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Intel roadmap reveals 10-core Xeon E5-2600 V2 Ivy Bridge CPU
Intel may have recently spilled its Q3 guts for 2012, but we highly doubt that the chip maker planned on outing its forthcoming projects for next year. An alleged internal slide makes the claim that the silicon giant plans to introduce a 10-core Xeon E5-2600 V2 Ivy Bridge-EP CPU in the third quarter of 2013. Compatible with Socket R LGA 2011 motherboards, this brute will max out at 20 threads through HyperThreading. Packing 30MB of L3 cache, this unannounced Ivy Bridge supports up to 1866MHz of DDR3 system RAM. If these specifications have whet your appetite, the Xeon E5-2600 V2 is only the tip of the iceberg -- Chipzilla is said to also have a 12-core processor in the pipeline as well.
Intel finishes crossing the Ivy Bridge with new desktop Core i3 models
Intel has been staggering the rollout of its Ivy Bridge processors over the space of nearly half a year, starting with its higher-end quad-core chips; it's finally time for the company to complete the story and ship some budget Core i3 desktop parts. The semiconductor giant is coy about the new roster at this stage, but it does promise both regular (s-series) and low-power (t-series) Core i3 chips at clock speeds between 2.8GHz and 3.4GHz. If the past is an indicator, the new components will be mostly or exclusively dual-core and lack extras like Hyperthreading -- they will get Intel's newer integrated graphics and other perks through the upgrade, however. Bulk pricing and other details haven't yet been aggregated in one place, although we're seeing that even the faster 3.3GHz Core i3-3220 is selling at retail for $130. We wouldn't expect anything from Intel's new offerings to break the bank.
IBM pushing System z, Power7+ chips as high as 5.5GHz, mainframes get mightier
Ten-core, 2.4GHz Xeons? Pshaw. IBM is used to the kind of clock speeds and brute force power that lead to Europe-dominating supercomputers. Big Blue has no intentions of letting its guard down when it unveils its next generation processors at the upcoming Hot Chips conference: the company is teasing that the "zNext" chip at the heart of a future System z mainframe will ramp up to 5.5GHz -- that's faster than the still-speedy 5.2GHz z196 that has led IBM's pack since 2010. For those who don't need quite that big a sledgehammer, the technology veteran is hinting that its upcoming Power7+ processors will be up to 20 percent faster than the long-serving Power7, whose current 4.14GHz peak clock rate may seem quaint. We'll know just how much those extra cycles mean when IBM takes to the conference podium on August 29th, but it's safe to say that our databases and large-scale simulations won't know what hit them.
FDA approves Proteus Digital Health's e-pills for dose monitoring
An "ingestible sensor" doesn't sound like the tastiest of snacks, but soon it might be just what the doctor ordered. A tiny microchip which activates upon contact with stomach acid has recently been given the green light by the US FDA. When the sensor is swallowed, an external patch picks up its signal and shoots a message over to whoever it's supposed to. The technology is aimed at tackling an issue known in the healthcare biz as compliance -- or, following instructions. Correct timing and dose are important for many drugs, and lax schedules can be responsible for treatment failures or the development of nasty drug-resistant bugs. Although the pills have only been used in trials, one pharmaceutical heavyweight has already bagged a license to the technology for real-world applications. If you don't like the thought of a belly full of microchips, no need to worry -- the harmless sensors pass naturally after completing their mission.
Qualcomm enlists Samsung, UMC to help meet 28nm Snapdragon S4 demand
Qualcomm's Snapdragon S4 chipset is certainly hot (well, not too hot), but it looks like demand is expected to grow even further, causing the San Diego-based SoC maker to turn to allies in the east to help beef up supply. According to China Economic News Service, United Microelectronics Corp. (UMC) and Korea-based Samsung will join Taiwan Semiconductor Manufacturing Co. (TSMC) to manufacturer the 28nm chips beginning later this year, in an attempt to increase S4 availability ahead of the Windows RT launch. The article cites Qualcomm CEO Paul Jacobs as saying that a shortage is expected to continue, due to the complicated techniques necessary to manufacturer 28nm chips, and that the company may consider adding its own manufacturing plant in the future. All in all, it doesn't seem like a terrible position for QCOM to be in. Full details are at the Taiwanese source link below.
Engadget Primed: why nanometers matter (and why they often don't)
Primed goes in-depth on the technobabble you hear on Engadget every day -- we dig deep into each topic's history and how it benefits our lives. You can follow the series here. Looking to suggest a piece of technology for us to break down? Drop us a line at primed *at* engadget *dawt* com. Welcome to one of the most unnecessarily complicated questions in the world of silicon-controlled gadgets: should a savvy customer care about the underlying nature of the processor in their next purchase? Theoretically at least, the answer is obvious. Whether it's a CPU, graphics card, smartphone or tricorder, it'll always receive the Holy Grail combo of greater performance and reduced power consumption if it's built around a chip with a smaller fabrication process. That's because, as transistors get tinier and more tightly packed, electrons don't have to travel so far when moving between them -- saving both time and energy. In other words, a phone with a 28-nanometer (nm) processor ought to be fundamentally superior to one with a 45nm chip, and a PC running on silicon with features etched at 22nm should deliver more performance-per-watt than a 32nm rival. But if that's true, isn't it equally sensible to focus on the end results? Instead of getting bogged down in semiconductor theory, we may as well let Moore's Law churn away in the background while we judge products based on their overall user experience. Wouldn't that make for an easier life? Well, maybe, but whichever way you look at it, it's hard to stop this subject descending into pure philosophy, on a par with other yawnsome puzzles like whether meat-eaters should visit an abattoir at least once, or whether it's better to medicate the ailment or the person. Bearing that in mind, we're going to look at how some key players in the silicon industry treat this topic, and we'll try to deliver some practical, offal-free information in the process.
Newport Media claims tiniest, lowest-power 802.11n WiFi chip yet, smartphones get a little less thirsty
Cellular chipsets get all the love these days, but it's WiFi that's still the most ubiquitous -- and often the most consistent drain on the battery. Newport Media might have that last problem solved through its new NMC1000 chip. The part is billed as the lowest-power 802.11n wireless system-on-a-chip you'll find, and potentially a big help to smartphones and other devices that lean heavily on a wire-free existence. At just 2.5mm (0.1 inches) square, the equally record-setting size should also please device makers trying to squeeze wireless into an exceptionally tiny footprint. If you're as excited about the prospect of WiFi everywhere as Newport's Stock Photography Woman above appears to be, you can get more details below and expect full-scale production in the fall.
Researchers develop silicon ReRAM chip, send warning shot to Flash memory
Does the word ReRAM ring a bell? No? Well, the key point is that it's much faster than NAND memory, and it's making its way into chips from Elpida, Sharp and Panasonic. Further proof that ReRAM is on the up and up? Researchers at University College London have used this technology to make a chip that operates at 100 times the speed of standard Flash memory. The device is composed completely of silicon oxide, which improves the chip's resistance, and it doesn't require a vacuum to work (which makes it cheaper to produce). But this new chip is more than just a faster alternative to Flash; its ability to move between different states of conductivity means it can be configured as a memristor, or a device that handles both data-processing and storage tasks. In the long term, researchers hope this technology can pave the way for silicon oxide CPUs -- and UCL is already using this design to help develop transparent memory chips for mobile devices. Need to know more? Feast your heart on the gritty details via the link below.
Intel sets sights on 5nm chip; already gearing up fabs for 14nm production
Ivy Bridge, Intel's first generation of chips to use the 22nm fabrication process, is hardly out of the gate, and yet talk has already turned to the company's next manufacturing technologies. According to Xbit Labs, which got its hands on some telltale slides, Paul Otellini et al. have the roadmap for 10nm, 7nm and 5nm processes locked down, and the company is preparing fabs in the states and Ireland to make chips using the 14nm fabrication method. Given that timeframe, Intel says 10nm chips will ship in 2015, with work on 5nm technology beginning that same year. While the slides in question look legit -- and that timeline matches previous reports -- we're not sure just when these mystery slides first made the rounds. Alas, we'll have a good few years to sort 5nm fact from fiction.
NVIDIA confirms no 'Project Grey' until 2013, Tegra 3 LTE later this year
While earnings calls are rarely the veritable dial-in party, sometimes they do toss up a juicy gambit or disappointing revelation. While NVIDIA was dishing out projections for Q1 2013, it pretty much quashed any hopes of seeing an in-house LTE Tegra chip in 2012. While we were assured that Tegra 3 LTE phones would come this year -- based on those partnerships announced back in February -- it was also stated that the thoroughbred Tegra LTE chip wouldn't be a reality until 2013. So, this pretty much ties in with what we had heard, but this time, from the horse's mouth.
Series revisits ARM's humble beginnings, BBC Micro and all
If you read our interview with ARM co-founder John Biggs, you know the company behind the processor in most smartphones had quite modest beginnings, what with an office in a barn and all. But Biggs is only part of the story, and Reghardware fleshes the rest out with a two-part series on the "unsung heroes of tech": Sophie Wilson, Steve Furber and Herman Hauser, the team behind Acorn Computers, the British PC company that spawned ARM in the mid-80s. We'll let you click through to the source links to take the journey yourself, but here are a few highlights: earning a computer contract with the BBC, happening upon ARM chips' low power consumption by accident and striking gold thanks to a partnership with Apple.
TSMC ramps 28nm ARM Cortex-A9 chip to 3.1GHz, gives your desktop jitters
We know TSMC's energy-miser 28-nanometer manufacturing process has a lot of headroom, but the company just ratcheted expectations up by a few notches. Lab workers at Taiwan's semiconductor giant have successfully run a dual-core ARM Cortex-A9 processor at 3.1GHz under normal conditions. That's a 55 percent higher clock speed than the 2GHz maximum that TSMC normally offers, folks, and about twice as fast as a 40nm chip under the same workload. Don't expect that kind of clock speed from your next smartphone or tablet, though: expect processors of this caliber to find "high-performance uses," which takes us that much closer to NVIDIA's Project Denver as well as other ARM-based desktops, notebooks and servers that should give x86 chips a run for their money.
ST-Ericsson to pass off application processor business to STM, cut 1,700 jobs
It's not every day that ST-Ericsson crosses our radar twice, but in addition to reportedly signing a deal with HTC for developing low-end handset chips, the company just announced its plans for a turnaround. The message? A heavier focus on SoCs for smartphones and tablets, along with a push for even more partnerships to develop those products. While that all sounds rosy, ST-Ericsson is also ceding its application processor business -- employees, R&D and all -- to STMicroelectronics. All told, between the loss of its application processor business and other reshuffling, the company expects to shed around 1,700 jobs -- and save about $320 million annually. Those bittersweet details and more await you in the press release after the break.
Globalfoundries buys out AMD stake to become fully independent chip maker
Globalfoundries has celebrated its third anniversary by announcing that it's agreed terms with AMD to buy out its remaining stake in the company to go it alone. Whilst Sunnyvale will remain a key customer to the chip foundry, the nuts and bolts of ownership will be wholly in the hands of ATIC. The company now provides a big chunk of AMD's 32nm wafers and is now kicking off a $3 billion spending plan to kit out its facilities in Singapore, Germany and New York. It looks like the single life will allow it to spend equal time and effort refining those 20nm ARM chips promised for 2013 as well as its new partnership with IBM.
NTT Docomo, Panasonic, Samsung and more team up to take on Qualcomm over cellphone chips
Japanese mobile operator NTT Docomo just announced (as had been rumored) it's forming a joint venture with five partners -- Samsung, Panasonic, Fujitsu Limited, Fujitsu Semiconductor and NEC -- to develop and sell chips for mobile devices. According to the press release the fabless JV will get started once all involved finish hammering out the details and focus on creating LTE-connected products for the global market. NTT Docomo is investing $5.8 million to create a subsidiary, Communication Platform Planning Co., in preparation with one of its executives as CEO. Currently Qualcomm makes the majority of chips found in smartphones, but it appears to have some high-powered competition on the way soon.
AMD ships '16-core' Bulldozer-powered Opteron 6200
We seem to have mislaid our definition of fashionably late -- a fortnight after the promised "October" launch, systems packing AMD's Bulldozer-powered Opteron 6200 (formerly Interlagos) will commence shipping to enterprise customers. If you haven't been paying too much attention, you might just believe the claim about it having 16 cores -- Bulldozer's architecture has eight two-core modules rather than 16 independent ones. Despite the short delay and the conspicuous claims, the company reckons it's 84 percent faster, 73 percent more efficient and uses half the power of the equivalent Intel Xeon. At the same time, Sunnyvale firmed up news on the Valencia (Opteron 4200) and announced 2012's Opteron 3000 platform with the new Zurich chip -- designed to run on low-power web hosts. Enterprise customers can read the PR we've got after the break and then begin placing orders; the rest of us will have to keep waiting to see if Andre Yang can push his FX all the way to 9GHz.[Thanks, Khan]
Intel and MasterCard to offer Ultrabook users 'safer' NFC checkout via PayPass, impulsive shoppers rejoice
Entering a 16-digit credit card number may be a thing of the past with a new initiative from MasterCard and Intel, which allows users to checkout online by tapping a PayPass-enabled card, tag or smartphone to their Ultrabook. Calling the checkout "safer" and "simpler," Intel is bringing its Identity Protection Technology to the potluck, giving shoppers two-factor authentication and chip-based display protection when forking over that hard earned cash. Here's how it all works: when you tap a NFC smartphone or other PayPass-enabled device, it will communicate with the Ultrabook, generating a six-digit code from the embedded processor or from within the Manageability Engine. The ME hardware, encrypted with third-party algorithms, then transacts with the e-commerce site, hopefully offering shoppers more protection than standard software solutions. Since using the feature requires an NFC-connected device as well as the Ultrabook and a username and password, forgetful folks who tend to misplace their phone or computer won't have to worry about unwarranted spending. Sadly, the solution won't protect your wallet from the perils of a late night shoe shopping spree. Check out the full PR after the break.
AMD ships 16-core Bulldozer chips for servers, makes consumers wait their turn
AMD's Interlagos, its server-styled Bulldozer chip -- Mr. Opteron 6200 to you and me -- is being pushed out to retailers and OEMs ready for an October launch. AMD is calling it the first 16-core x86 processor, although as we know from the required reading, it has eight two-core shared modules rather than 16 independent ones. The chips are compatible with Socket G34 motherboards, but most of this first production run will go straight into supercomputer projects. AMD remains mute on progress of the consumer-level Zambezi, but rumors are that the company can't clock it fast enough to compete with Intel's Core i7 -- the very class that Bulldozer was designed to bury. [Thanks, Sebastian]
IBM and 3M join forces to fab 3D microchips, create mini-silicon skyscraper valley
3D hype is fast wearing out its welcome, but there's at least one area of industry where the buzzed about term could usher in true innovation. Announced today as a joint research project, IBM and 3M will work towards the creation of a new breed of microprocessors. Unlike similar three-dimensional semiconductor efforts by Intel, the two newly partnered outfits plan to stack up to 100 layers of chips atop one another resulting in a microchip "brick." Under the agreement, IBM will contribute its expertise on packaging the new processors, while 3M will get to work developing an adhesive that can not only be applied in batches, but'll also allow for heat transfer without crippling logic circuitry. If the companies' boasts are to be believed, these powerhouse computing towers would cram memory and networking into a "computer chip 1,000 times faster than today's fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices." That's a heady claim for a tech that doesn't yet exist, but is already taking swings at current faux 3D transistors. Official presser and video await you after the break.
More details emerge on AMDs Bulldozer for high-end desktops
AMDs Bulldozer is the company's anticipated high-power rival to Intel's Core i7 and the company just released a slew of new information about its internals. Now, pay attention 007 -- the "Zambezi for Socket AM3+" chips will include four modules, each with two cores and 2MB of L2 cache. Operating above these is a single Northbridge with 8MB of L3 cache to direct data between two 72-bit DDR3 channels and 4 x 16-bit receive / transmit HyperTransport links. Finally, the "Turbo Core" increases the whole chip's click speed when taxed or kills power to idle cores when it's not. Hustle on down to the source link to see the slides yourself. [Thanks, Bertrandsbox]
