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It's been a year since Huawei's Richard Yu's teased his company's octa-core HiSilicon system-on-chip, and according to the exec's recent Sina Weibo post (screenshot after the break), said product is finally ready. In fact, Yu revealed that his company's launched two new 28nm HPM chips. The octa-co...

January 16th 2014 at 12:37am 0 Comments
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Huawei's upcoming Ascend P6 must be as slim as we've heard, because it just keeps slipping out -- this time, in an official rendering obtained by @evleaks. The imagery appears to validate what we've previously seen in photos, including the wafer-like 6.2mm thick body, a metal chassis and an iterat...

May 23rd 2013 at 3:33pm 0 Comments
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Last year, Huawei's Device Business Group set an ambitious goal of shipping 60 million smartphones, but managed only 32 million, keeping it out of IDC's top five smartphone vendors in 2012. That said, for Q4 that same year Huawei did finally break into top three, but it didn't change the fact that...

April 23rd 2013 at 10:48pm 0 Comments
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Some companies have mascots, but Huawei has Richard Yu. Shortly after the Ascend P2 launch yesterday, we had a chance to catch up with a rather relaxed Chairman of Huawei Device to see what he's been up to, as well as picking his brain on the design decisions of the P2, what Huawei's going to do a...

February 25th 2013 at 6:30am 0 Comments
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Earlier today our brethren over at Engadget Chinese got to hang out with Huawei Device chairman Richard Yu, who was kind enough to inform us that his company will release a HiSilicon K3V3 chipset -- the follow-up to the current quad-core K3V2 -- in the second half of this year. What's more, much l...

January 8th 2013 at 10:30pm 0 Comments