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Manufacturers have been murmuring about 3D memory chips for years, but an escalation in recent radio chatter suggests the technology is on the cusp of becoming commercial. Intel unveiled a Hybrid Memory Cube (HMC) at IDF, which promises seven times the energy efficiency of today's DDR3, and now I

3 years ago 0 Comments
December 6, 2011 at 8:57AM
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Next-generation cooling technology isn't the only thing IBM's R&D crew is spending time with, as the chip giant has recently made plans to hit up \"vertical stacking technology\" in order to make the next wave of supercomputers really crank. Supposedly, \"laying chips vertically -- as opposed to si

7 years ago 0 Comments