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SK Hynix teases 4GB LPDDR3 RAM for high-end mobiles due end of this year
Samsung is already pressing ahead with its own high-density 20nm LPDDR3 modules, but SK Hynix reckons it can go one better. Instead of the stingy, piffling, retro 2GB stack offered by Sammy (pah!), the Korean memory specialist says it's sampling 20nm 8Gb (1GB) chips that can be stacked to provide 4GB of RAM in high-end mobile devices. This memory will come with all the trimmings and trappings of high-density LPDDR3, including a data transmission speed of 2,133Mbps (vs. 1,600Mbps offered by existing LPDDR3 phones like the GS4), a thinner profile and less power consumption in standby mode compared to LPDDR2. That just leaves the question of "when?," to which SK Hynix confusingly answers that we'll see products "noticeably loaded" with more than 2GB of LPDDR3 during the second half of this year, although it doesn't intend to start mass production of this exact chip until the end of the year. Of course, there'll come a point in 2014 when even mid-range processors like ARM's Cortex-A12 will theoretically be able to address more than 4GB, so that amount of RAM may not even seem so outlandish.
Four workers sentenced in Samsung, SK Hynix corporate theft affair
There's finally resolution to a case that dates back almost three years, in which chip subcontractor Applied Materials was accused of stealing semiconductor secrets from Samsung and supplying them to its arch chip rival SK Hynix. According to Korean media outlets YTN and Yonhap, one Samsung employee along with two SK Hynix workers and one of its subcontractors received suspended prison sentences of up to a year with two years of probation. Eighteen defendants from Samsung, SK Hynix and Applied Materials were originally charged, but no high-level management employees were reported to be involved. Applied Materials and Samsung arrived at a civil settlement late in 2010, so this seems to put a wrap on the entire sordid affair.
Apple TV (2012) gets torn down, confirmed to have 512MB of RAM, 8GB of storage
We already knew about most of the latest Apple TV's technical upgrades, but a few key specs have eluded us since its announcement. That's now changed, however, thanks to user aicjofs over at XBMC's forum, who ripped a fresh unit apart to find out exactly what's inside of its shell. Apart from its documented single-core A5 SoC, it's now confirmed that the 1080p-capable streamer features 512MB of Hynix-branded RAM (up from 256) along with an unchanged 8GB of storage, courtesy of Toshiba. Interestingly, there's no word on whether it's still packing Bluetooth 2.1 + EDR like the 2010 variant (Apple's website only lists 802.11a/b/g/n WiFi), but MacRumors notes that aicjofs has discovered what's possibly an additional WiFi antenna. A few parts are still under investigation, but you can check out the links below for more info.
iPad 3 logic board with 'A5X' chip purportedly snapped by Mr. Not-so-Blurrycam
Well, if it looks real, sounds real and is halfway logical, we probably should distrust it all the more. Yes, it's the time when all the rumors, photoshops and general hysteria around Apple's next slab reaches its apex. The photo above was grabbed by the steady hand of sas126, a blurrycam snapper in name only, and posted to Chinese site Weiphone, purporting to be the logic board for the iPad 3. The big news (if true) is the "A5X" silicon, suggesting we'll see an incremental enhancement rather than the wholesale revolutions evident in the A4 and A5 chips that accompanied its predecessors. The SoC (with the Apple logo, to the right of the two Hynix memory modules) carries a date-stamp of 1146, suggesting it was produced in the 46th week of last year. Of course, now that we're getting so close to the actual event, whatever Tim Cook whips out on stage will never match whatever we'd conjured up on our own hearts: so try to dampen down that rampant excitement because we've still got 17 days left to wait.
Intellectual Ventures begins tech patent offensive, files three lawsuits against nine companies
We've always wondered why former Microsoft CTO Nathan Mhyrvold was stockpiling patents at his new company Intellectual Ventures, and it looks like we're starting to find out why: in addition to licensing the entire portfolio to HTC and Samsung, IV's just filed its first three patent lawsuits against nine tech companies. Details are sparse, but the first suit is against Symantec, McAfeee, Trend Micro, and Check Point Software, the second names Elpida Memory and Hynix, and the third is against Altera, Lattice Semiconductor, and Microsemi. We'd assume the patents in question are all super-technical in nature, but it's really not the specifics we're interested in -- it's more the fact that IV is starting to flex some muscle in the tech world, and that means a lot of money could change hands real fast. We'll see what happens.
HP Labs teams up with Hynix to manufacture memristors, plans assault on flash memory in 2013
The memristor's come a long way since being hypothesized back in 1971. If you ask HP Labs, the history of this particular memory technology didn't hit its next milestone for almost four decades, when the company produced the very first memory resistor chip. Just last month, the Labs group proved its little transistor could handle logic and data storage, and as of today, the company's announcing a joint development agreement with Hynix Semiconductor, with a goal of bringing these chips to the market -- and rendering flash memory obsolete. That challenge against flash (not a very popular naming convention these days, it seems) was thrown down by HP Labs Senior Fellow Stan Williams, who posits that the memristor is "an universal memory that over a sufficient amount of time will replace flash, DRAM, magnetic hard disks, and possibly even SRAM." But onto the immediate, albeit aspirational goal (i.e. not a commitment, which he stressed on multiple occasions): Williams hopes to see the transistors in consumer products by this time 2013, for approximately the price of what flash memory will be selling for at the time but with "at least twice the bit capacity." He also claims a much smaller power requirement of "at least a factor of 10" and an even faster operation speed, in addition to previously-discussed advantages like read / write endurance. With Hynix on board, the goal is to make these "drop-in replacements" for flash memory, whereby the same protocols and even the same connectors will work just fine. For HP, however, Williams says there'll be an initial competitive advantage for the company due to its comfort level with memristors' unique properties, but that other companies will be encouraged to license the technology and experiment with new possibilities in hardware design. Williams wouldn't give any specific product examples where we might initially see the memristor, except to repeat that it'll be anywhere and everywhere flash memory is. Fighting words, indeed. We normally don't get excited about minute hardware components -- not often, at least -- but we gotta say, the seeds of the future look mighty interesting. Can't wait to see what germinates. Highlights from our talk with Williams after the break. %Gallery-100780%
Samsung, Hynix, Applied Materials in corporate espionage shocker!
In the cut-throat world of high tech manufacturing, "going rogue" is an ever-present temptation -- and no one, from AMD to LG, is immune from scandal. For the latest bit of corporate shenanigans, look no further than Applied Materials, who installs and maintains Samsung's chip manufacturing equipment -- prosecutors in South Korea have accused the company of stealing the latter's semiconductor technology and leaking it to Hynix Semiconductor (who ranks third in the world in the manufacture of NAND flash, behind Samsung and Toshiba). According to the AP, eighteen people have been indicted in the case so far, including the vice president of Applied Materials Korea. We just hope they didn't get the idea from us! That is definitely not the message we're trying to impart with this site.
Chip makers: Apple manipulating flash memory prices
The Korean Times is reporting today that Apple is (allegedly) manipulating the flash memory market. An unnamed source tells the Times that Apple is ordering more chips than it actually purchases: " ... [Apple] doesn't make immediate purchases, but waits until chip prices to fall to the level the company has internally targeted." The iPhone uses NAND flash memory, which both Samsung Electronics, the world's No. 1 flash memory maker, and Hynix Semiconductor, the industry's 3rd biggest, manufacture. Both companies sell their NAND chips to Apple. The iPhone's performance in Asia has been modest compared to the US and elsewhere. Hindrances like a lack of Wi-Fi and a strong black market have affected sales in China. Eager crowds welcomed this week's release in Korea, but in Japan sales have been quite slow. I'm no market expert, but I imagine Apple must predict how many units it needs and doesn't always hit the mark with 100% accuracy. We'll follow this story as it develops. [Via AppleInsider]
iPhone refresh could be straining Apple's flash memory suppliers
According to Ed Sutherland from Cult of Mac, three out of four Apple's NAND flash memory suppliers are feeling the strain as the company demands storage for its new line of iPhones. Sutherland cites a research report by analyst Vijay Rakesh from ThinkEquity. Rakesh says that Samsung has set aside its inventory of NAND chips for Apple until April. Hynix, another supplier, reported softer sales growth for its NAND chips, and Toshiba is having problems supplying customers with 56nm NAND chips. Apple's fourth supplier, Micron, wasn't mentioned in Rakesh's report. Aside from a new iPhone handset on the way, what does this mean? Higher memory prices, for one. Rakesh said that he expects NAND spot and contract prices to rise. Many analysts around the time of Apple's Q1 conference call said they had high hopes for a new iPhone during the first half of the year. Some rumors suggest June might be the target date for release.
Taiwan's proposed DRAM industry bailout puts the word "global" in economic downturn
It looks like a $6.5 billion dollar bailout of Taiwan's DRAM industry is in the works, a move that is proving as controversial on the island as the auto bailout is Stateside. The DRAM market has been in decline a while now, as evidenced by the recent closure of the Hynix plant in Eugene, where some 1,100 souls once worked doggedly to topple the likes of Intel and AMD. Now, we don't really know all the particulars of this admittedly complex situation, but we sure hope that lawmakers over there are able to work something out -- after the recent debut of Phantom of the Opera peformed by robots at Taiwan's University of Science and Technology, we're sure that people there could use something to lift their spirits.[Via TG Daily]
16GB Hynix DDR3 RAM modules demonstrated at IDF
Remember that MetaRAM technology we figured was nothing more than a sophisticated joke back in February? Intel, one of the noteworthy backers, has proven that said tech actually is one rung above snake-oil at its own Developers Conference in San Francisco. Hynix-made DDR3 DIMMs packing 16GB of memory were reportedly created via the MetaRAM method (and subsequently shown off), and just in case you're not wowed by such wizardry, the demo system included no fewer than ten of these modules. Just in case that sort of flew over your head, the machine they were in possessed 160GB of RAM. Unfortunately, we've a feeling these are quite aways out from hitting the consumer market.
Hynix set to close its Oregon plant, cutting 1,100 jobs
It may have once talked about toppling both Intel and AMD within a decade, but South Korea's Hynix looks to have been knocked back on its heels a bit amid a general downturn in the DRAM market, and it's now taken the rather drastic step of closing down its plan in Eugene, Oregon, eliminating some 1,100 jobs in the process. As EE Times points out, that move is at least partly due to the fact that 300mm plants are ramping up faster than expected, making 200mm plans like the one in Oregon far less cost effective to operate and, apparently, too expensive to upgrade. There's also the little matter of some tariffs the United States had imposed on Hynix, which it was able to avoid thanks to its plant in Oregon, but which now appear to be set to expire. For its part, Hynix denies that has anything to do with the plant closing, and it adds that it is still looking at ways to "have a presence" in Eugene.[Via The Wall Street Journal]
Hynix develops triple-level-cell NAND flash: 30 percent cheaper than MLC
The more cells you can pack onto a NAND chip, the cheaper the storage, so we're excited about Hynix's recent announcement of triple-level-cell NAND flash. You might have noticed that MLC-based SSDs are cheaper than SLC units, and TLC keeps the trend alive -- Hynix says the cost of TLC production is some 30 percent lower than current chips. On top of that, the 32GB chips themselves are 30 percent smaller than current NAND chips, meaning device manufacturers will be able to cram more storage into our PMPs and phones. We'll have to wait a little while though: production is going to ramp up in October, and Hynix hasn't committed to using the new chips in SSDs quite yet.
Hynix ships fastest one-gigabit LPDDR2 chip for mobile devices
Though not quite as impressive as the idea of toppling Intel and AMD within the next ten years, Hynix Semiconductor still has a decent reason to brag today. The South Korean chip producer has announced that it has just started mailing out the "fastest data transferring advanced dynamic random access memory (DRAM) chip for mobile devices." Said chip is the one-gigabit LPDDR2 (low-power double-data-rate 2), which was crafted using 66-nanometer technology and features an 800-megabits per second operating speed at 1.2-volts. No word on exactly what devices will see the super-speedy chip packed within, but a company spokesperson did note that it plans on ramping up production during Q4 to meet "growing demand for flat-panel television sets and high-end handheld devices."[Via Physorg]
MetaRAM aims to bump RAM capacity by 4x overnight
We're not sure what whacky voodoo snakeoil these MetaRAM people are peddling, but the company's got some high profile behind it (like Intel, for one), is being led by former AMD CTO Fred Weber, has appears to have some potentially revolutionary RAM quadrupling technology. Claiming to have leapfrogged current RAM technology by 2-4 years, MetaRAM uses a specialized "MetaSDRAM" chipset that effectively bonds and addresses four cheap 1Gb DRAM chips as one, tricking any machine's memory controller into using it as a 4x capacity DIMM. Since a 1Gb chip is apparently far less expensive than a 2Gb chip, MetaRAM devices can multiply capacity at prices far lower than their competition; the company claims it'll be shipping in machines in the first quarter of this year, and Hynix has already announced their own 2-rank 8GB DDR2 RDIMMs for the second half.
Hynix boldly plans to topple Intel, AMD within a decade
In a fairly tame show of initiative, Hynix, a South Korean company you've probably never heard of, has announced its plan to become the world's leading chip producer over the next ten years. The company, currently the world's fifth largest memory chipmaker, claims it will boost sales from last year's $7.7 billion to $18 billion in 2010 (the year we make contact), and to $25 billion by 2012 (when the Mayan calendar ends and we're all supposed to eat it). Hynix plans to gain ground by eagerly developing new technologies, and with the introduction of a new type of memory chip called Phase-change Random Access Memory (PRAM, but not of Apple fame). Analysts say PRAM will become the industry's main memory source, replacing flash storage over the next decade. Meanwhile, architects in Korea are working feverishly to design a room in the new Hynix headquarters large enough for president Jong-Kap Kim's head.
$300,000 worth of Hynix DDR RAM modules hijacked
It seems the traditional method of acquiring goods -- you know, that "money for product" approach we've been testing out for centuries -- is going to the wayside quite often these days, as yet another major heist has gone down in Taiwan. Twenty boxes of Hynix Semiconductor DDR RAM modules were stolen yesterday, as a trio of assailants reportedly used a machete and stun gun to threaten the driver. The hijacking is likely a planned, organized move, as reports say that the thieves were seen headed to the airport, where they probably hopped a flight to China. Interestingly, it was stated that "ownership of the chips is still unknown," a fact that's sure to make insurance companies drool, considering the $306,000 of missing goods that somebody is going to be out for. Incidents like this do wonders in making those $169 GPS / RFID adornments seem fairly inexpensive, eh?[Via Inquirer]
