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Your Android phone's volume key can unlock your Google account
Google just made two-step verification a little easier for Android users. Android phones running 7.0+ Nougat or newer can be used as a physical security key to confirm a user's identity when logging into a Google account with the Chrome browser. When prompted, users will simply hold the volume button on their phone to verify their log-in attempt. This isn't the only option for two-step verification, but it will likely be faster and more convenient than, say, using a physical key fob.
The big memory cube gamble: IBM and Micron stack their chips
Manufacturers have been murmuring about 3D memory chips for years, but an escalation in recent radio chatter suggests the technology is on the cusp of becoming commercial. Intel unveiled a Hybrid Memory Cube (HMC) at IDF, which promises seven times the energy efficiency of today's DDR3, and now IBM and Micron have shown their hand too. The pair just struck up a partnership to produce cubes using layers of DRAM connected by vertical conduits known as through-silicon vias (TSVs). These pillars allow a 90 percent reduction in a memory chip's physical footprint, a 70 percent cut in its appetite for energy, and -- best of all -- a radical increase in bandwidth: HMC prototypes have already scored 128Gb/s 128GB/s, which makes 6Gb/s SATA III look like a bottleneck. It certainly sounds like a game-changer, unless of course some rival technology like ferroelectric memory gets there first. Update: Doh, sorry for the wrong caps, which were shrunken by a factor of eight. For comparison, current high-level DRAM delivers around 12.8GB/s. [Thanks, Maximilian]
IBM pushing vertical stacking in next wave of supercomputers
Next-generation cooling technology isn't the only thing IBM's R&D crew is spending time with, as the chip giant has recently made plans to hit up "vertical stacking technology" in order to make the next wave of supercomputers really crank. Supposedly, "laying chips vertically -- as opposed to side by side -- reduces the distance data has to travel by 1,000 times, making the chips faster and more efficient." The new format will place chips directly atop one another and connect them with "tungsten filled pipes etched through the silicon," which will subsequently eliminate the need for wires and increase the speed at which data can flow. The questionably-dubbed "3D chips" will reportedly operate around 40-percent more efficiently than existing renditions, and considering that Intel is purportedly cooking up a similar agenda in their own labs, that "end of 2007" release date is quite likely to be accurate.
