crooks in California turned a minor fender bender into a successful heist of some 100,000 microchips on Tuesday afternoon. Police suspect that the men had been planning the crime for some time, as the victim's Fremont-bound Mazda MPV had just left a warehouse with $190,000 worth of chips when the robbers rear-ended it with their white van; rather than using weapons to subdue the driver, however, the two thieves simply waited until he exited the vehicle to discuss the accident, when one of them proceeded to slip into the minivan and drive away. The driver of the van followed suit, leaving the victim standing on the side of the road, no doubt confused and worried that his employer would chew him out for being so careless with the precious cargo. Although the brand of chip has not been revealed, since this all went down in Santa Clara, it's not too difficult to figure out whose products got pinched. So far authorities have no leads as to the whereabouts of the chips or the two robbers, but if someone in an MPV with license plate 4NKV115 tries to sell you a CPU for a buck and some change, do the right thing and notify law enforcement officials after you've purchased enough silicon to meet your needs. And if you're driving back home with your cheap booty when someone happens to ram your car, for heaven's sake, don't leave the keys in the ignition when you get out to exchange insurance info.[Via Boing Boing]
IBM to future game makers: Stay in school
The vagaries of computer chip design don't usually hold a school child's rapt attention. But tell the student how that chip design relates to video games and things might go a little differently.That was clearly IBM's hope when they invited over 300 New York area children to its $2.5-billion East Fishkill manufacturing plant this week to show them how the chips behind today's game systems get made. The trip was part of a program to encourage math and science education by "making the subjects interesting and relevant to them."To that end, IBM showed the students how math and science make games possible, and how the technology behind video games is being used in everything from health care to energy exploration. The students also got to get some hands on time with the next-gen systems, which we're sure made them forget all about that boring educational stuff.With IBM chips in all three next-gen systems, the company clearly has a vested interest in promoting its position at the forefront of gaming hardware technology. Still, it's always nice to see a corporate mega-conglomerate giving something back to the community.
Intel's Penryn Core 2 Quad processor "on schedule"
With the rampant delays swarming nearly every aspect of consumer electronics, it's understandable to approach "release dates" with a certain level of skepticism, but Intel's Mark Bohr has stated that the company is already "processing the first samples of the Penryn design," which is good news for Intel fans everywhere. The 45nm, quad-core successor to its Core 2 Extreme QX6700 was previously scheduled to be released "sometime during Q3 2007," and just as Intel nailed their November target on its latest Kentsfield chip, it just might be safe to put a little stock in this date as well. Dubbed the Core 2 Quad, this next generation processor will seek to increase power, consume less energy, and primarily outgun AMD by releasing its 45nm CPUs only months after AMD launches its 65nm Barcelona. Additionally, Penryn could play a role in the part of Montevina, which according to Intel's roadmap, would be the successor to Centrino Pro. Nevertheless, Intel's done a fair job of keeping its promises as of late, so we're banking on them keeping this one as well, which means the first batch of Yorkfield-derived wafers should hit motherboards "in the second half of next year."[Via RegHardware]
MS opens in-house chip lab for Xbox 720
The NY Times reports that Microsoft is ending its partnership with IBM to found it's own chip design lab to work on chips for a planned third generation Xbox:The design effort will initially be split between research labs at the company's headquarters in Redmond, Wash., and its Silicon Valley campus here. Tentatively named the Computer Architecture Group, the project underscores sweeping changes in the industry. One reason for the effort is that Microsoft needs to begin thinking about the next-generation design of its Xbox game console, said Charles P. Thacker, a veteran engineer and Microsoft engineer who will head the Silicon Valley group. Voice recognition may also be an area where the research could play a significant role. Thacker is famous in certain circles for his work at the Xerox Palo Alto Research Center. The division will be called the "Comupter Architecture Group" which isn't the snazziest name ever, but then, neither was IBM.
Platinum-coated virus to be used for speedy memory
All the hip-cool scientists these days are enslaving living organisms to do their bidding. Luckily, they're sticking with the micro end of the size spectrum, or "nano" end in this case. Apparently they've managed to create some supa' fast memory chips by coating 30-nanometer-long bits of tobacco mosaic virus (pictured above in its natural habitat) with itsy-bitsy platinum nanoparticles. Millions of these virus transistors could eventually end up in MP3 players or digital cameras, speeding up image capture or file transfer. We're not exactly sure what makes these virus transistors so special, but apparently the transistors they've built out of the nano-coated strands, and sandwiched between two electrodes, are easy to switch between ON and OFF states, since they don't need to build up a charge at a lame-o capacitor before they can be switched. We suppose we'll just have to trust the methods of these "well meaning scientists who might just instigate the end of civilization through their attempts to advance humanity through science." If it means faster memory chips, that's a risk we're willing to take.
AMD CEO: AMD + Apple inevitable
During an Intel-bashing session at the Commonwealth Club in San Francisco, The CEO of AMD, Hector Ruiz, whined remarked that an AMD + Apple partnership is in their cards: "Knowing Apple, why would they want to be held hostage like everyone else has been?" Of course, Apple wasn't available to comment on whether Mac users could have AMD inside anytime soon.While I try to manage my shackled ankles that this iMac imposes, I'll let you check out the full rundown of what Ruiz had to say at Bloomberg.[via Engadget]
Apple trying to keep iPod nano chip manufacturers a secret?
I should have noted this when we found iLounge's 2G iPod nano dissection gallery, but it seems that Apple has (strangely) opted to take a step towards keeping their new iPod chip manufacturer's identity under wraps (strange because we already knew Samsung won PortalPlayer's old contract). As iLounge notes about their gallery, you can see three chips stamped with Apple's logo, and absolutely none from PortalPlayer (which we were expecting). It is believed that Wolfson and Philips are the other two namelessly Apple-branded chips, though I have to admit I'm a bit perplexed as to why Apple went to all this trouble in the first place. I mean, their attention to detail is admirable, and their logo is cool and all - but how many nano owners do they expect will ever check under the hood?
Intel embedding lasers into silicon for speedy data
In what's being marked as a breakthrough in the world of "photonics," Intel has managed to squeeze laser beam functionality into silicon-based chips, allowing for high speed data transfer between chips on the cheap. The new technology should be a boon to both high-end computer manufacturers and the fiber-optics industry, allowing for cheaper, smaller and faster optical switching of high volumes of data. Intel managed the feat by bonding some light-emitting indium phosphide to the surface of a regular ol' silicon chip that has been etched with light-directing channels. With billions of lasers in one place, the chips should help with the "last mile" problem of bringing fiber to the home, and resolve most bandwidth bottlenecks inside your computer -- though that type of consumer application could be quite a few years down the road. Commercial versions of the chips are still years away, but we're liking where this is headed.
Oki Electric Industry intros "world's smallest MP3 chip"
As decreasing chip sizes seems to be all the rage these days, Japan's Oki Electric Industry isn't missing out on its own opportunity to go small. The company recently announced that sample shipments of the "world's smallest MP3 playback chip" were being dispersed, and that manufacturers of cellphones, PDAs, MP3 players (clearly), and essentially anything in which MP3 playback could be crammed into should take notice. The minuscule module -- dubbed the ML2011 -- packs an MP3 decoder and 650mW amplifier onto a 3.6mm x 4.2mm wafer, and can be conveniently paired with Oki's reference board and "SoundLib" software in order to bypass that whole headache-inducing "playback software development" phase. If you can spare just a tad more room, and want something that's instantly mountable, the 5mm x 6mm QFN-packaged version is also on the horizon. While pricing details were kept under wraps, Oki plans to ramp up full scale production by December, and will probably lobby mighty hard to get under the hood of Motorola's next cash cow.[Via CrissCross]
Marvell intros first combo WiFi / Bluetooth chip for portables
We wouldn't even think of buying a cellphone that didn't incorporate both WiFi and Bluetooth, so you better believe we were excited to learn of semiconductor manufacturer Marvell's new combo 802.11a/b/g - BT chip for portables, which is supposedly the first of its kind. The so-called 88W8688 -- which supports Bluetooth 2.0 and hardware acceleration for UMA, IMS, etc. -- has a footprint of less than 80-square-millimeters, or about half the size of current two-chip combinations. For consumers, this will mean smaller versions of all the gadgets we love, and most importantly for us, those super-functional-but-chunky smartphones that we feel naked without. Although the chip is currently shipping to select Marvell OEM partners, it has yet to announced which specific device categories will see the first implementations; our plea: get these puppies to HTC as quickly as possible!
Self-healing chips could function forever
Although you may have never given a thought to what transistors do to repair themselves when certain sectors fail, there are a few organizations who make it their life's work. Researchers from the National Science Foundation, the Semiconductor Research Corporation, and the University of Michigan have a mission to complete before their grant money runs dry: to create semiconductors that can heal themselves without the burdensome redundancy currently used. The goal here, which could seem a tad superfluous until you consider these chips operate in things like airplanes and medical devices -- you know, fairly critical applications -- is to design a semiconductor that runs more efficiently and can be counted on to function no matter how crucial the situation. By designing a chip that can auto-detect a problem, then shift the resources to a functioning area while the chip diagnoses and repairs the issue with help from "online collaboration software," you'll get a slimmer semiconductor that suffers no noticeable loss in performance while self-repairing. If this circuitry talk has your wires all crossed up, here's the skinny: more dependable chips will make everyone's life a bit easier, and if the team's plan is free of defects, we can expect to see prototypes within the next three years. [Via Mobilemag]
Intel announces Rosedale II mobile WiMax chip
With its Rosedale I fixed WiMax chip already out the door, Intel is now focusing on the real holy grail of this technology -- mobile WiMax -- with the just-announced Rosedale II long-range wireless solution. According to company exec Chris Beardsmore, Intel already has ten confirmed customers for the new chip, who will begin producing compatible products later in the year. As you might expect, the first implementations of Rosedale II will involve external laptop cards, while integration into the Centrino platform should happen late next year or in early 2008. Intel is pushing mobile WiMax as a better alternative to the 3G networks offered by cellular providers, and as long as it helps force companies like Verizon to lower the fees on their pricey broadband data packages, we're all for a swift and widespread deployment.[Via WiMax Networking News]
Intel fights AMD's 4x4 with new quad-core tech
There aren't many arguments that Intel has a winner -- however temporary -- with their new Conroe Core 2 Duo chips, but they aren't relaxing just yet. With the oncoming threat of AMD's 4x4 chips in the performance/gamer space, Intel is getting a bit of quad-core action of their own with the new Kentsfield and Clovertown setups for consumer and server use respectively. Originally due in the first half of 2007, near when AMD's "Conroe killer" K8L was set to drop, both have been bumped up to fourth quarter '06 status, which sure has Intel looking smug. There are differences, however, in approach: Intel's Kentsfield architecture squeezes four cores into one socket, as compared to the dual sockets used by AMD's 4x4. This means the Intel chips will have less memory and frontside bus bandwidth available to each core, which will hurt them some in the performance race, but it also means cost savings that could give them an edge in the bang for buck arena. If anything, this is an indication of the intense competition going on for our chip dollars, and even if the quad-core war is a bit of a semantic one, we'll accept all the Photoshop crunching and AI processing power these guys want to push our way.
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RFID to prevent loss of surgical sponges inside patients
We always said those sophisticated tracking tags had to be good for something other than data processing and jazzing up passports, and as the list of applications continues to grow, a study at Stanford University is showing how RFID chips can be used to potentially save lives. 1 out of 10,000 surgery survivors will experience the misfortune of having a foreign object remain in them after they're all sewn up, and nearly 67% of those remnants are surgical sponges. The traditional tracking system (eyes and careful counting) has failed enough times to cause 57 deaths since 2000, definitely not something you want to hear when you're going under the knife. Researchers have determined that tagging sponges (and other supplies) with RFID tags allows for a chip-reader to scan the body and detect any remaining, erm, used paraphernalia, yet to be removed. Volunteer-led studies have shown a perfect success rate in discovering leftovers thus far, and hopes are to have every instrument in the OR RFID'ed. This may make a few folks queasy, but we're all for keeping our innards a sponge-free environment.
Intel selling mobile chip unit to Marvell
The rumors of Intel searching for a buyer were circulating, and it looks like they were true: Intel is selling off their mobile chip arm -- responsible for the quite successful XScale group of processors -- to Marvell Technology Group for $600 million. With chips making notable appearances in Treo, Blackberry and HTC devices, and pulling in a reported $250 million in revenue last year, we're still scratching our heads as to why exactly Intel would want to get rid of such a successful portion of their business. We'd think powering smartphones would be a priority for Intel right now, but the word is that Intel will have an option to receive $100 million of the purchase price in Marvell stock, so they might not be out of the game entirely. The chip unit currently employs 1,400 people, and Marvell plans to retain the "vast majority" of them, so this move shouldn't be too traumatic for most parties involved. We just hope they keep up with the R&D to get us smaller, faster, cooler and cheaper chips on the regular.
Intel reveals Core 2 Duo info and ULV Core Duo CPU
Intel is using this week's Computex trade show to reveal various bits of information about upcoming additions to the Core Duo family, including details on the chipset that will support the new Core 2 Duo (formerly known as Conroe) processors as well as the existence of an impending low voltage version of the current Core Duo CPU. Senior Vice President Anand Chandrasekher announced that the 965 chipset will come in three versions (P965, G965, and U965) sporting either Core 2 Duos or Core 2 Extremes -- the latter chip coming in July in a 2.93GHz version, followed by a 3.2GHz model later this year -- along with DDR2 memory as fast as 800MHz. As for the new ULV Core Duo processor, the company claims that it will sip an average of just 0.75 watts (compared to the one to two watts consumed by the already efficient Core 2 Duo), and be available in a 1.06GHz configuration called the U2500 for $289 this summer. Release dates for the Core 2 Duo chip are still unknown, although a press conference being held tomorrow may contain that key piece of info, which is already being reported by some sources as July 23rd.
