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Intel, Micron unveil first 128-gigabit flash chip, provide double the data density
Realign the data and the previous 32- and 64-gigabit roadblocks to flash storage disappear. Today, Intel and Micron announced the first 128-gigabit NAND flash chip. The chip, which was created through the companies' joint IM Flash Technologies venture, is smaller than a fingertip, created through a 20 nanometer manufacturing process and is capable of 333 megatransfers per second with the option of stacking as many as eight chips on top of each other. What makes the new NAND unique is its planar structure that allows individual memory cells to scale much smaller than before. When combined with a Hi-K/metal gate combo to keep the power leaks to a minimum, presto, you've got flash memory denser than your mother-in-law's fruitcake. Mass production of the 128Gb chips isn't due until the first half of 2012, but you can get a more in-depth intro to the future of flash right now in the PR below.
ARM and TSMC team up for tinier 20nm Cortex SOCs
It's no secret that ARM ideas are powering much of the mobile revolution these days, but the company doesn't print its own systems-on-a-chip, that duty gets outsourced to silicon foundries -- like TSMC, who just got all buddy-buddy with the firm to transition future smartphone chips to the 28nm and obscenely tiny 20nm high-k metal gate processes. (We're not sure what this means for GlobalFoundries, who had a similar deal earlier this year.) As per usual with a die size reduction, ARM chips will see higher speed and have decreased power consumption, but since 20nm is (relatively) unexplored territory it could be years before chips hit the market. PR after the break, or hit the more coverage link for further explanation by an ARM VP of Marketing.
