Intel's 32nm Clarkdale CPUs moved up to Q4, a full year ahead of AMD?

Read -- DigiTimes
Read -- DailyTECH
32-nm posts

Sure, Intel's one-upping AMD in the 32nm department, but IBM and its merry band of Technology Alliance members -- including Samsung, STMicroelectronics, and AMD chipmakers Globalfoundries -- are looking to ramp up the competition and develop even smaller, low power 28nm processors before Intel gets a chance to size down. The group additionally promises migration plans for companies who've got 32nm on their roadmap and want to maybe shrink a few of the later, already planned models. Early risk production for the 28nm chips are planned for second half 2010, which means it's very unlikely we'll be seeing them in consumer gadgets until at least 2011.
In 2005 Intel revealed its 65-nm manufacturing process, then 45-nm in 2007. Today, in keeping with its "tick-tock" strategy, Intel is announcing a further shrinkage to its manufacturing process as it ends the development phase for 32-nm chip circuitry. That puts the chips on a production schedule for Q4 2009 -- interesting as Intel's rumored 32-nm Medfield chip wasn't expected until the first half of 2010. According to Intel, the new chips incorporate second-generation high-k + metal gate technology with transistors that switch 22% faster than its current 45-nm Penryn chips. Why should you care? Well, the smaller chips are cheaper to manufacture which should translate to consumer savings. They also require less power than Intel's notoriously power-friendly Atom-class chips. As an interesting side note, the Wall Street Journal is reporting that Intel has also disclosed a variant of its 45-nm process (the Lincroft-based Pineview we presume) "that is tailored to create chips for portable computing devices that require low power consumption." Uh, those wouldn't be targeting ARM by any chance would they Intel? Wink wink, nudge nudge.
We've seen some big names working on 32nm chips, and now we can add two more to the mix. According to Nikkei, Panasonic and Renesas have recently developed technology necessary to mass produce the little guys, using metal oxide film (instead of a silicon material) for the insulating layer and titanium nitride for the conducting layer. This has allowed the chips to consume less power, so the 32nm chips operate comparably to their 45nm siblings. Look for a street date sometime in 2011 -- but considering that Toshiba, IBM and others have set a target date of 2010 for their 32nm chips, and Samsung and Intel are aiming at 2009, Panny might be showing up to this party a little late.
As of this morning you can add Hitachi to the list of cohorts IBM has gathered in its quest for sub-32nm circuitry. Hitachi's 2-year semiconductor research agreement -- a first between IBM and Hitachi -- puts them under a loose-knit alliance with AMD, Chartered, Freescale, Infineon, Samsung, Sony, Toshiba and STMicroelectronics. The notable, non-member here is of course, Intel; that little company making "45-nm processes" and "Hi-K metal gate" house-hold terms amongst geeky, type-A adopters of consumer electronics. Yes, we're looking at you.
Toshiba just announced its membership in an alliance to develop system chips using 32-nm circuitry. That's well below the existing 45-nm processes used in manufacturing Intel's Penryn, for example. The alliance includes IBM, AMD, Samsung (already pushing 30-nm NAND), Infineon, Freescale, and Singapore's Chartered Semiconductor Manufacturing. No surprise really, what with Tosh already in bed with IBM to develop chips using 32-nm processes. The agreement is good until 2010 and covers design, development, and the production of the itty bitty circuitry. A move which should reduce manufacturing costs for the alliance with the savings passed along to us consumers.





