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Intel delivers record earnings yet again in Q2 -- let the boardroom bragging begin
We know, you've heard it all before, but the chip maker's once again reporting record revenues, reaching a whopping $13.1 billion in Q2 2011. If you're keeping track, that's up $2.3 billion, or 22 percent, from Q2 2010, and bests last quarter's earnings of $12.9 billion by 2 percent. Net income was up 10 percent year-over-year, but down three percent from last quarter, ringing in at $3.2 billion. As Intel humbly points out, this is the outfit's fifth consecutive quarter of record revenue. So, perhaps a little bit of gloating is in order.
Apple considering TSMC mobile chips?
We hope you're ready for a heaping helping of Apple speculation, because Reuters is serving up a nice big slice of rumor pie today. According to the ever-present "source with knowledge of the matter," Taiwanese chipmaker, TSMC is gearing up to supply Apple with its next generation mobile processors. According to the apparently credible anonymous source, TSMC has already begun trial manufacturing on the chips and "has got all the authorization and details ready." As you may already know, Apple's current supplier of its A5 CPU is Samsung, and relations between the two have been rocky (at least in court). This round of speculation also comes just one year after TSMC began construction on its new $9.3 billion foundry, and teamed up with ARM -- the brains behind the A5. Of course all parties have declined to comment, which lands this report squarely in the grapevine for now, but we'll keep you posted if it winds its way into reality.
Freescale expands its family of i.MX50 chips, goes beyond e-readers this time
We had a feeling that Freescale was onto something when it debuted the i.MX508, a system-on-a-chip that carried the promise of $150 e-readers (and the reality of $129 ones). Given that, we can see where the execs at Freescale would be feeling a bit heady, and might wonder where else they could help push down prices. That's exactly what we have here: the outfit is trotting out three new i.MX50 processors and, as you can see in that handy chart up there, they all sit even lower in the lineup than the low-cost i.MX508. Like the i.MX508, they all pack an 800HMz ARM Cortex-A8 processor, among other similar specs. The new i.MX507, in particular, resembles the i.MX508 in that it's designed to work with E Ink displays, though it lacks graphics acceleration, and Freescale imagines it'll instead find a home in outdoor signs and smart labels. Moving on down the line, the i.MX502 and the i.MX503 were both intended for devices with LCD -- not electronic paper -- displays, with the latter offering OpenVG graphics acceleration. If Freescale's predictions are on the money, you'll find the lower-end i.MX502 in DECT phones and vending machine displays, and the i.MX503 in personal navigators and medical monitoring tablets, among other use cases. For now, companies are sampling the chips, but they'll start shipping later this quarter for a song -- less than $10 for the i.MX502 at volume cost. Full PR after the break, and lots more technical details at the source link.
AMD's Fusion A-Series chips official: 10.5-hour battery life, DirectX 11 graphics, and USB 3.0 support (video)
AMD's Llano platform has been on our radar for more than two years, and finally, the company has come clean with its latest class of hybrid CPU / GPU chips, officially dubbed the Fusion A-Series. Unlike the low-power flavor of Fusion accelerated processing units already on the market, these 32-nanometer APUs were designed with desktops and mainstream laptops in mind, taking direct aim at Intel's Core 2011 processors with the promise of superior processing and discrete-level graphics, and 10-plus hours of battery life. Aside from the assorted performance and battery life claims the company is making (much more on that in a moment), what this means is that as far as laptops go, AMD is completely stepping away from the standalone-CPU-plus-GPU paradigm. But, the company will still make dedicated Radeon cards, which can be coupled with an APU for a 75 percent boost in graphics performance -- a setup AMD is calling "Dual Graphics." All told, these chips measure just 228 square millimeters. To put this in context, check out the gallery of hands-on shots below, featuring the A-series next to a standalone CPU, discrete graphics card, and, for the sake of scale, the kind of low-power Fusion chip introduced back at CES. A-Series-equipped PCs are already shipping, and AMD says we can expect to see at least 150 of them this year. That sounds promising indeed, but we've still got lots of technical details to rehash. Head on past the break for the full spill on what these APUs pledge to do, along with a video of AMD senior product marketing manager Raymond Dumbeck showing off some A-series laptops in action. %Gallery-124351%
Intel hints at option of custom chip foundry for big customers
Reuters is reporting that Intel "wouldn't blink" if given the chance to make custom chips for Apple's devices, like the iPhone and iPad. At an investor event in London on Thursday, Chief Financial Officer Stacy Smith told journalists that "there are certain customers that would be interesting to us and certain customers that wouldn't." Apple, unsurprisingly, is one of the first type of customer. Currently the A4 and A5 chips found in iPhones and iPads are manufactured by Samsung, but reports have hinted that Apple may be moving away from Samsung and jumping to Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) on a foundry basis. Given that Apple's A5 chip makes up a large portion of the $7.8 billion components contract Apple has with Samsung, it's no wonder that Intel would want to be a foundry chip maker for the Cupertino company. As Smith told reporters, "If Apple or Sony came to us and said 'I want to do a product that involves your IA (Intel architecture) core and put some of my IP around it', I wouldn't blink. That would be fantastic business for us." She did also say that Intel would have to put more thought into considering being a foundry for custom chips that didn't involve an Intel architecture core: "Then you get into the middle ground of 'I don't want it to be a IA core, I want it to be my own custom-designed core,' and then you are only getting the manufacturing margin, (and) that would be a much more in-depth discussion and analysis." [via MacRumors]
Next-next-gen Atom will be a system on a chip called 'Silvermont,' pack 3D transistors?
Last week, we were treated to an earful about Intel's plans for its future chips -- most notably, that it's committing to 3D transistors across the board. Well, that trickle of information hasn't run dry just yet -- today's tidbit gives us a peek not into the next-generation of Atom, but the one already in the works to come after that. The new processor, codenamed "Silvermont," will be a system-on-a-chip and is reportedly slated to ship sometime in 2013. CNET also cites unnamed sources who claim that it will be designed specifically to take advantage of Intel's 22nm technology and 3D transistors. As it stands, though, they boost the cost of wafers by two to three percent, so here's hoping that premium comes down before the netbooks of the future hit the market -- if we have netbooks in the future.
That hotel towel you're stealing might have an RFID chip in it
For many travelers, stealing hotel towels or bathrobes is more pastime than petty crime. Hotels, on the other hand, apparently take it more seriously. So seriously, in fact, that some have begun embedding specially crafted RFID tags within their linens, just to help us avoid "accidentally" stuffing them in our suitcases before heading to the check-out desk. The chips, designed by Miami-based Linen Technology Tracking, can be sewn directly into towels, bathrobes or bed sheets, and can reportedly withstand up to 300 wash cycles. If a tagged item ever leaves a hotel's premises, the RFID chip will trip an alarm that will instantly alert the staff, and comprehensively humiliate the guilty party. The system has already paid dividends for one Honolulu hotel, which claims to have saved about $15,000 worth of linens since adopting the system last summer. But small-time crooks needn't get too paranoid. In addition to the hotel in Hawaii, only two other establishments have begun tagging their towels -- one in Manhattan, and one in Miami. All three, however, have chosen to remain anonymous, so swipe at your own (minimal) risk.
Intel teases 32nm Cloverview tablet processor, 22nm Ivy Bridge CPU
It hasn't even been a week since Intel rolled out Oak Trail, and it's already teasing us with yet another tablet-ready chip called Cloverview. What's more, we're also seeing unofficial details emerging for its next generation Ivy Bridge CPU. Starting from the top: PC World is reporting that Intel's Doug Davis introduced the Atom-based Cloverview at the firm's Developer Forum in Beijing Tuesday, touting its 32nm architecture and low power consumption. Meanwhile a set of rather convincing slides are showing off the 22nm stylings of Sandy Bridge's successor, Ivy Bridge. From the look of things, the CPU will support DirectX 11 graphics, USB 3.0, and 1600MHz DDR3 memory -- its desktop platform has been christened Maho Bay. Ivy Bridge is reportedly expected to arrive in the first half of 2012, but we're still waiting on Cloverview's ETA. Isn't silicon fun?
Anand Chandrasekher resigns from Intel after 24 years, leaves scandal mongers hanging
Well, as tech industry resignations go, this one's not exactly sensational, but Anand Chandrasekher's plan to leave Intel is no doubt a popular topic of conversation with chip makers this week. The chief of the company's Ultra Mobility Group (UMG) and the man behind Atom, apparently resigned "to pursue other interests." Intel Architecture Group's Mike Bell and Dave Whalen will co-manage UMG in Chandrasekher's stead -- and that's about it for sordid details. His resignation isn't apt to be marked by a Mark Hurd-style scandal, and we have a feeling this is a pretty straight forward changing of the guards, but, then again, we said the same thing when Dirk Meyer left AMD.
Apple selects Taiwan's TSMC to produce its A5 chip
Apple is reported to have inked a deal with Taiwanese chip manufacturer TSMC to produce the A5 dual-core chip for the iPad 2, in a substantial blow to former producer Samsung. TSMC was apparently chosen over Samsung because tests showed it was consistently producing the chips more efficiently at 40 nanometers than was Samsung at 45 nanometers. It had the most capacity and highest yields in each batch. There are now suggestions that the deal between Apple and TSMC could stretch into the future, with the Taiwanese company producing the next generation of 28 nanometer quad-core chips. Samsung made the A4 chip in the original iPad along with the processor for the iPhone, but as a competitor producing the Galaxy S and Galaxy Tab, it's probably in Apple's interests to move away from Samsung if Apple feared the company would give production priority to its own devices in the future. Apple still depends on Samsung for the majority of the flash memory it uses in iPads, iPhones and iPods, but it has switched manufacturing partners in the past when it sees a commercial or technological advantage. [via Electronista]
Intel to spend $5 billion on new 14nm fab in Arizona, create 4,000 new jobs this year
When Paul Otellini isn't too busy talking about being jilted by Nokia, he spends his time hosting presidents and splashing billions of dollars on new manufacturing facilities. Intel's CEO is wrapping his tumultuous week on a high note, having welcomed Barack Obama to Chipzilla's Oregon facility and treated the president to the happy news that Intel will invest $5 billion back into the US economy by building its most advanced fab yet -- which will introduce an impossibly small 14nm production process -- in Arizona, to begin operation in 2013. Construction starts in the middle of this year and is expected to create "thousands" of jobs, both temporary and permanent. Aside from that, Otellini has disclosed Intel's intention to create 4,000 new jobs in the US, mostly in R&D and product development. Music to Obama's ears, we're sure.
Intel recalls Sandy Bridge, may affect future Macs
Intel announced on Monday that it was recalling its Intel 6 series chipset. This chipset is utilized in computers powered by the next generation Core i5 and Core i7 processor. These Sandy Bridge processors are expected to debut in the next refresh of the MacBook Pro and possibly the iMac. The flaw may result in the slow degradation of the SATA port, which could potentially affect the performance of hard drives and DVDs. Intel has issued a silicon fix and is re-manufacturing this chipset. The first batch of improved chipsets will arrive in late February, and manufacturing should be in full swing by April. The delayed availability of these Sandy Bridge processors may affect the production of Apple's upcoming MacBook Pro line, which was rumored to land as early as March. As it stands, Apple may not be able to begin manufacturing these second generation Core i5 and Core i7 systems until March, which means a launch in April or later is possible. Considering Apple refreshed the MacBook Pro in April 2010, this delay may not push it that far off from a yearly update. The iMac was updated in July 2010, and this delay should have minimal impact on the debut of the 2011 lineup of Apple's all-in-one computers.
IBM forms new partnership with ARM in hopes of developing ludicrously small chip processing technology
We've seen IBM and ARM team up before, but this week both companies announced a new joint initiative to develop 14nm chip processing technology. That's significantly smaller than the 20nm SoC technology ARM hopes to create in partnership with TSMC, and makes the company's previous work with IBM on 32nm semiconductors look like a cake walk. The potential benefits, though, are faster processors that require less power, and feature lower per unit manufacturing costs Who knows if or when we'll see tangible results from the tag team, but if IBM's Watson can beat Jeopardy champions, further reducing the average size of a feature that can be created on a chip should be elementary, right? To read over the full announcement check out the press release after the break.
Bang & Olufsen announce chip co-op deal with Intel
Well, along with all the other things that happened this year at CES, Bang & Olufsen announced a new cooperation agreement with Intel. What does that mean to you, the consumer? Not terribly much, on the outside -- B&O products have carried Intel chips in the past, but this marks the first time the two companies have had an official relationship, and should mean we'll be seeing refreshes of B&O products every time Intel brings forth new chips. And that's always great news, isn't it? Hit up the source link for full, flowery quotes from reps at both Intel and Bang & Olfusen. Full press release is after the break.
VIA Nano X2 low power, dual-core chip gets official
VIA has officially announced its Nano X2 low power dual-core chip. The chip comprises two of VIA's 64-bit Isaiah architecture cores, found in previous single-core Nano CPUs. The processors come with native 64-bit software support, VIA's PadLock hardware security features, and VT CPU virtualization technology. The new Nano X2 chips are compatible with VIA's previous processors, including the Nano, C7, C7-M, and Eden, facilitating easy upgrades. The VIA Nano X2 processors are already currently available for OEMs, with systems featuring the chips expected in the first quarter of this year. Full press release is after the break
Intel confirms Oregon plant will be ready to make 450 mm wafers
Intel's already boasted of its massive investment in a new 22 nanometer manufacturing process, and it's now confirmed that it's new plant in Hillsboro, Oregon, dubbed D1X will be ready to produce 450 millimeter wafers. Of course, "ready" seems to be the keyword here -- Intel will apparently stick with 300 mm wafers for a while yet, but have all the necessary preparations put in place to kick start 450 mm production when the industry is ready for it. That shift promises to both increase efficiency and cut costs by allowing more chips to be produced at a time, but it will likely still be years before we see any actual results -- one analyst speculates it could be 2018 at the earliest before 450 mm fabrication tools are ready.
Intel learns from Dr. Dre, wants Atom chips in NFL helmets to know when heads are ringing
We always understood that Intel looked after the rock stars of tomorrow, but who knew that included football players? Yup, according to PC World, Intel is currently investigating adding Atom chips inside NFL helmets to provide real-time impact data to medical staff on the sidelines. While there's no explicit time frame set for this project, we're thinking the sooner the better -- lest we forget it took the league until 2009 to require players who display signs of a concussion to stop playing for at least one day. This isn't the first time though that the world's largest chip maker has actually helped make the gridiron safer. In fact, it previously worked with helmet maker Riddell's fittingly named HITS (Head Impact Telemetry System) and academic researchers to run head injury simulations using linked Xeon-powered computers. Off the field, Intel is also currently partnering with the Mayo Clinic to boost medical cranial scans using MIC (Many Integrated Core) supercomputer co-processors. Codenamed Knights Corner, this hardware puts teacher's pets to shame by running trillions of calculations per second, and apparently accelerates head scans by up to 18 times. Sure, safety's all well and good, but we know Intel's really just curious about how Moore's Law holds up to the shoulder pressure of NFL d-backs.
Intel providing 22nm fabrication capacity to semiconductor start-up
Well, there sure are interesting things afoot in the land of Intel these days. Just last month the chipmaker announced a $6 to $8 billion dollar investment in factory upgrades to push ahead with hits 22nm manufacturing process, and it's now announced that its struck a first of its kind deal with upstart semiconductor company Achronix. That deal involves Intel actually giving Achronix access to its 22nm fab process, which Achronix will use to manufacture its 22i Speedster FPGAs (said to boast a 300% higher performance and 50% lower power than FPGAs using any other process technology). While that arrangement is notable in and of itself, Intel seems to be going out of its way to downplay the size of the deal. In a blog post discussing the matter, Intel's Bill Kircos notes that the deal "would only make up a tiny amount of our overall capacity, significantly less than one percent, and is not currently viewed as financially material to Intel's earnings." He does add that it is an "important endeavor" for Intel, though, which could possibly suggest that Intel is using the company as a testbed of sorts for its new manufacturing process.
Globalfoundries takes ARM Cortex-A9 into 28nm land, looks forward to 20nm chips in 2013
Forget the numbers, here's what matters: Globalfoundries' new production capabilities will lead to "smooth production ramp-ups and faster time-to-market" for its customers. Now consider that this promise relates to scrumptious 28nm Cortex-A9 SOCs and feel free to rejoice. The chip fabricator has just declared itself ready to take orders for ARM's systems-on-chip built using its high-k metal gate 28nm fab process. This fulfills its pledge for mass production in the latter half of 2010, but lest you think Globalfoundries is resting on any nanoscale laurels, it also has a 20nm roadmap to tell you about. It's very simple, really: expect even smaller, even more power-efficient silicon in 2013. We don't know if the future will be bright, but it sure looks like it's gonna be small.
HP Labs teams up with Hynix to manufacture memristors, plans assault on flash memory in 2013
The memristor's come a long way since being hypothesized back in 1971. If you ask HP Labs, the history of this particular memory technology didn't hit its next milestone for almost four decades, when the company produced the very first memory resistor chip. Just last month, the Labs group proved its little transistor could handle logic and data storage, and as of today, the company's announcing a joint development agreement with Hynix Semiconductor, with a goal of bringing these chips to the market -- and rendering flash memory obsolete. That challenge against flash (not a very popular naming convention these days, it seems) was thrown down by HP Labs Senior Fellow Stan Williams, who posits that the memristor is "an universal memory that over a sufficient amount of time will replace flash, DRAM, magnetic hard disks, and possibly even SRAM." But onto the immediate, albeit aspirational goal (i.e. not a commitment, which he stressed on multiple occasions): Williams hopes to see the transistors in consumer products by this time 2013, for approximately the price of what flash memory will be selling for at the time but with "at least twice the bit capacity." He also claims a much smaller power requirement of "at least a factor of 10" and an even faster operation speed, in addition to previously-discussed advantages like read / write endurance. With Hynix on board, the goal is to make these "drop-in replacements" for flash memory, whereby the same protocols and even the same connectors will work just fine. For HP, however, Williams says there'll be an initial competitive advantage for the company due to its comfort level with memristors' unique properties, but that other companies will be encouraged to license the technology and experiment with new possibilities in hardware design. Williams wouldn't give any specific product examples where we might initially see the memristor, except to repeat that it'll be anywhere and everywhere flash memory is. Fighting words, indeed. We normally don't get excited about minute hardware components -- not often, at least -- but we gotta say, the seeds of the future look mighty interesting. Can't wait to see what germinates. Highlights from our talk with Williams after the break. %Gallery-100780%
