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Samsung's started foundries rolling for its new embedded multi-chip package memory for budget smartphones -- after the success of the high-end modules that were released in October. eMCP jams together 30-nanometer low-power DDR2 DRAM and 20-nanometer NAND flash memory into a single slice of silico...

3 years ago 0 Comments
January 19, 2012 at 4:04PM