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Samsung's started foundries rolling for its new embedded multi-chip package memory for budget smartphones -- after the success of the high-end modules that were released in October. eMCP jams together 30-nanometer low-power DDR2 DRAM and 20-nanometer NAND flash memory into a single slice of silico

2 years ago 0 Comments
January 19, 2012 at 4:04PM
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Leave it to Toshiba to make even the latest smartphones feel somewhat undernourished. Quadrupling the current high-end standard of 32GB of embedded memory, the Japanese company has announced an all-new 128GB slab of storage, built on a 32nm production process. It's somehow managed to fit sixteen 8G

4 years ago 0 Comments