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iPhone 7 will get a larger camera, according to spy shot (updated)
Another week, another iPhone 7 leak. (Hey, it rhymes!) Following the set of components allegedly showing dual-SIM support, up to 256GB of storage and a 3.5mm headphone jack on the next iPhone, Chinese repair shop Rock Fix is back with a photo of what it claims to be the 4.7-inch iPhone 7's rear casing. Most notably, there are fewer plastic antenna bands here, and the main camera is said to feature a larger CMOS sensor -- here's hoping this will offer larger pixel sites to boost light sensitivity. What's interesting is that contrary to WSJ's report earlier this week, Rock Fix pointed out that the headphone jack is here to stay on one of the two 4.7-inch variants, which would explain why we're seeing conflicting rumors about the headphone jack.
WSJ: This year's iPhone won't feature big changes
If you're eagerly awaiting a load of new features for this year's iPhone, you might be a bit disappointed come fall. The Wall Street Journal reports that the upcoming models will offer only modest changes from the current iPhone 6S and 6S Plus rather than a more robust redesign. Apple has been trotting out new designs every two years with the "S" models offering mostly internal tweaks in between. According to WSJ's sources though, that won't be the case this year.
iPhone 7 may keep the headphone jack and support dual SIMs
One of the most intriguing rumors about the upcoming iPhone 7 is that it'll ditch the 3.5mm headphone jack, meaning users will have to get audio output via Lightning or Bluetooth. But according to a leakster, this may no longer be the case. Rock Fix, a smartphone repair shop based in China's Ganzhou, has recently been posting photos of alleged iPhone 7 components. One of these is apparently the 4.7-inch model's Lightning cable assembly which, contrary to what we've been hearing before, still has a headphone jack attached to it. And more recently, the shop shared photos of what it claims to be the next iPhone's dual-SIM trays, which will be a first for Apple if true.
Bloomberg: Intel will supply modem chips for the next iPhone
Bloomberg is reporting that Intel will replace Qualcomm as the supplier of modem hardware for some models in the next generation of iPhones. The news service believes that the move is down to Apple's desire to "diversify its supplier" base for the best-selling devices. Intel will provide the wireless hardware for the GSM version of the device, compatible with AT&T and T-Mobile in the US as well as most worldwide carriers. Qualcomm, meanwhile, will still provide the gear that goes into the Verizon/Sprint model, as well as for other mobile networks that use the CDMA protocol.
Apple is reportedly making premium wireless earbuds for the next iPhone
Rumors have swirled about Apple ditching the traditional 3.5mm headphone jack for much of the last year. Now, one of the most reliable Apple rumor reporters is saying that the iPhone 7 will indeed force owners to use either wireless headphones or a wired option through the device's Lightning port. Mark Gurman at 9to5Mac today posted a report claiming that the 3.5mm headphone jack was history and that Apple is also developing a premium pair of wireless headphones to go with the new phone.
Apple's next iPhone reportedly ditches the headphone jack
Apple's quest for ever-thinner, ever-smarter devices may produce another casualty: your iPhone's headphone jack. A rumor at MacOtakara claims that the next iPhone might drop the 3.5mm port and use the Lightning port for audio instead. The move would let Apple slim its phone even further (reportedly, over 1mm thinner than the iPhone 6s) and take advantage of Lightning's features, such as headphone-based DACs and app launching. You'd have to use an adapter for any conventional wired headphones, or else make the leap to Bluetooth.
Apple allegedly working with Samsung on chips again
Apple and Samsung have had a complicated relationship dating back to 2007 when Samsung became the exclusive producer of chips for Apple's iOS devices. Despite this business connection, the two companies have been attacking each other with a series of lawsuits claiming patent violations of functions on each company's phones. In April, we reported that Apple would be dropping Samsung's chips in favor of chips from TSMC, the Taiwan Semiconductor Manufacturing Co. Unfortunately rumors have surfaced indicating it doesn't appear that those plans are going to work out. Now the Korean Economic Daily is reporting that Apple's 2015 iOS device will still be using Samsung chips, specifically the 14-nanometer FinFET. These chips will power what is expected to be the iPhone 7. As of press time we don't know what this means for TSMC and Apple's relationship. It's possible the different chips will be used in different models of phones, with TSMC and Samsung both finding a home inside iOS devices. Still the idea of working with one company for 2014 only to move back to the old company you worked with in 2015 seems a little strange. We'll keep you updated if more information develops.
