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Samsung's new chip could put 4GB of memory in your next smartphone
Think the 3GB of RAM in the Galaxy Note 3 was a lot? Samsung was only getting started. The company has just unveiled the first 8-gigabit (1GB) low-power DDR4 memory chip, which could lead to 4GB of RAM in a multi-layered, mobile-sized package. Moving to the higher-bandwidth (3.1Gbps) DDR standard should also provide a hefty 50 percent speed boost over existing DDR3-based chips, even though the new silicon uses 40 percent less power than its ancestors. Samsung is only promising mass production of the new RAM sometime in 2014, but it's already clear about the target audience. The technology will go into laptops, smartphones and tablets with Ultra HD displays, where additional memory will be crucial for powering all those extra pixels.
Samsung starts making 3GB low-power memory for smartphones
We hope you weren't just getting used to having 2GB of RAM in a smartphone, because Samsung is already moving on. The company is now mass-producing 3GB LPDDR3 packages whose 0.8mm (0.03in) thickness can accommodate most device sizes. The capacious, 20nm-class memory should also be quick when there's a pair of symmetric channels to keep data flowing. The first smartphones with 3GB of RAM should ship in the second half of the year; Samsung isn't revealing which phones will have the honor, but it's not hard to make some educated guesses.
SK Hynix teases 4GB LPDDR3 RAM for high-end mobiles due end of this year
Samsung is already pressing ahead with its own high-density 20nm LPDDR3 modules, but SK Hynix reckons it can go one better. Instead of the stingy, piffling, retro 2GB stack offered by Sammy (pah!), the Korean memory specialist says it's sampling 20nm 8Gb (1GB) chips that can be stacked to provide 4GB of RAM in high-end mobile devices. This memory will come with all the trimmings and trappings of high-density LPDDR3, including a data transmission speed of 2,133Mbps (vs. 1,600Mbps offered by existing LPDDR3 phones like the GS4), a thinner profile and less power consumption in standby mode compared to LPDDR2. That just leaves the question of "when?," to which SK Hynix confusingly answers that we'll see products "noticeably loaded" with more than 2GB of LPDDR3 during the second half of this year, although it doesn't intend to start mass production of this exact chip until the end of the year. Of course, there'll come a point in 2014 when even mid-range processors like ARM's Cortex-A12 will theoretically be able to address more than 4GB, so that amount of RAM may not even seem so outlandish.
Samsung starts production of 20nm 4Gb LPDDR3 mobile DRAM
What is it that you want to know about the RAM in your mobile device? Usually, how much of it there is, and if you're a little more demanding of your hardware, maybe what type it is, too. Well, folk in the latter category might be interested to know that Samsung has started production of 20nm 4Gb LPDDR3 mobile DRAM. As is the nature of smaller, more efficient components, the new chips promise to be faster (2,133 Mbps per pin, over LPDDR2's 800 Mbps), and -- so claims Samsung -- a 20 percent drop in power consumption. With just four of these new chips, OEMs can have a 2GB offering that's still just a slick 0.8mm in height.
Intel ships SSD 335 as its first drive with 20nm flash, asks just a little to stay cutting-edge
Don't panic, SSD 330 owners: your drive hasn't been immediately rendered obsolete. Intel's new SSD 335 is just the first shipping drive using the company's 20-nanometer flash memory. The shrink down from 25nm is primarily a technological showcase that proves the more scalable, hi-K/metal gate borrowed from processors can fly in NAND-based storage. Buyers will still get the same 500MB/s read speeds and 450MB/s writes in a 2.5-inch, SATA 6Gbps drive that will stuff neatly into many desktops and laptops. Intel is shy about pricing for the lone 240GB variant on offer, although a quick scan finds it selling for a slight premium over its ancestor, at $210. While that's still frugal in this day and age, we're guessing that Intel's vow to "pass along the savings" with the SSD 335 won't truly be realized without a reseller price drop or two.
ARM and Globalfoundries hammer out deal to promote 20nm mobile chips
Sure it's British, but ARM's mobile empire is being built through careful alliances rather than conquest. The chip designer's latest deal with Globalfoundries, which mirrors a very similar agreement signed with rival foundry TSMC last month, is a case in point. It's designed to promote the adoption of fast, energy-efficient 20nm processors by making it easy for chip makers (like Samsung, perhaps) to knock on Globalfoundries' door for the grunt work of actually fabricating the silicon -- since the foundry will now be prepped to produce precisely that type of chip. As far as the regular gadget buyer is concerned, all this politicking amounts to one thing: further reassurance that mobile processor shrinkage isn't going to peter out after the new 32nm Exynos chips or the 28nm Snapdragon S4 -- it's going to push on past the 22nm benchmark that Ivy Bridge already established in the desktop sphere and hopefully deliver phones and tablets that do more with less juice.
Samsung starts mass-producing 4x faster mobile flash memory, kickstarts our phones and tablets
Samsung isn't content to leave fast NAND flash memory to traditional solid-state drives. Its Pro Class 1500 promises a big jolt to the performance of frequently pokey smartphone and tablet storage. By how much? That name is a clue -- it reaches 1,500 IOPS (inputs/outputs per second) when writing data, which along with 3,500 IOPS data reads is about four times faster than any previous embedded flash chip Samsung has tested. In the real world, that leads to as much as 140MB/s when reading data and 50MB/s for writes. The speed comes after Samsung has thrown virtually every trick in the book at its new chips, including a dense 20-nanometer manufacturing process, quick toggle DDR 2.0 memory with its own controller and a new JEDEC memory standard with 200MB/s of bandwidth to spare. Samsung hasn't named customers for the 16GB, 32GB and 64GB parts that are rolling out of the factories, although we'd do well to remember that a flourishing phone business doesn't guarantee that the only major customer is Samsung itself: even in the face of legal challenges, Samsung still has at least one noteworthy client that tends to snap up much of its flash supply.
Samsung ready to invest in next-gen chip production: here comes 20nm and even 14nm
As things stand, the super-small and super-efficient 22 nanometer transistors in Intels' Ivy Bridge are about as cutting edge as mainstream chip production gets, which is why this promise from Samsung is rather impressive. As reported by Reuters, the Korean manufacturer is preparing to invest $1.9 billion in a new logic chip line that will make chips for smartphones and processors. These chips will use 20nm and 14nm fabrication processes, making them potentially faster and more efficient than Ivy Bridge -- and leaving the silicon currently found in Sammy's 32nm Exynos Quad and Qualcomm's 28nm Snapdragon S4 far behind. Of course, Intel is gearing up for 14nm production next year too, and even setting its sights on 5nm after 2015, so the coming battle for Moore's Law should be just as lively as it is today. [Silicon wafer photo via Shutterstock]
Samsung mass-produces 4-gigabit LPDDR2 memory, aims to make 2GB a common sight in smartphones
Samsung started making 2GB low-power mobile memory last year, but as the 1GB-equipped phone you likely have in your hand shows, the chips weren't built on a wide-enough scale to get much use. The Korean company is hoping to fix that now that it's mass-producing 20-nanometer, 4-gigabit LPDDR2 RAM. Going to a smaller process than the 30-nanometer chips of old will not just slim the memory down by a fifth, helping your smartphone stay skinny: it should help 2GB of RAM become the "mainstream product" by the end of 2013, if Samsung gets its way. New chips should run at 1,066Mbps without chewing up any more power than the earlier parts, too, so there's no penalty for using the denser parts. It's hard to say whether or not the 20nm design is what's leading to the 2GB of RAM in the Japanese Galaxy S III; we just know that the upgraded NTT DoCoMo phone is now just the start of a rapidly approaching trend for smartphones and tablets.
Globalfoundries buys out AMD stake to become fully independent chip maker
Globalfoundries has celebrated its third anniversary by announcing that it's agreed terms with AMD to buy out its remaining stake in the company to go it alone. Whilst Sunnyvale will remain a key customer to the chip foundry, the nuts and bolts of ownership will be wholly in the hands of ATIC. The company now provides a big chunk of AMD's 32nm wafers and is now kicking off a $3 billion spending plan to kit out its facilities in Singapore, Germany and New York. It looks like the single life will allow it to spend equal time and effort refining those 20nm ARM chips promised for 2013 as well as its new partnership with IBM.
Intel, Micron unveil first 128-gigabit flash chip, provide double the data density
Realign the data and the previous 32- and 64-gigabit roadblocks to flash storage disappear. Today, Intel and Micron announced the first 128-gigabit NAND flash chip. The chip, which was created through the companies' joint IM Flash Technologies venture, is smaller than a fingertip, created through a 20 nanometer manufacturing process and is capable of 333 megatransfers per second with the option of stacking as many as eight chips on top of each other. What makes the new NAND unique is its planar structure that allows individual memory cells to scale much smaller than before. When combined with a Hi-K/metal gate combo to keep the power leaks to a minimum, presto, you've got flash memory denser than your mother-in-law's fruitcake. Mass production of the 128Gb chips isn't due until the first half of 2012, but you can get a more in-depth intro to the future of flash right now in the PR below.
Samsung opens 'most advanced' 20nm-class flash memory production line
Samsung's "20nm-class" designations for flash memory production are frustratingly nonspecific, but smallest processes or not it's ready to crank out more chips than ever. Reuters reports the electronics giant just flipped the switch on its first new production line in five years, one that it's calling "the industry's largest and most advanced memory fabrication facility." It could take up to nine months to get fully up to speed, but the increased production and reduced costs should keep the competition coming Samsung's way for storage no matter what their current legal situation.
Intel and Micron announce new 20nm NAND Flash manufacturing process
You didn't think Intel and Micron would just rest on their laurels after starting 25nm flash production last year, did you? The two are now back with an even more impressive 20nm process, and an 8GB MLC NAND device that measures just 118mm² and allows for a 30 to 40 percent reduction in board space. Of course, those 8GB chips can also be combined for far more storage, so you can count on seeing even higher capacity phones, tablets and SSDs sometime after production kicks off in the in second half of 2011. At that point, Intel and Micron also plan to show off a 16GB device that promises to allow for 128GB of storage in a solid-state storage solution smaller than a postage stamp. Full press release is after the break.
IBM forms new partnership with ARM in hopes of developing ludicrously small chip processing technology
We've seen IBM and ARM team up before, but this week both companies announced a new joint initiative to develop 14nm chip processing technology. That's significantly smaller than the 20nm SoC technology ARM hopes to create in partnership with TSMC, and makes the company's previous work with IBM on 32nm semiconductors look like a cake walk. The potential benefits, though, are faster processors that require less power, and feature lower per unit manufacturing costs Who knows if or when we'll see tangible results from the tag team, but if IBM's Watson can beat Jeopardy champions, further reducing the average size of a feature that can be created on a chip should be elementary, right? To read over the full announcement check out the press release after the break.
Globalfoundries takes ARM Cortex-A9 into 28nm land, looks forward to 20nm chips in 2013
Forget the numbers, here's what matters: Globalfoundries' new production capabilities will lead to "smooth production ramp-ups and faster time-to-market" for its customers. Now consider that this promise relates to scrumptious 28nm Cortex-A9 SOCs and feel free to rejoice. The chip fabricator has just declared itself ready to take orders for ARM's systems-on-chip built using its high-k metal gate 28nm fab process. This fulfills its pledge for mass production in the latter half of 2010, but lest you think Globalfoundries is resting on any nanoscale laurels, it also has a 20nm roadmap to tell you about. It's very simple, really: expect even smaller, even more power-efficient silicon in 2013. We don't know if the future will be bright, but it sure looks like it's gonna be small.
ARM and TSMC team up for tinier 20nm Cortex SOCs
It's no secret that ARM ideas are powering much of the mobile revolution these days, but the company doesn't print its own systems-on-a-chip, that duty gets outsourced to silicon foundries -- like TSMC, who just got all buddy-buddy with the firm to transition future smartphone chips to the 28nm and obscenely tiny 20nm high-k metal gate processes. (We're not sure what this means for GlobalFoundries, who had a similar deal earlier this year.) As per usual with a die size reduction, ARM chips will see higher speed and have decreased power consumption, but since 20nm is (relatively) unexplored territory it could be years before chips hit the market. PR after the break, or hit the more coverage link for further explanation by an ARM VP of Marketing.
Samsung first with 20-nm NAND Flash: cheaper, faster SD cards on the way (update)
Let it sink in, 20 nanometers. It wasn't that long ago when 45-nm manufacturing processes were all the rage. Now we've got Samsung following Toshiba with a sub-25nm flash memory announcement all its own. Samsung's 20-nm class 32Gb (gigabit) MLC NAND is sampling now, however, for use in embedded memory solutions and SD memory cards ranging from 4GB to 64GB. In addition to increasing densities and decreasing manufacturing costs, Samsung's 20-nm class NAND is claimed to be more reliable and 30 percent faster than the 30-nm MLC chips forming the core of its existing 8GB and higher SD cards. That translates to cheaper class 10 (20MBps read, 10MBps write) SD cards when these ship to consumers later this year -- always a good thing. Update: There's a chance that Samsung is playing fast and loose with words here. It repeatedly says "20-nm class" without specifying the actual node size. Is it 20nm, 22nm, 27nm? We're digging for details and will update this post when we have them. Update 2: Samsung's response: "Unfortunately, we are not disclosing the actual process node for our memory devices. Thank you in advance for your understanding." Yeah, we understand: Samsung's process node is likely larger than the 25nm threshold set by Intel and Micron.
